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    • 7. 发明申请
    • MEMCAPACITOR
    • 忆容器
    • WO2010147588A1
    • 2010-12-23
    • PCT/US2009/047791
    • 2009-06-18
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.BRATKOVSKI, Alexandre, M.WILLIAMS, R., Stanley
    • BRATKOVSKI, Alexandre, M.WILLIAMS, R., Stanley
    • H01G5/01H01G5/00
    • G11C11/24G11C13/0002H01G4/1272H01G4/255H01G4/33H01L27/101H01L28/40
    • A memcapacitor device (100) includes a first electrode (104) and a second electrode (106) and a memcapacitive matrix (102) interposed between the first electrode (104) and the second electrode (106). Mobile dopants (111) are contained within the memcapacitive matrix (102) and are repositioned within the memcapacitive matrix (102) by the application of a programming voltage (126) across the first electrode (104) and second electrode (106) to alter the capacitance of the memcapacitor (100). A method for utilizing a memcapacitive device (100) includes applying a programming voltage (126) across a memcapacitive matrix (102) such that mobile ions (111) contained within a memcapacitive matrix (102) are redistributed and alter a capacitance of the memcapacitive device (100), then removing the programming voltage (126) and applying a reading voltage to sense the capacitance of the memcapacitive device (100).
    • 电容器装置(100)包括插入在第一电极(104)和第二电极(106)之间的第一电极(104)和第二电极(106)和存储电容矩阵(102)。 移动掺杂剂(111)被包含在存储体矩阵(102)内,并且通过跨越第一电极(104)和第二电极(106)施加编程电压(126)而重新定位在存储电容矩阵(102)内,以改变 电容器(100)的电容。 一种利用存储电容器件(100)的方法包括跨越存储电容矩阵(102)应用编程电压(126),使得包含在存储电容矩阵(102)内的移动离子(111)被重新分配并改变存储器件的电容 (100),然后去除所述编程电压(126)并施加读取电压以感测所述存储器件(100)的电容。
    • 8. 发明申请
    • INDIRECT-BANDGAP-SEMICONDUCTOR, LIGHT-EMITTING DIODE
    • 间接双峰半导体,发光二极管
    • WO2010110781A1
    • 2010-09-30
    • PCT/US2009/037962
    • 2009-03-23
    • HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.BRATKOVSKI, Alexandre, M.OSIPOV, Viatcheslav
    • BRATKOVSKI, Alexandre, M.OSIPOV, Viatcheslav
    • H01L33/00
    • H01L33/34H01L33/0012
    • An indirect-bandgap-semiconductor, light-emitting diode (401). The indirect-bandgap-semiconductor, light-emitting diode (401) includes a plurality of portions including a p-doped portion (412) of an indirect-bandgap semiconductor, an intrinsic portion (414) of the indirect-bandgap semiconductor, and a n-doped portion (416) of the indirect-bandgap semiconductor. The intrinsic portion (414) is disposed between the p-doped portion (412) and the n-doped portion (414) and forms a p-i junction (430) with the p-doped portion (412), and an i-n junction (434) with the n-doped portion (416). The p-i junction (430) and the i-n junction (434) are configured to facilitate formation of at least one hot electron-hole plasma in the intrinsic portion (414) when the indirect-bandgap-semiconductor, light-emitting diode (401) is reverse biased and to facilitate luminescence produced by recombination of a hot electron with a hole.
    • 间接带隙半导体发光二极管(401)。 间接带隙半导体发光二极管(401)包括多个部分,其包括间接带隙半导体的p掺杂部分(412),间接带隙半导体的本征部分(414)和 间接带隙半导体的n掺杂部分(416)。 本征部分(414)设置在p掺杂部分(412)和n掺杂部分(414)之间并与p掺杂部分(412)形成π结(430),并且在结(434) )与n掺杂部分(416)。 当间接带隙半导体发光二极管(401)为(...)时,pI结(430)和In结(434)被构造成便于在本征部分(414)中形成至少一个热电子 - 空穴等离子体 反向偏置,并促进热电子与孔复合产生的发光。