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    • 2. 发明申请
    • COMPOSITE FILM FOR BOARD LEVEL EMI SHIELDING
    • 用于板级EMI屏蔽的复合膜
    • WO2012058131A3
    • 2012-06-28
    • PCT/US2011057418
    • 2011-10-24
    • HENKEL CORPCHENG CHIH-MINXIA BOTHOMAS GEORGE
    • CHENG CHIH-MINXIA BOTHOMAS GEORGE
    • H05K9/00H05K3/28
    • G21F1/00H05K9/0088
    • An EMI shielding composite film for use in printed circuit boards has at least two layers, a top layer electrically conductive in all directions (isotropic), and a bottom layer electrically conductive only in the Z (thickness) direction (anisotropic) after thermo-compression. The bottom layer is in contact with the grounding pads of the circuitry of the electronic device to be shielded. The conductive top layer functions similarly to metallic boxes to prevent the electromagnetic radiation from both entering the boxes and escaping into the environment. The bottom layer interconnects the top conductive layer to the grounding pads on the PCB after thermo-compression so that electromagnetic waves collected by the top layer are directed and released to PCB grounding pads through the bottom layer.
    • 用于印刷电路板的EMI屏蔽复合膜具有至少两层,在所有方向上导电的顶层(各向同性)和仅在热压缩后的Z(厚度)方向(各向异性)上导电的底层 。 底层与要屏蔽的电子设备的电路的接地焊盘接触。 导电顶层的作用类似于金属盒,以防止电磁辐射进入箱体并逃逸到环境中。 底层在热压缩之后将顶部导电层与PCB上的接地焊盘相互连接,使得由顶层收集的电磁波通过底层引导并释放到PCB接地焊盘。