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    • 2. 发明申请
    • CRYSTAL DEVICE AND INSPECTION METHOD OF CRYSTAL DEVICE
    • 晶体器件的晶体和检测方法
    • US20120242195A1
    • 2012-09-27
    • US13426613
    • 2012-03-22
    • KENJI SHIMAOMANABU ISHIKAWAHIROYUKI SASAKI
    • KENJI SHIMAOMANABU ISHIKAWAHIROYUKI SASAKI
    • H01L41/047
    • H03H9/1021H03H9/0519
    • A crystal device and an inspection method for inspecting the crystal device are provided. The crystal device includes: a crystal plate; excitation electrodes formed on the crystal plate; extraction electrodes extending from the excitation electrodes; electrode pads electrically connected with the extraction electrodes; a package including mounting terminals formed on a mounting surface and connection terminals formed on a bottom surface, which is on the other side of the mounting surface, and electrically connected with the mounting terminals; and an electrically-conductive adhesive agent bonding and fixing the connection terminals to the electrode pads. An bonding status inspection region, on which no metal film is formed, is formed in the crystal plate, and the bonding status inspection region is surrounded by or adjacent to the electrode pads. In addition, the bonding status inspection region occupies not more than 25% of the area of the electrode pads.
    • 提供了一种用于检查晶体装置的晶体装置和检查方法。 晶体装置包括:晶体板; 形成在晶体板上的激励电极; 从激励电极延伸的提取电极; 与提取电极电连接的电极焊盘; 包括形成在安装表面上的安装端子和形成在底面的连接端子的封装,所述连接端子位于所述安装面的另一侧,并与所述安装端子电连接; 以及将连接端子接合并固定到电极焊盘的导电粘合剂。 在该晶体板中形成没有形成金属膜的接合状态检查区域,并且接合状态检查区域被电极焊盘包围或邻近。 此外,接合状态检查区域不超过电极焊盘面积的25%。