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    • 3. 发明申请
    • FORMATION OF VERTICAL DEVICES BY ELECTROPLATING
    • 通过电镀形成垂直装置
    • US20090294989A1
    • 2009-12-03
    • US12538782
    • 2009-08-10
    • Hariklia DeligianniQiang HuangJohn P. HummelLubomyr T. RomankiwMary B. Rothwell
    • Hariklia DeligianniQiang HuangJohn P. HummelLubomyr T. RomankiwMary B. Rothwell
    • H01L23/48
    • H01L21/76879H01L21/2885Y10S205/925
    • The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures.
    • 本发明涉及通过电镀形成垂直导电结构的方法。 具体地,首先形成模板结构,其包括衬底,位于衬底表面上的离散金属接触焊盘,分立金属接触焊盘和衬底两者之间的级间电介质(ILD)层,以及金属通孔结构 延伸穿过ILD层到分立的金属接触垫上。 接下来,在模板结构中形成垂直通孔,其延伸穿过ILD层到分立的金属接触垫上。 然后通过电镀在垂直通孔中形成垂直导电结构,电镀通过通过金属通孔结构将电镀电流施加到离散的金属接触焊盘来进行。 优选地,模板结构包括多个分立的金属接触焊盘,多个金属通孔结构以及用于形成多个垂直导电结构的多个垂直通孔。