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1. 发明专利

JPS60105257A RESIN SEAL TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60105257A
公开(公告)日：1985-06-10
申请号：JP18630784
申请日：1984-09-07
申请人： HITACHI LTD
发明人： YAMAGUCHI MASAO , IMAI JIYOUGA , KANBAYASHI KAZUO
IPC分类号： H01L23/28 , H01L23/31 , H01L23/495
摘要： PURPOSE:To prevent the breakdown of a semiconductor pellet and the disconnection of a wire resulting from the difference of thermal expansion coefficients between a support plate and a resin body by forming a through-hole to the support plate and filling the hole section with the resin body. CONSTITUTION:When a through-hole 9 is formed to a metallic support plate 1 and a semiconductor pellet 4 is sealed with a resin body 7, the hole 9 is filled with a resin. The through-hole such as a circular hole 9 penetrating to a reverse main surface 1b from a main surface 1a is formed positioned between an exposed support-plate main surface one section 1a and the semiconductor pellet 4, and the inside of the circular hole 9 is filled with the resin body. The slip displacement of the resin on the support-plate main surface 1a is suppressed by the resin existing in the hole, and stress applied to the side surface of the semiconductor pellet is prevented. When the width W1 of the hole is larger than one side W2 of the semiconductor pellet and there is the semiconductor pellet in the extensions of the width W1, the hole is effective for preventing the breakdown of the semiconductor pellet.

2. 发明专利

JPS55130153A RESIN SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS55130153A
公开(公告)日：1980-10-08
申请号：JP3687679
申请日：1979-03-30
申请人： HITACHI LTD
发明人： IMAI JIYOUGA
IPC分类号： H01L23/28 , H01L23/31 , H01L23/495
摘要： PURPOSE:To prevent the disconnection of a junction owing to heat in a semiconductor device and improve the reliability of the device by forming thin and slender portion not coated with connector resin having lower rigidity and easily defomable property than the portion coated with the connector resin. CONSTITUTION:Base and emitter connectors 8 and 9 are connected through solders 4 to the base and emitter electrodes of a semiconductor element 2 secured to a preferably thermoconductive header 1, and formed thinner by half than the connector portion projected externaly of a herd coating resin 6 and more slender in a degree by half in width than that. At this time the connector portion coated with the resin 6 has lower rigidity and easily deformable property. Accordingly, it can eliminate the deformation of the connector owing to thermal stress.

3. 发明专利

JPS55127041A RESINNSEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS55127041A
公开(公告)日：1980-10-01
申请号：JP3443479
申请日：1979-03-26
申请人： HITACHI LTD
发明人： IMAI JIYOUGA , SUZUKI SATORU
IPC分类号： H01L23/29 , H01L23/28 , H01L23/31
摘要： PURPOSE:To absorb an external force to be applied on a pellet peripheral edge and thus to keep the pellet from being applied with a large force by covering the pellet peripheral edge to which the external force to arise due to a difference in thermal conductivity is applied with a soft and easily deformable resin. CONSTITUTION:A pellet 2 is fixed on the main surface of a header 1, and the top of the pellet 2 is covered with a soft coating resin 5. The resin 5 is then given thick on a peripheral edge of the pellet 2 on mounting hole 7 side of the header 1, thus forming a shock absorber 10. Further the inside edges of the pellet 2 and a lead 3 are covered with a hard coating resin 6. The resin 6 is then arranged to spread to a header end 9 on which the mounting hole 7 is not provided. According to this constitution, in case there occurs a thermal contraction phenomenon to have the resin 6 move in the direction of the header end along the header surface, the shock absorber 10 is pushed and crushed by the resin 6, and hence the pellet edge is prevented from being applied with a large force.

4. 发明专利

JPS52129379A PLASTIC MOLDED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS52129379A
公开(公告)日：1977-10-29
申请号：JP4549876
申请日：1976-04-23
申请人： HITACHI LTD
发明人： YAMAGUCHI MASAO , IMAI JIYOUGA , KANBAYASHI KAZUO
IPC分类号： H01L23/48 , H01L23/02 , H01L23/12 , H01L23/28
摘要： PURPOSE:To evade the breakdown of pellets and the disconnection of wires by so designing a metal support plate as to restrain the resin around semiconductor pellet and the vicinity of wires thereby reducing the displacement owing to thermal expansion of the resin.

5. 发明专利

JPS60105258A RESIN SEAL TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS60105258A
公开(公告)日：1985-06-10
申请号：JP18630884
申请日：1984-09-07
申请人： HITACHI LTD
发明人： YAMAGUCHI MASAO , IMAI JIYOUGA , KANBAYASHI KAZUO
IPC分类号： H01L23/28 , H01L23/31 , H01L23/433
摘要： PURPOSE:To prevent the breakdown of a semiconductor pellet and the disconnection of a wire resulting from the difference of thermal expansion coefficients between a support plate and a resin body by forming a groove to the support plate, fixing the semiconductor pellet to a flat section in the groove and filling the inside of the groove with a resin. CONSTITUTION:A quadrilateral groove 2 having size in an extent that the groove can receive a pellet is formed to the central upper surface of a metallic support plate 1, a rectangular notch section 3 is formed at one end of the support plate 1, and the semiconductor pellet 4 is fixed to a flat section 2a in the groove 2 through solder, etc. The upper surface of the metallic support plate 1 including one part of the side surface section of the rectangular notch section 3 is sealed with a resin body 7 so as to surround the semiconductor pellet 4, wires 6 and the partial inner end sections of each lead wire 5. Accordingly, the resin 7 in the semiconductor pellet 4 and peripheral section in the vicinity of the wires 6 is constraied by the quadrilateral groove 2 and the rectangular notch section 3 of one end of the groove, and displacement due to the thermal expansion of the resin 7 is reduced by the sections, thus minimizing the breakdown of the semiconductor pellet 4 and the disconnection of the wires 6.

6. 发明专利

JPS53118446A COATING DEVICE OF VISCOUS COATING COMPOUNDS 失效
公开(公告)号：JPS53118446A
公开(公告)日：1978-10-16
申请号：JP3218577
申请日：1977-03-25
申请人： HITACHI LTD
发明人： IMAI JIYOUGA , MAKINO KEISUKE
IPC分类号： B05C5/00 , B05B1/02
摘要： PURPOSE:The title coating device designed to feed a very small amount of viscous coating compound without contacting the part to be coated, wherein a pneumatic discharge means to feed a coating compound is provided near a closing device to close the coating compound path when the amount of the viscous coating compound becomes a given value.

7. 发明专利

JPS54113251A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS54113251A
公开(公告)日：1979-09-04
申请号：JP1980578
申请日：1978-02-24
申请人： HITACHI LTD
发明人： IMAI JIYOUGA , SUZUKI SATORU
IPC分类号： H01L23/48 , H01L23/12
摘要： PURPOSE:To improve a quality and a reliability of devices by providing a cut part in the side face part of the stem which is placed between a vise hole for heat sink fitting and a mold. CONSTITUTION:Two cut grooves 8 which have a U-shaped section are formed vertically and symmetrically in respect to one vise hole in the side face part of stem 1 which is placed between mold part 2 and vise hole 3. It is desirable that grooves 8 are provided at distance l within distance L from the tip of mold part 2 to the center of vise hole 3. As a result, in case of fitting to heat sink 7, stress is absorbed because of the existence of cut groove 8 and is prevented from being transferred to stem 12 of the mold part 2 side, so that stem 1b cannot be deformed, and element breakage cannot occur, and quality can be improved.

8. 发明专利

JPS5362473A PRODUCTION OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5362473A
公开(公告)日：1978-06-03
申请号：JP13730376
申请日：1976-11-17
申请人： HITACHI LTD
发明人： HAYASHI HATSUO , IMAI JIYOUGA , TOYODA MASAKATSU , YAMAMOTO HISAO
IPC分类号： H01L23/28 , H01L23/04 , H01L23/08
摘要： PURPOSE:To achieve the improvement in airtightness by providing an undercoat effluence preventing groove on the outside circumference of the pellet fixing part on a stem.

9. 发明专利

JPS51111068A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS51111068A
公开(公告)日：1976-10-01
申请号：JP3560275
申请日：1975-03-26
申请人： HITACHI LTD
发明人： IMAI JIYOUGA , YOSHIOKA TOSHIAKI
IPC分类号： H01L23/32 , H01L23/28
摘要： PURPOSE:To prevent Si oil grease, coated to get high heat transfer between the stem and the heat rink, from flowing into the semiconductor pellet is the resin mold of the resin mold type semiconductor.

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