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    • 2. 发明专利
    • SUBSTRATE POSITIONING DEVICE
    • JPH10100036A
    • 1998-04-21
    • JP25694996
    • 1996-09-27
    • HITACHI LTDHITACHI DEVICE ENG
    • TOUJIYOU KENJIROUOTAKA TAKASHINEKATA TAKEYASUNISHIMURA YUICHI
    • G02F1/13B23Q3/18G02F1/1333
    • PROBLEM TO BE SOLVED: To position a glass substrate and the other substrates at a predetermined position of a finishing machine with high accuracy. SOLUTION: In a substrate positioning device for positioning a substrate 4 at the predetermined position of the working table 7 of a finishing machine in a manufacturing process for manufacturing a predetermined product by performing various kinds of film forming treatments and patternings on the substrate 4 in a series of working processes by a plurality of finishing machines, the working table 7 has a plurality of vertical supporting rods 6 for supporting the bottom surface of the substrate 4 and a plurality of positioning pins 9 which abut on and move to and from the periphery of the substrate 4 placed on the supporting rods 6 in parallel to the working table 7 to position the substrate 4 at a predetermined position. The supporting rod 6 has a conduit 10 for guiding fluid supplied from a fluid supply source 12 and jetting the fluid from an opening made in the tip thereof contacting the substrate 4 and the substrate 4 is positioned by the positioning pins 9 in a state where the substrate 4 is slightly floated by the pressure of the fluid jetted from the opening of the conduit 10.
    • 3. 发明专利
    • EXPOSURE DEVICE
    • JPH0961798A
    • 1997-03-07
    • JP21838195
    • 1995-08-28
    • HITACHI LTD
    • NISHIMURA YUICHITSUBOI YUZO
    • G02F1/13G02F1/1333G03F7/20H01L21/027
    • PROBLEM TO BE SOLVED: To make it possible to execute exposure by entirely obviating the breakage of a glass substrate by forming the placing surface of a stage to the same size and shape as the size and shape of the glass substrate to be placed thereon and forming tapers on the peripheries of the placing surface. SOLUTION: The stage 3 in the lower part of a photomask 1 has the placing surface formed to the same size and shape as the size and shape of the glass substrate 4 to be placed thereon. The tapers 3A are formed on the peripheries of the placing surface. Even if, for example, the foreign matter of photoresist, etc., exist on the surface coated with the photoresist film on the glass substrate 4, the force from the photomask 1 generated according to ascending of the stage 3 is merely applied on the glass substrate 4 in the part on the stage 3. Then, the easy breakage of the glass substrate 4 like heretofore does not arise. The tapers 3A are formed so as to prevent the contact of the photoresist film 5 sticking to the rear surface of the glass substrate 4 with the placing surface of the stage 3 when the photoresist film 5 infiltrates to the peripheries of the glass substrate 4 and stick to its rear surface.
    • 6. 发明专利
    • WASHER
    • JPH11253893A
    • 1999-09-21
    • JP5671898
    • 1998-03-09
    • HITACHI LTD
    • NISHIMURA YUICHISHINOHARA MASAAKITSUBOI YUZOUCHIDA MORIONAKANO YASUSHIKANEKO TOSHITERU
    • B08B3/02G02F1/13H01L21/304
    • PROBLEM TO BE SOLVED: To prevent chemicals from being deposited on a nozzle to cause foreign matter and also to simplify constitution irrespectively of the number of kinds of chemicals to be used. SOLUTION: This washer for washing an insulating substrate 10 by using chemicals and water in this order during the process in which a photosensitive photoresist film is formed on the surface of the substrate 10 to form a desired pattern by photolithography is equipped with a turntable 9 on which the substrate 10 is mounted to rotate it, one nozzle 7 arranged above the substrate 10, and at least two systems of liquid supply paths consisting of a chemical check valve 5 and a water check valve 6 connected in common to the nozzle 7 on the outlet side thereof and a chemical supply valve 3 and a pure water supply valve 4 connected to the check valves 5, 6 on the inlet sides thereof respectively. In this way, to the substrate 10 mounted on the turntable 9, the chemicals and the water are fed with a time-lag by alternately opening/closing the chemical supply valve 3 and the pure water supply valve 4.
    • 8. 发明专利
    • Actual work result input support system
    • 实际工作结果输入支持系统
    • JP2009288828A
    • 2009-12-10
    • JP2008137392
    • 2008-05-27
    • Hitachi Ltd株式会社日立製作所
    • NISHIMURA YUICHI
    • G06Q10/00G06Q10/06G06Q50/00
    • PROBLEM TO BE SOLVED: To provide a system and method for registering the actual work results of an employee accurately in more detail, and for making a labor charge for each charging destination calculated by summing them up, become closer to an actual situation. SOLUTION: Based on the record of the actual residence location of the employee stored in a room entry/exit management server, the actual charging destination is determined in a schedule management server by collating with a cost code registered in advance. Accordingly, it is possible to make the labor charge on the basis of each cost code closer to the actual situation. Also, based on the record of the software/document use state of the employee concerned, stored in a terminal operation history management server, the actual charging destination is also determined in a project management server by a method of collating with software/document information being linked with the cost code and registered in advance. Accordingly, even in regard to a time zone unable to calculate by the method described above, it is possible to make the actual work result close to the actual situation. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种更详细地准确地登记员工的实际工作结果的系统和方法,并且通过对每个计费目的地进行求和计算的每个计费目的地的劳动费用变得更接近实际情况 。 解决方案:根据存储在房间入/出管理服务器中的员工的实际居住地点的记录,通过与预先登记的成本代码进行核对,在日程管理服务器中确定实际收费目的地。 因此,可以根据每个成本代码更接近实际情况来进行劳务费用。 此外,根据存储在终端操作历史管理服务器中的有关员工的软件/文档使用状态的记录,还通过与软件/文档信息进行对照的方法在项目管理服务器中确定实际计费目的地 与成本代码相关联并提前注册。 因此,即使对于不能通过上述方法计算的时区,也可以使实际工作结果接近实际情况。 版权所有(C)2010,JPO&INPIT
    • 10. 发明专利
    • SUBSTRATE WASHING METHOD AND SUBSTRATE WASHING DEVICE
    • JPH11221532A
    • 1999-08-17
    • JP2410398
    • 1998-02-05
    • HITACHI LTD
    • NAKANO YASUSHIKANEKO TOSHITERUNISHIMURA YUICHIUCHIDA MORIO
    • B08B3/08C11D7/04H01L21/304
    • PROBLEM TO BE SOLVED: To drastically decrease the amt. of the static electricity to be generated and to prevent the occurrence of a defect occurring in static electricity, as metallic wiring dissolution, by using the washing water prepd. by dissolving a salt not contg. metal elements or gaseous carbon dioxide at a high concn. into ultrapure water to lower the resistivity thereof. SOLUTION: This washing device senses the flow rate of the ultrapure water flowing into a washing water pipe 110a by a flow meter 111. Ammonium carbonate water which is the salt not contg. the metal elements in a tank 113 is intermittently injected by an injection pump 114 in accordance with the flow rate into a washing water pipe 110a. At this time, if the flow rate of the ultrapure water sensed by the flow meter 111 is large, the intermittent intervals are made shorter by the control of a controller 115 and if the flow rate is small, the intermittent intervals are made longer to a maintain the concn. of the ammonium carbonate which is the washing water constant. The setting of the concn. is executed by inputting desired electroconductivity into the controller 115. The information from an electroconductivity meter 112 is fed back to the injection pump 114 to maintain the desired electroconductivity of the washing water. For example, a static mixer 117 is disposed between the injection pump 114 and the electroconductivity meter 112 to well mix the ultrapure water and the ammonium carbonate water.