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    • 3. 发明授权
    • Photosensitive etching composition
    • 感光蚀刻组合物
    • US3935117A
    • 1976-01-27
    • US419010
    • 1973-11-26
    • Gyoji SuzukiTakeshi Tomotsu
    • Gyoji SuzukiTakeshi Tomotsu
    • C03C15/00H01L21/00H01L21/316H01L21/318C09K13/00G03C5/00
    • H01L21/3185C03C15/00H01L21/00H01L21/316
    • A method of forming patterns on a semiconductor element is disclosed comprising the steps of (a) depositing a coating of silicon nitride, borosilicate glass, or phosphosilicate glass on the surface of a semiconductor substrate, (b) applying a photosensitive etching solution layer to the coating and drying it, (c) irradiating the substrate with ultraviolet radiation through a photomask having a required pattern to decompose the photosensitive solution and etch the coating, and (d) removing the photosensitive solution, the decomposed material, and the reaction product of the decomposed material and the coating with an organic solvent. The photosensitive etching solution consists of a compound which may be decomposed by light to a material which etches the coating, or a compound obtained from the reaction between the photodecomposed material and other material in the solution which etches said coating.
    • 公开了一种在半导体元件上形成图案的方法,包括以下步骤:(a)在半导体衬底的表面上沉积氮化硅,硼硅酸盐玻璃或磷硅玻璃的涂层,(b)将光敏蚀刻溶液层施加到 涂覆和干燥,(c)通过具有所需图案的光掩模用紫外线照射基板以分解感光溶液并蚀刻涂层,和(d)除去感光溶液,分解的材料和反应产物 分解的材料和涂层用有机溶剂。 感光蚀刻溶液由可以被光分解成蚀刻该涂层的材料的化合物或从蚀刻所述涂层的溶液中的光分解材料和其它材料之间的反应获得的化合物组成。