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1. 发明专利

JPH0959779A PRETREATMENT FOR PLATING 失效
公开(公告)号：JPH0959779A
公开(公告)日：1997-03-04
申请号：JP21460895
申请日：1995-08-23
申请人： HITACHI CABLE
发明人： OOKAWA YOSHINORI , MAEDA MASAMI , KOMAGINE RIKIO , OAKU TOSHIYUKI , TAKABA SHINICHI , ENDO KAZUYA
IPC分类号： B08B3/12 , C23C18/16 , C23C18/22
摘要： PROBLEM TO BE SOLVED: To form a metallic plating having sufficient peel strength on a formed body by ultrasonically cleaning the plastic formed body contg. carbon black while the body is not dried in the roughening stage of the surface of the formed body. SOLUTION: A plastic formed body of ABS resin, etc., contg. carbon black is treated with chromium sulfate, etc., to roughen the surface to form ruggednesses, and then the body is ultrasonically cleaned while the body is not dried during or after the roughening stage. In this case, the oscillation frequency of the ultrasonic wave is preferably controlled to 15-100kHz, especially to 20-50kHz, and the ultrasonic output to >=5watt/l, especially to >=10watt/l. Consequently, the free grain of carbon black on the body surface is removed, and a metallic plating layer high in peel strength is formed in the subsequent plating.

2. 发明专利

JPH08195465A LEAD FRAME INSERT BOARD FOR BATTERY PACK 失效
公开(公告)号：JPH08195465A
公开(公告)日：1996-07-30
申请号：JP386595
申请日：1995-01-13
申请人： HITACHI CABLE
发明人： ICHIGE TOSHIAKI , ENDO KAZUYA , TAKABA SHINICHI , OUCHI KATSUAKI
IPC分类号： H01R13/66 , H01L23/50 , H01M2/02
摘要： PURPOSE: To obtain a lead frame insert board for a portable terminal battery pack excellent in reliability, economy, etc., which can be reduced in size and thickness and in which the number of components and connections is decreased. CONSTITUTION: The case of a portable terminal battery pack is made of a board molding 1 and, while forming a required pattern by means of a lead frame inserted therein, output terminals 3, charging terminals 6 and connection bars for the battery are formed. The lead frame 2 is partially exposed depending on each element. A thermal shock absorbing film may be interposed between the circuit pattern and the board molding 1 in order to suppress thermal effect at the time of soldering, an ultrathin insulating film may be applied to the battery mounting face of the board body in order to ensure sufficient electric insulation between the board body and the mounted battery, or an electric or electronic device may be mounted while interconnecting the lead frames 2.

3. 发明专利

JPH07122840A COPPER BAR BOARD 失效
公开(公告)号：JPH07122840A
公开(公告)日：1995-05-12
申请号：JP26357693
申请日：1993-10-21
申请人： HITACHI CABLE
发明人： OUCHI KATSUAKI , NIHEI KIYOSHI , IWASHITA TSUKASA , ENDO KAZUYA
IPC分类号： H05K3/20 , H05K7/06
摘要： PURPOSE:To improve assembly properties largely by constituting a copper bar board with an insulating spacer installed so as to hold the mutual space of adjacent copper bars. CONSTITUTION:An insulating spacer 2 is arranged to the mutual parallel sections of one pieces of a copper bar 1 and a copper bar 1' in an interposing manner, and an insulating spacer 3 is disposed even to the two pieces of the copper bar 1 and a parallel section with the copper bar 1' in the interposing manner, thus working a copper bar board as a desired wiring board under the state, in which each copper bar 1, 1', 1'' is held at regular intervals and distributed at fixed positions. A spacer body 4 consisting of the infection molded form of plastics and a hold-down cover 5 are combined in the insulating spacer 2. A spacer body 4' composed of the infection molded form of plastics and a hold-down cover 5' are combined in the insulating spacer 3. Accordingly, the insulating spacers can be formed in a single-operation assembly step, thus improving assembly properties.

4. 发明专利

JPH09187833A PLASTIC MOLDED SUBSTRATE WITH CIRCUIT TERMINAL AND ITS MANUFACTURE 失效
公开(公告)号：JPH09187833A
公开(公告)日：1997-07-22
申请号：JP16196
申请日：1996-01-05
申请人： HITACHI CABLE
发明人： TAKABA SHINICHI , ICHIGE TOSHIAKI , ENDO KAZUYA , KOMAGINE RIKIO , OOKAWA YOSHINORI , OAKU TOSHIYUKI
IPC分类号： B29C45/00 , C23C18/22 , H05K3/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To set at least two circuits of high design freedom and high reliability at a low cost by a method wherein an easily plating resin molded product and a hardly plating resin molded product are bonded to each other by an irregular interface. SOLUTION: For a primary molded product 1, a cross section is square, a recessed part 11 is formed at each face center between respective corners, and an independent circuit 12 is respectively set on two face parts of each corner divided thereby. For a secondary molded product 2, hardly plating resin composing that is casted into each recessed part 11 of the primary molded product, and bonding by an irregular interface is carried out thereby. Further, by projecting a part from a surface of the primary molded product 1, an insulating partition between respective circuit set parts is formed. By making injecting pressure of the hardly plating resin in secondary molding maximum pressure capable of being held by the circuit set part 12 of the primary molded product, a gap is removed in the interface part between the recessed part 11 of the primary molded product and the secondary molded product 2. A short-circuit of circuits with each other via plating solution can be prevented.

5. 发明专利

JPH11207781A MANUFACTURE OF MICROWAVE CIRCUIT BOARD 失效
公开(公告)号：JPH11207781A
公开(公告)日：1999-08-03
申请号：JP1522298
申请日：1998-01-28
申请人： HITACHI CABLE
发明人： TAKABA SHINICHI , ICHIGE TOSHIAKI , ENDO KAZUYA
IPC分类号： B29C45/73 , B29C45/16 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To effectively conduct a wire bonding by reducing a surface roughness of a surface of an easily plating resin in combination with a hard plating resin. SOLUTION: In the case of combining an easily plating resin 1 and a hard plating resin 2, and integrally injection molding a base by two-color injection molding, an injection mold temperature of the easily plating resin is set to 150 deg.C or higher, or an injection speed of the resin 1 is set to 40 mm/sec. The microwave circuit board manufactured via these means can be controlled to reduce a roughness of a surface of the resin 1. The resin 1 is a liquid crystal polymer. And, the resin 2 may be a polyphenylene sulfide. And, an injection molding width of the injection molding may be 0.4 mm(min).

6. 发明专利

JPH09293947A MANUFACTURE OF THREE-DIMENSIONAL MOLDED CIRCUIT BOARD 失效
公开(公告)号：JPH09293947A
公开(公告)日：1997-11-11
申请号：JP10795996
申请日：1996-04-26
申请人： HITACHI CABLE
发明人： TAKABA SHINICHI , KOMAGINE RIKIO , OOKAWA YOSHINORI , ICHIGE TOSHIAKI , OAKU TOSHIYUKI , ENDO KAZUYA
IPC分类号： H05K1/03 , H05K3/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of a three-dimensional molded circuit board of beautiful appearance having almost no hole in the circuit formed body consisting of resin of easily plating property. SOLUTION: In this three-dimensional molded circuit board 1 manufacturing method in which a circuit formed body 2 is formed by injection-molding resin 2a of easily plating property into the first metal mold, the circuit formed body 2 is taken out from the above-mentioned first metal mold and housed in the second metal mold, and the temperature of the above-mentioned mold when the resin 2a of easily plating property is injection-molded is set at 80 to 100 deg.C.

7. 发明专利

JPH11243270A METAL PIECE INSERT INJECTION-MELDED CIRCUIT BOARD 失效
公开(公告)号：JPH11243270A
公开(公告)日：1999-09-07
申请号：JP4207398
申请日：1998-02-24
申请人： HITACHI CABLE
发明人： OOKAWA YOSHINORI , KOMAGINE RIKIO , OAKU TOSHIYUKI , ICHIGE TOSHIAKI , TAKABA SHINICHI , ENDO KAZUYA
IPC分类号： H05K1/11 , H05K3/00 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To contrive reduction in the number of parts items for a metal piece insert injection-molded circuit board, reduction in the number of the mounting processes for the circuit board and enhancement of the reliability of the circuit board, by a method wherein a metal piece, which is used as an external connection terminal, is inserted in molded materials along with molding. SOLUTION: A metal piece insert injection-molded circuit board is constituted of an injection-molded object 10, which consists of primary molded materials 1 having each patterned surface 1a and a secondary molded material 2 formed in such a way as to cover the parts other than the patterned surfaces 1a, and an external connection terminal 30, which is connected electrically with electric circuits 20 formed on the pattered surfaces 1a and at the same time, has a metal piece 21 for connecting electrically with external components and a substrate. The metal piece 21 is inserted in the molded materials 1, the molded materials 1 are provided integrally with each outer, and a cone-shaped protruding part 1b is formed in the root part of the piece 21 toward the point of the piece 21. The molded material 2 consists of a difficult plated resin formed without compounding a catalyst for electroless plating in a resin and is formed on a polyphenylene sulfide. As a result, the terminal 30 having a mechanically full strength can be formed in the number of few processes without connecting another component with the terminal 30.

8. 发明专利

JPH08306237A THREE DIMENSIONALLY WIRED COMPONENT AND ITS MANUFACTURE 失效
公开(公告)号：JPH08306237A
公开(公告)日：1996-11-22
申请号：JP11142295
申请日：1995-05-10
申请人： HITACHI CABLE
发明人： OUCHI KATSUAKI , ICHIGE TOSHIAKI , ENDO KAZUYA , NIHEI KIYOSHI
IPC分类号： H01B7/00 , H01B7/08 , H02G3/30 , H02G3/26
摘要： PURPOSE: To remarkably reduce wiring man-hour by setting a block every arranging part in the different direction in three dimensional wiring, uniting a plurality of electric wires by molding, and bending a parallel part between adjacent blocks in a lump. CONSTITUTION: Five insulating wires 1, for example, are cut in the length required for three dimensional wiring expected, the insulating covers at both ends are peeled off, then wires 1 are arranged in parallel. Resin injection molding is applied to blocks A, B, C except for intermediate bending parts 5, 6 to unite the electric wires 1. The blocks A, C of an intermediate product obtained are bent 90 degrees against the block B in a U shape in the bending parts 5, 6. The electric wires 1 led out from the blocks A, C are bent 90 degrees at its root so as to form bending parts 7, 8 for leading out. The man-hour for bending is reduced to only 12 times compared with 20 times in individually bending of the electric wires. In addition, leading out job of the electric wire can be conducted without positioning.

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