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    • 10. 发明专利
    • Inorganic filler-contaning resin composition
    • 无机填料 - 树脂组合物
    • JPS6164756A
    • 1986-04-03
    • JP18607584
    • 1984-09-05
    • Harima Refract Co LtdNippon Steel Corp
    • ITO MICHIOSHINOHARA YASUAKIKURATA YOSHIAKIMURAKAMI SUMIKAZU
    • C08K3/00C08K3/16C08K3/20C08K3/22C08K3/34C08K3/36C08L87/00H05K1/03
    • H05K1/0373
    • PURPOSE: To provide the titled compsn. having excellent thermal conductivity and an excellent effect of preventing burr formation, by incorporating a specified filler in a thermosetting resin.
      CONSTITUTION: 10W90wt% spherical silica particles obtd. by finely dividing silica sand, tridymite or cristobalite and passing the resulting particles through high-temperature flame at 2,000°C or above, is mixed with 90W10wt% crushed alumina particles obtd. by crushing sintered or soft-burnt alumina into a powder having a particle size of 177μm or below to obtain a filler. 35W90wt% said filler is blended with a thermosetting resin (e.g. phenolic resin).
      EFFECT: An inorg. filler-contg. resin compsn. which has low thermal expansibility and is suitable for use as insulating sheet for electronic parts, sealing material and a heat-dissipating sheet can be obtd.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:提供标题化合物。 通过在热固性树脂中加入特定的填料,具有优异的导热性和优异的防止毛刺形成的效果。 构成:10-90wt%球形二氧化硅颗粒。 通过将二氧化硅砂,鳞石英或方英石细分,并将所得颗粒通过2,000℃或更高温度的高温火焰,与90-10重量%的粉碎的氧化铝颗粒混合。 通过将烧结或软化的氧化铝粉碎成粒径为177μm以下的粉末,得到填料。 35-90wt%的所述填料与热固性树脂(例如酚醛树脂)共混。 效果:一个inorg。 填充物 树脂制品 其热膨胀性低,适用于电子零件的绝缘片,密封材料和散热片。