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1. 发明专利

DE69116709T2 未知
公开(公告)号：DE69116709T2
公开(公告)日：1997-02-06
申请号：DE69116709
申请日：1991-03-18
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HONMA KAZUO , IGARASHI SHIGEMI , ISHIKAWA TADAAKI , TAKIZAWA RYU , HIRAMOTO SOTOZI , HONMA MAKOTO , HATA SEIJI , NAKAMURA MITSUO
IPC分类号： H05K13/04 , H05K13/08
摘要： An apparatus for transporting a component, such as an electronic component (4) has a head (1) with a holding means (3) for holding the component (4) when the component (4) is picked up from a suitable store (15,15a). The head (1) is movable relative to a base (100). An imaging apparatus (6), such as a camera, is fixed to the head (1) and this allows the position of the component (4) relative to the holding means (3) to be determined whilst the component (4) is being transported. In order to simplify the structure, there is a movable optical component (8) on the head (1) which, in one position, contributes to defining an optical path between the component (4) and the imaging apparatus (6), and in another position is withdrawn. A further imaging apparatus may be provided, on the base or on the head. That further imaging apparatus (42,43,45) may then detect the position of large components (4), if the first imaging apparatus has a narrow filed of view for small components (4). Alternatively, when the further imaging apparatus is on the head (1), it may detect the position to which the component (4) is to be transported.

2. 发明专利

DE69116709D1 未知
公开(公告)号：DE69116709D1
公开(公告)日：1996-03-14
申请号：DE69116709
申请日：1991-03-18
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HONMA KAZUO , IGARASHI SHIGEMI , ISHIKAWA TADAAKI , TAKIZAWA RYU , HIRAMOTO SOTOZI , HONMA MAKOTO , HATA SEIJI , NAKAMURA MITSUO
IPC分类号： H05K13/04 , H05K13/08
摘要： An apparatus for transporting a component, such as an electronic component (4) has a head (1) with a holding means (3) for holding the component (4) when the component (4) is picked up from a suitable store (15,15a). The head (1) is movable relative to a base (100). An imaging apparatus (6), such as a camera, is fixed to the head (1) and this allows the position of the component (4) relative to the holding means (3) to be determined whilst the component (4) is being transported. In order to simplify the structure, there is a movable optical component (8) on the head (1) which, in one position, contributes to defining an optical path between the component (4) and the imaging apparatus (6), and in another position is withdrawn. A further imaging apparatus may be provided, on the base or on the head. That further imaging apparatus (42,43,45) may then detect the position of large components (4), if the first imaging apparatus has a narrow filed of view for small components (4). Alternatively, when the further imaging apparatus is on the head (1), it may detect the position to which the component (4) is to be transported.

3. 发明专利

DE2813718A1 未知
公开(公告)号：DE2813718A1
公开(公告)日：1978-10-19
申请号：DE2813718
申请日：1978-03-30
申请人： HITACHI LTD
发明人： HONMA MAKOTO , INOUE TAKAO
IPC分类号： H03G3/34 , H04B1/10 , H04B1/16 , H04H1/00 , H04H40/72 , H04H5/00
摘要： An FM noise suppressor comprising a detector circuit which detects noise pulses included in a detected stereo composite signal, a gate circuit which is enabled or disabled by an output from the detector circuit, and a reproducing circuit which receives the stereo composite signal without intervention of the gate circuit and which reproduces a subcarrier signal for FM stereo signal demodulation in synchronism with a pilot signal included in the received stereo composite signal. A decoder demodulates stereo signals on the basis of an output signal of the gate circuit and the output signal of the reproducing circuit.

4. 发明专利

JPH0425322A PART DETECTING MECHANISM OF ELECTRONIC PART HOLDING DEVICE 失效
公开(公告)号：JPH0425322A
公开(公告)日：1992-01-29
申请号：JP12666190
申请日：1990-05-18
申请人： HITACHI LTD
发明人： HIRAMOTO SOTOJI , NAKAMURA MITSUO , HONMA MAKOTO , HATA SEIJI , HONMA KAZUO
IPC分类号： B23P19/00 , B23P21/00 , H05K13/08
摘要： PURPOSE:To prevent the lowering of loading efficiency by loading electronic parts on a printed board after using two detectors properly according to kinds of electronic parts, in a part detecting mechanism for detecting the position or the posture of an electronic part. CONSTITUTION:In an electronic part holding device where an adsorbing head 1 takes out electronic parts A and B from part supplying sections 3A and 3B and holds them and this adsorbing head 1 moves the electronic parts A and B while holding to load them on a printed board 5 when the adsorbing head 1 moves, for example, to a part supplying unit 3A and then an adsorbing nozzle 2 adsorbs the electronic part A and ascends, a movable mirror moves in a position below the nozzle 2 by being driven by an optical air cylinder while the nozzle 2 is ascending, and accordingly the electronic part A is projected on the first detector 41 so that the detector 41 can detect the electronic part A. On the other hand, when the large size electronic part B is loaded, the second detector 42 is used. The electronic parts A and B detected in this way are mounted on the printed board 5.

5. 发明专利

JPH04225300A POSITIONING METHOD OF IMAGE 失效
公开(公告)号：JPH04225300A
公开(公告)日：1992-08-14
申请号：JP40755790
申请日：1990-12-27
申请人： HITACHI LTD
发明人： HATA SEIJI , DOUJIYOU ATSUNARI , HONMA MAKOTO , HIRAMOTO SOTOJI , TOMITA MASAMICHI
IPC分类号： B23P19/00 , G05D3/12 , H05K13/04 , H05K13/08
摘要： PURPOSE:To offer an accurate positioning method whose reliability is high by a method wherein the outside-shape contour of an image picked up by using a PV camera is extracted or the projection distribution of a component region is found and the approximate position of the image is then decided. CONSTITUTION:A silhouette image is taken into a memory at an image processing device when the image is input. Then, it is approximated to a polygon by executing a square approximation treatment. On the basis of image contour information obtained by the treatment, its recessed parts are filled; and an outside-shape contour is changed to a protruding figure. A rectangle which is overlapped best with the silhouette image of a component is selected. For example, in the case of the image of QFP, it is positioned by drawing measuring lines in parallel with individual sides of the rectangle and on the inner side by a prescribed amount which has been given in advance. In the case of a square ticket or the like, a positioning window is set on the inner side by a prescribed amount from corners of a circumscribed rectangle; then, its position and its angle can be decided by synthesizing all positions computed by using the window.

6. 发明专利

JPH03270893A METHOD AND DEVICE FOR SENSING AND TRANSPORT OF ELECTRONIC PARTS 失效
公开(公告)号：JPH03270893A
公开(公告)日：1991-12-03
申请号：JP6875290
申请日：1990-03-19
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HONMA KAZUO , IGARASHI SHIGEMI , ISHIKAWA TADAAKI , TAKIZAWA TATSU , HIRAMOTO SOTOJI , HONMA MAKOTO , HATA SEIJI
IPC分类号： B25J19/04 , B25J5/02 , B25J15/06 , H04N5/225 , H04N7/18 , H05K13/02 , H05K13/08
摘要： PURPOSE:To have quick and precise mounting of electronic parts by transporting them by a mounting head, performing at the same time the sensing of displacement of each piece of the parts, providing a reflecting face in an optical component, and accomplishing in light weight and enabling quick traveling. CONSTITUTION:A mounting head 1 moves onto an electronic parts supply device 15, and an attraction nozzle 3 sinks to attract electronic parts 4. At this time, an optical component 8 is retreated to the retreat position 10, and the mounting head 1 transports the electronic parts 4 to the target position for mounting 11 on a printed circuit board 5. Meantime the optical component 8 having a reflecting face makes parallel motion or rotation relative to an image pickup device 6 to be located on the axial extension of an attraction nozzle 3, and feeds the image of electronic parts 4 to the image pickup device 6. This device 6 picks up the image of electronic parts 4 in conformity to a command from a control device 12, and the deviations of the position and attitude of the electronic parts 4 relative to the attraction head 1 are measured, and calculation and correction are conducted on the basis of the result from measurement. Thus the attraction head 1 stop in place precisely, and the attraction nozzle 3 sinks to enable proper performance of mounting.

7. 发明专利

JPH0555797A HEAD DEVICE FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JPH0555797A
公开(公告)日：1993-03-05
申请号：JP24240491
申请日：1991-08-29
申请人： HITACHI LTD
发明人： KATO HIROYASU , OKUBO SHIGETO , HONMA MAKOTO
IPC分类号： B23P21/00 , H05K13/04
摘要： PURPOSE:To provide a head device for mounting an electronic component for an electronic component mounting machine which can sufficiently improve the positioning accuracy in mounting the component. CONSTITUTION:An electronic component holding member such as a suction nozzle 3 is mounted in the end 1A of a center shaft 1 by a piezo actuator 7, the actuator 7 is driven in response to a fine positional change between the nozzle 3 and the shaft 1 to cancel the deviation of the nozzle 3, thereby preventing its fine vibration. Since the fine vibration of the nozzle 3 is prevented, its mounting accuracy can be improved, and since the vibration generated at the time of accelerating/decelerating can be removed at the nozzle 3, its mounting time can be shortened.

8. 发明专利

JPH04252100A APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT 失效
公开(公告)号：JPH04252100A
公开(公告)日：1992-09-08
申请号：JP192591
申请日：1991-01-11
申请人： HITACHI LTD
发明人： TOMITA MASAMICHI , HONMA KAZUO , IGARASHI SHIGEMI , TAKIZAWA TATSU , FUJISHIRO KEISUKE , HONMA MAKOTO , TOMITA TOMOYA
IPC分类号： G01B11/00 , H05B33/00 , H05K13/02 , H05K13/04 , H05K13/08
摘要： PURPOSE:To obtain an apparatus for rapidly mounting various electronic components on a printed board coping with the large and small components. CONSTITUTION:An image sensor 9 for selectively imaging the image of a small- sized electronic component 5 and the image of a positioning mark 15 by a beam splitter 16 and a shutter 17, and image sensor 10 for imaging a mounting pattern 7 are provided in a mounting head 2, and an image sensor 8 for a large-sized component 4 is secured to a mounting apparatus body. A movable mirror 18 is provided under a suction nozzle 3, and the small-sized component 5 is imaged during conveying. Since the small-sized component 5 can be imaged during the conveyance, it can be mounted at a high speed. Since both the small- sized component 5 and the mark 15 can be imaged by the sensor 9, a simple and inexpensive structure is provided.

9. 发明专利

JPH04105341A METHOD AND EQUIPMENT FOR DETECTING BENDING AND FLOATING OF LEAD OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04105341A
公开(公告)日：1992-04-07
申请号：JP22130290
申请日：1990-08-24
申请人： HITACHI LTD
发明人： HONMA MAKOTO , HIRAMOTO SOTOJI , HATA SEIJI , TOMITA MASAMICHI , ISHIBASHI AKIRA
IPC分类号： G01B11/00 , G01B11/24 , G01N21/956 , H01L21/66 , H01L23/50 , H05K13/08
摘要： PURPOSE:To detect the bending and the floating of a lead with high precision by using the same mechanism, and shorten the detection time, by irradiating a lead with an optical cutting beam, imaging the lead part with an image equipment, and detecting the bending or the floating on the basis of three-dimensional data of each lead on the picture image. CONSTITUTION:The leads of a semiconductor device 1 are irradiated with an optical cutting beam 6, and a lead part 12 is imaged by an image equipment 3. On the basis of three-dimensional data of each lead obtained from the optical cutting beam 6 of each lead part 12 on the picture image picked up by the image equipment 3, at least one of the bending or the floating of the lead is detected. For example, the semiconductor device 1 is moved in the visual field of a TV camera 3; the light outputted from a semiconductor laser light source 7 is turned into the optical cutting beam 6 by a lens 8, and projected on the lead part 12 of the semiconductor device 1; the image of the optical cutting beam 6 of the lead part 12 obtained in the above process is picked up by the TV camera 3, and read and stored as picture image data by an image processing equipment 11. The bending and the floating of leads of the semiconductor device 1 are detected through a specified process.

10. 发明专利

JPH0448248A CREAM SOLDER PRINTING AND INSPECTING DEVICE 失效
公开(公告)号：JPH0448248A
公开(公告)日：1992-02-18
申请号：JP15774890
申请日：1990-06-18
申请人： HITACHI LTD
发明人： KATO HIROYASU , KADOYA TADAAKI , OKUBO SHIGETO , HONMA MAKOTO
IPC分类号： G01N21/88 , G01N21/956 , G06T1/00 , H01L21/66 , H04N7/18 , H05K3/34
摘要： PURPOSE:To eliminate the generation of defects and to improve a yield by analyzing the image data before parts are mounted on a circuit board printed with cream solder and deciding the normal/defective condition of the cream solder printing. CONSTITUTION:The images of the circuit patterns of the circuit board 12 are picked up by a TV camera 5 and the image data of the region of the circuit board 12 where the cream solder is presumed to be printed is taken into an image data analyzing section 7. The taken-in image data of the region of the circuit board 12 where the cream solder is presumed to be printed is investigated and the defect is detected from the degree of the presence or absence of the information indicating the presence of the circuit pattern therein. The ordinary operation to transfer the parts is started when the absence of the defect is decided. Then, the defective cream solder - printed circuit board having the high probability of generating the defect after the mounting of the parts is eliminated before the mounting of the parts and the high yield of production is maintained.

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