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1. 发明申请

US20110156740A1 PROBE CARD 审中-公开
标题翻译：探针卡
公开(公告)号：US20110156740A1
公开(公告)日：2011-06-30
申请号：US12880707
申请日：2010-09-13
申请人： Gyu Man Hwang , Ji Hwan Shin , Yong Seok Choi
发明人： Gyu Man Hwang , Ji Hwan Shin , Yong Seok Choi
IPC分类号： G01R31/00 , G01R1/06
CPC分类号： G01R1/07378
摘要： There is provided a probe card. A probe card according to an aspect of the invention may include: a printed circuit board; a horizontal regulator passing through the printed circuit board and having an insertion portion having a horizontal regulation bolt and an insertion portion having a curved portion provided on an end portion of the horizontal regulation bolt; a probe substrate electrically connected to the printed circuit board; and a connection member mounted on the probe circuit, engaged with the horizontal regulation portion, and having an insertion recess therein so that the insertion portion is rotated within the insertion recess.
摘要翻译：提供了探针卡。根据本发明的一个方面的探针卡可以包括：印刷电路板; 水平调节器穿过印刷电路板并具有具有水平调节螺栓的插入部分和设置在水平调节螺栓的端部上的具有弯曲部分的插入部分; 电连接到印刷电路板的探针基板; 以及连接构件，其安装在探针电路上，与水平调节部分接合，并且在其中具有插入凹部，使得插入部分在插入凹槽内旋转。

2. 发明授权

US07926154B2 Method of manufacturing multi-layer ceramic condenser 有权
标题翻译：制造多层陶瓷冷凝器的方法
公开(公告)号：US07926154B2
公开(公告)日：2011-04-19
申请号：US12271428
申请日：2008-11-14
申请人： Ki Pyo Hong , Byeung Gyu Chang , Ji Hwan Shin , Gyu Man Hwang
发明人： Ki Pyo Hong , Byeung Gyu Chang , Ji Hwan Shin , Gyu Man Hwang
IPC分类号： H01G7/00
CPC分类号： H01G4/30 , H01G4/1227 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49165 , Y10T29/49169
摘要： There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.
摘要翻译：提供一种制造多层陶瓷冷凝器的方法。制造多层陶瓷电容器的方法可以包括：层压多个形成有内部电极的电介质生片以形成层压体; 在要形成外部电极的层压体的区域中形成通孔; 用导电膏填充通孔以形成外部电极; 切割其上形成有外部电极的层压体; 并烧制切割的层压体以形成至少一层多层陶瓷冷凝器。

3. 发明申请

US20090126174A1 METHOD OF MANUFACTURING MULTI-LAYER CERAMIC CONDENSER 有权
标题翻译：制造多层陶瓷冷凝器的方法
公开(公告)号：US20090126174A1
公开(公告)日：2009-05-21
申请号：US12271428
申请日：2008-11-14
申请人： Ki Pyo Hong , Byeung Gyu Chang , Ji Hwan Shin , Gyu Man Hwang
发明人： Ki Pyo Hong , Byeung Gyu Chang , Ji Hwan Shin , Gyu Man Hwang
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/1227 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T29/49165 , Y10T29/49169
摘要： There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.
摘要翻译：提供一种制造多层陶瓷冷凝器的方法。制造多层陶瓷电容器的方法可以包括：层压多个形成有内部电极的电介质生片以形成层压体; 在要形成外部电极的层压体的区域中形成通孔; 用导电膏填充通孔以形成外部电极; 切割其上形成有外部电极的层压体; 并烧制切割的层压体以形成至少一层多层陶瓷冷凝器。

4. 发明授权

US09188607B2 Substrate and method for manufacturing the same, and probe card 有权
标题翻译：基板及其制造方法及探针卡
公开(公告)号：US09188607B2
公开(公告)日：2015-11-17
申请号：US13482353
申请日：2012-05-29
申请人： Gyu Man Hwang , Ji Hwan Shin
发明人： Gyu Man Hwang , Ji Hwan Shin
IPC分类号： G01R3/00 , G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , Y10T428/2462
摘要： A substrate and a method for manufacturing the same, and a probe card employing the substrate as a space transformer. The substrate includes: a substrate body; a key forming groove formed in one surface of the substrate body; and an alignment key formed on the key forming groove. The recognition rate of the alignment key formed on the substrate can be increased, resulting in improved accuracy in a micro electro mechanical system (MEMS) process for forming micro probes on the substrate, thereby improving productivity and reliability of the substrate and the probe card including the same.
摘要翻译：基板及其制造方法以及使用该基板作为空间变换器的探针卡。基板包括：基板主体; 形成在所述基板主体的一个表面中的键形成槽; 以及形成在键形成槽上的对准键。可以增加形成在基板上的对准键的识别率，从而提高用于在基板上形成微探针的微机电系统（MEMS）工艺的精度，从而提高基板和探针卡的生产率和可靠性，包括一样。

5. 发明申请

US20110181314A1 Member for adjusting horizontality, and probe card with the same 审中-公开
标题翻译：会员调整水平度，探针卡相同
公开(公告)号：US20110181314A1
公开(公告)日：2011-07-28
申请号：US12805804
申请日：2010-08-19
申请人： Gyu Man Hwang , Ji Hwan Shin , Yong Seok Choi
发明人： Gyu Man Hwang , Ji Hwan Shin , Yong Seok Choi
IPC分类号： G01R31/00
CPC分类号： G01R31/2891
摘要： Disclosed herein are a member for adjusting horizontality and a probe card with the same. The member for adjusting horizontality according to the present invention horizontally couples a micro probe head to a probe substrate with an adhesive layer therebetween, and the member for adjusting horizontality which is coupled to the micro probe head does not have an edge of the coupling portion and an edge of the adhesive layer. Therefore, according to the member for adjusting horizontality and the probe card with the same of the present invention, it is possible to prevent the coupling portions of the micro probe head from being broken, by reducing stress applied to the micro probe head during the process of horizontally coupling the micro probe head to the probe substrate.
摘要翻译：这里公开了用于调节水平度的构件和具有该水平度的探针卡。根据本发明的用于调节水平度的构件将微型探针头水平地耦合到探针基底上，其间具有粘合剂层，并且用于调节与微型探针头连接的水平度的构件不具有联接部分的边缘，粘合剂层的边缘。因此，根据本发明的水平调整用构件和探针卡，通过减少在该过程中施加于微型探头的应力，可以防止微型探头的联结部分破裂将微探头水平地耦合到探针基板。

6. 发明申请

US20110061919A1 Low temperature co-fired ceramics assembling system and method thereof 审中-公开
标题翻译：低温共烧陶瓷装配系统及其方法
公开(公告)号：US20110061919A1
公开(公告)日：2011-03-17
申请号：US12654899
申请日：2010-01-07
申请人： Gyu Man Hwang , Dae Hyeong Lee
发明人： Gyu Man Hwang , Dae Hyeong Lee
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K3/0061 , H01L23/4006 , H01L2023/4062 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4629 , H05K2201/0969 , H05K2203/167 , Y10T29/4913 , Y10T29/53174 , H01L2924/00
摘要： A low temperature ceramics substrate, a low temperature ceramics assembling system, and a method thereof in which a fixing member is formed on the bottom of an LTCC substrate, an insertion hole is formed at a coupled portion on a fixing member of the LTCC substrate coupled onto the heat sink, the fixing member is inserted into the insertion hole when the LTCC substrate and the heat sink are coupled to each other to firmly achieve alignment and fixation by the fixing member and a ceramic laminate assembling system includes a ceramic laminate substrate including an electronic component mounted on the bottom thereof and a fixing member is formed at one side thereof; and a heat sink including a sensor holder onto which the electronic component is held and an insertion groove is provided at a portion corresponding to the fixing member.
摘要翻译：一种低温陶瓷基板，低温陶瓷组装系统及其方法，在LTCC基板的底部形成有固定部件，在LTCC基板的固定部件上的耦合部分上形成有插入孔，在散热器上，当LTCC基板和散热片彼此连接时，固定部件插入到插入孔中，以牢固地实现固定部件的对准和固定，并且陶瓷层叠体组装系统包括陶瓷层叠基板，其包括：安装在其底部的电子部件和在其一侧形成固定部件; 以及散热器，其包括保持有电子部件的传感器保持件，并且在与固定部件相对应的部分设置插入槽。

7. 发明申请

US20110061929A1 Optimized power package for electrical device 有权
标题翻译：电气设备优化电源包
公开(公告)号：US20110061929A1
公开(公告)日：2011-03-17
申请号：US12591408
申请日：2009-11-18
申请人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
发明人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
IPC分类号： H05K5/00
CPC分类号： H05K5/0026 , H01L2224/48091 , H05K1/0306 , H05K1/141 , H05K3/0061 , H05K2201/105 , H05K2203/049 , H01L2924/00014
摘要： Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.
摘要翻译：公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。

8. 发明授权

US08183473B2 Optimized power package for electrical device 有权
标题翻译：电气设备优化电源包
公开(公告)号：US08183473B2
公开(公告)日：2012-05-22
申请号：US12591408
申请日：2009-11-18
申请人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
发明人： Gyu Man Hwang , Dae Hyeong Lee , Bong Gyun Kim
IPC分类号： H05K7/02
CPC分类号： H05K5/0026 , H01L2224/48091 , H05K1/0306 , H05K1/141 , H05K3/0061 , H05K2201/105 , H05K2203/049 , H01L2924/00014
摘要： Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.
摘要翻译：公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。

9. 发明申请

US20110000701A1 Ceramic elements module and manufacturing method thereof 有权
标题翻译：陶瓷元件模块及其制造方法
公开(公告)号：US20110000701A1
公开(公告)日：2011-01-06
申请号：US12461922
申请日：2009-08-27
申请人： Gyu Man Hwang , Dae Hyeong Lee
发明人： Gyu Man Hwang , Dae Hyeong Lee
IPC分类号： H05K7/20 , H05K3/30
CPC分类号： H05K1/0203 , H05K1/0306 , H05K3/0061 , H05K3/4629 , H05K7/205 , H05K2201/0969 , H05K2201/10598 , H05K2203/063 , Y10T29/49126 , Y10T29/4913
摘要： The present invention relates to a ceramic elements module and a manufacturing method thereof. There is provided a ceramic elements module, including: a ceramic elements that has a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted, and a manufacturing method thereof.
摘要翻译：陶瓷元件模块及其制造方法技术领域本发明涉及陶瓷元件模块及其制造方法。提供了一种陶瓷元件模块，包括：具有多个下插入槽的陶瓷元件; 电子部件，安装在陶瓷元件的下表面上; 以及与安装有电子部件的陶瓷元件的下部耦合的散热器，具有与下部插入槽对应的第一贯通孔和插入电子部件的第二贯通孔，其制造方法。

10. 发明授权

US08307546B2 Method for manufacturing a ceramic elements module 有权
标题翻译：陶瓷元件模块的制造方法
公开(公告)号：US08307546B2
公开(公告)日：2012-11-13
申请号：US12461922
申请日：2009-08-27
申请人： Gyu Man Hwang , Dae Hyeong Lee
发明人： Gyu Man Hwang , Dae Hyeong Lee
IPC分类号： H05K3/30
CPC分类号： H05K1/0203 , H05K1/0306 , H05K3/0061 , H05K3/4629 , H05K7/205 , H05K2201/0969 , H05K2201/10598 , H05K2203/063 , Y10T29/49126 , Y10T29/4913
摘要： A method for manufacturing a ceramic elements module. The method includes providing a ceramic elements that has a plurality of lower inserting grooves; mounting an electronic component on a lower surface of the ceramic elements; providing a heat sink that has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted to a lower part of the ceramic elements; coupling the ceramic elements with the heat sink; engaging a fixing member with the lower inserting groove of the ceramic elements by passing through the first penetrating hole of the heat sink; and removing the fixing member.
摘要翻译：陶瓷元件模块的制造方法。该方法包括提供具有多个下插入槽的陶瓷元件; 将电子部件安装在陶瓷元件的下表面上; 提供具有对应于下插入槽的第一穿透孔的散热器和电子部件插入陶瓷元件的下部的第二穿透孔; 将陶瓷元件与散热器耦合; 通过穿过散热器的第一穿孔将固定构件与陶瓷构件的下插入槽接合; 并移除固定件。

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