会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明专利
    • VACUUM SUCTION BASE
    • JPH03163848A
    • 1991-07-15
    • JP30217689
    • 1989-11-22
    • HITACHI LTD
    • KATSUYAMA MASAMISAKAIZAWA HIDEYUKI
    • H01L21/683G03F7/20H01L21/027H01L21/30
    • PURPOSE:To enhance the flatness of wafers by a method wherein a sheet specimen is arranged to come into contact with the ends of multiple projections arrayed in the pitch not exceeding 2mm forming the same surfaces as well as the upper end of an outer peripheral part including the projections so as to make the projections approach to the outer peripheral part. CONSTITUTION:A wafer suction surface comprising an outer peripheral part 2 and a pin part vacuum-sucks at the rear surface of a wafer 1 to be fixed on a wafer suction base 6 by vacuumizing vacuum holes 4 and a bottom part 5. Taking into consideration of the deformation in the wafer when it is vacuum- sucked at, the pitch of projections 3 and the outer peripheral part 2 is specified not to exceed 1mm likewise the pitch between the projections 3 not to exceed 2mm. Furthermore, in oder to improve the effect of avoiding the adhesion of foreign matters, the space of the projections 3 must be narrowed but in order to avoid the damage due to the flattening work load, both the width of outer peripheral part and the diameter of the projections 3 are specified not to exceed 0.5mm. Through these procedures, the deterioration in the flatness due to the existence of the dust, etc., can be avoided.
    • 8. 发明专利
    • ELECTRON BEAM LITHOGRAPHY EQUIPMENT
    • JPH0945605A
    • 1997-02-14
    • JP19351095
    • 1995-07-28
    • HITACHI LTD
    • KOBAYASHI TOSHITAKATSUNODA MASAHIROKATSUYAMA MASAMI
    • H01J37/305H01L21/027
    • PROBLEM TO BE SOLVED: To realize an electron beam lithography equipment which wherein an can grasp an accurate upper surface shape of a sample arranged in a sample stand and improve pattern generation accuracy and pattern generation efficiency. SOLUTION: A height direction deformation amount calculation part 40 calculates an upper surface coordinate of a sample for each sample material, etc. A taper element calculation part 41 calculates a taper element of a sample 1, and the outputs of the deformation amount calculation part 40 and a calculated taper element of the element calculation part 41 are added by an adder 42 and supplied to a matrix preparation part 34. A matrix showing an upper surface shape of a sample is prepared by the reparation part 34 and stored in a sample deformation amount data storage part 29 through a computer 20. The computer 20 supplies stored data of the storage part 29 to a focal correction value calculation part 43, and a calculated focal point correction value of the calculation part 43 and a detected sample upper surface height of a height detection system 21 are added by an adder 44. An aimed focal point value calculated by an aimed focal point value calculation part 36 and an output value of the adder 44 are subtracted by a subtracter 45, focal point error data is generated and supplied to a focal point correction control part 22 and a focal point corrector 11 is controlled.