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    • 4. 发明专利
    • POSITIONING MECHANISM FOR OPTICAL COMPONENT
    • JPS63316870A
    • 1988-12-26
    • JP15305787
    • 1987-06-19
    • HITACHI ELECTR ENGHITACHI LTD
    • SHINPO SENJITAKENAKA YASUOTSUKAZAKI KOICHI
    • G03G7/00B41J25/34G02B7/00
    • PURPOSE:To eliminate the error of a positioning mechanism and to eliminate the need for adjustment at the time of refitting operation by limiting the movement of a positioning plate by guide pins provided at right angles to the optical axis of an optical system and adjusting its position by utilizing an elliptic hole, and bringing a storage plate into contact with the flank of the positioning plate and fixing the plate. CONSTITUTION:A holder 17 which holds an optical component 17a is accurately fixed to the positioning plate 18. The positioning plate 18 is fixed temporarily in the elliptic hole 18a in contact with the two guide pins 19a and 19b provided to a reference base 11, and the positioning plate 18 is moved along the guide pins to perform positioning operation. Then a setscrew 18b in the elliptic hole is clamped and fixed, and the storage plate 21 is fixed with screws in contact with the flank of the positioning plate 18. When an optical component 17a is detached, it is detached from a reference base board 11 together with the positioning plate 18. The flank of the position plate 18 is brought into contact with the storage plate 21 when the component is fitted again, and the positioning plate is returned to the same position as before immediately by using the guide pins.
    • 7. 发明专利
    • DETECTING METHOD FOR PATTERN
    • JPH05196435A
    • 1993-08-06
    • JP15473092
    • 1992-06-15
    • HITACHI LTD
    • SAITOU KEIYATSUKAZAKI KOICHIHARA YASUHIKO
    • G01B11/24G01N21/88G01N21/956
    • PURPOSE:To detect a wiring pattern and a through hole by providing a fluorescent substance on the rear side of a printed wiring board, by making fluorescence be generated in the fluorescent substance by lights passed through a base and the through hole respectively, and by detecting light obtained by adding the fluorescence thus generated to a fluorescence generated in the base. CONSTITUTION:A fluorescent substance 12 generating a fluorescence having virtually the same wavelength as the one of a base 3 is provided on the rear side of a printed wiring board 1. A light 21 from a light source 5 is turned/by a filter 7 into a light 22 of a wavelength making a fluorescence be generated readily from the base 3, an optical path thereof is changed by a semi-transparent mirror 8 and the light is applied to a wiring surface 2. A reflected light is generated from the wiring surface 2, while the fluorescence is generated from the base 3. The light transmitted through the base 3 is applied to the fluorescent substance 12 and makes the fluorescence be generated and this fluorescence is transmitted through the base 3 and proceeds upward. Moreover, a fluorescence 33 is generated from the fluorescent substance 12 by a light 24 passing through a through hole 13 and that light returns through the through hole 13 and integrates with the foregoing fluorescence to be a light 36. The light 36 passes through the semi-transparent mirror 8, only a fluorescence 35 is transmitted through a filter 9, with the reflected light cut thereby, and an image is formed on a detector 11 by an image-forming lens 10. In this way, the positions and shapes of a wiring pattern and the through hole are detected.
    • 9. 发明专利
    • METHOD FOR INSPECTING CONNECTED PART BY SOLDERING
    • JPH0277980A
    • 1990-03-19
    • JP22875588
    • 1988-09-14
    • HITACHI LTD
    • HOSHI SHIROUDAGAWA KATSUMITSUKAZAKI KOICHI
    • G01N25/72B23K1/00G06T1/00H05K3/34
    • PURPOSE:To easily discriminate the quality of a connected part by soldering by applying a paint, the physical property of which changes when the soldered part is heated and observing the soldered part after heating. CONSTITUTION:Particles 7 of the paint applied on the surface of a soldered reed 5 do not deform and maintain their original shapes even when hot air of about 80 deg.C is blown on the reed 5 for 1-2 minutes, because the heat capacity of the solder is large. On the other hand, particles 7 of the paint applied on the surface of another reed 6 which is not soldered are melted by the hot air and form a film 8 of the paint and the particles 7 disappear. The part of the film 8 formed as a result of heating becomes flat and strongly reflects inspection light from a light source 10 and strong reflected light enters a detector 11. Since the particles 7 maintain the original shapes at a well soldered part, the light reflectivity of the part is low and the reflected light entering the detector 11 becomes less in quantity. Therefore, when such states are processed with a processor 12, the quality of the connected part by soldering can be discriminated.