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    • 6. 发明专利
    • SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF DECIDING END OF FORMATION OF OXIDE FILM, WHICH IS USED FOR THAT DEVICE
    • JPH08139082A
    • 1996-05-31
    • JP27335094
    • 1994-11-08
    • HITACHI LTDHITACHI VLSI ENG
    • HASEBE TADAYOSHIKATO HIDEAKI
    • C30B25/16H01L21/31
    • PURPOSE: To enable a high-accuracy decision of the end of formation of an oxide film without being affected by the temperature in a treating chamber and a variation of an atmosphere by a method wherein infrared rays, which are radiated from a workpiece, are utilized and the decision of the end point of formation of the oxide film is made on the basis of previously inputted film thickness data to show the relation between the film thickness of the oxide film and an infrared intensity. CONSTITUTION: A wafer 2 is transferred in the interior of a treating chamber 1 or to the outside of the chamber 1 by a workpiece transfer mechanism 4. Infrared rays 6 only of a frequency in a prescribed range out of infrared rays 6 radiated from the wafer 2 are transmitted through a filter 7 installed in the vicinity of the wafer 2 and the intensity of the infrared rays 6 transmitted through this filter 7 is measured by an infrared intensity detector 8. An decision of the end point of formation of an oxide film is made by an automatic end point decision means 9 on the basis of previously inputted film thickness data 12 to show the relation between this infrared intensity and the film thickness of the oxide film and after the decision of the end point is made, a power supply of a heating source 3 is turned-off. Moreover, the opening and shutting of a prescribed valve 11 is driven by a process gas control part 10 on the basis of information from the means 9.