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    • 1. 发明申请
    • Thin film transistors and semiconductor constructions
    • 薄膜晶体管和半导体结构
    • US20070102705A1
    • 2007-05-10
    • US11644863
    • 2006-12-21
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • H01L29/04H01L29/786
    • H01L29/78678H01L27/1214H01L27/127H01L29/04H01L29/6675H01L29/66757H01L29/66765H01L29/78672H01L29/78675
    • A method of forming a thin film transistor relative to a substrate includes, a) providing a thin film transistor layer of polycrystalline material on a substrate, the polycrystalline material comprising grain boundaries; b) providing a fluorine containing layer adjacent the polycrystalline thin film layer; c) annealing the fluorine containing layer at a temperature and for a time period which in combination are effective to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries; and d) providing a transistor gate operatively adjacent the thin film transistor layer. The thin film transistor can be fabricated to be bottom gated or top gated. A buffering layer can be provided intermediate the thin film transistor layer and the fluorine containing layer, with the buffering layer being transmissive of fluorine from the fluorine containing layer during the annealing. Preferably, the annealing temperature is both sufficiently high to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries, but sufficiently low to prevent chemical reaction of the fluorine containing layer with the polycrystalline thin film layer.
    • 相对于衬底形成薄膜晶体管的方法包括:a)在衬底上提供多晶材料的薄膜晶体管层,所述多晶材料包括晶界; b)在多晶薄膜层附近提供含氟层; c)在一段温度和一段时间内退火含氟层,所述时间段有效地将氟从含氟层驱动到多晶薄膜层中,并且在晶界内引入氟以钝化所述晶界; 以及d)提供与所述薄膜晶体管层可操作地相邻的晶体管栅极。 薄膜晶体管可以被制造为底部门控或顶部门控。 可以在薄膜晶体管层和含氟层之间设置缓冲层,缓冲层在退火期间从含氟层透过氟。 优选地,退火温度足够高以将氟从含氟层驱动到多晶薄膜层中并且在晶界内引入氟以使所述晶界钝化,但是足够低以防止含氟层与 多晶薄膜层。
    • 3. 发明申请
    • Thin film transistors and semiconductor constructions
    • 薄膜晶体管和半导体结构
    • US20050156240A1
    • 2005-07-21
    • US11021651
    • 2004-12-22
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • Gurtej SandhuShubneesh BatraPierre Fazan
    • H01L21/336H01L21/77H01L21/84H01L29/04H01L29/786H01L21/00H01L21/8242
    • H01L29/78678H01L27/1214H01L27/127H01L29/04H01L29/6675H01L29/66757H01L29/66765H01L29/78672H01L29/78675
    • A method of forming a thin film transistor relative to a substrate includes, a) providing a thin film transistor layer of polycrystalline material on a substrate, the polycrystalline material comprising grain boundaries; b) providing a fluorine containing layer adjacent the polycrystalline thin film layer; c) annealing the fluorine containing layer at a temperature and for a time period which in combination are effective to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries; and d) providing a transistor gate operatively adjacent the thin film transistor layer. The thin film transistor can be fabricated to be bottom gated or top gated. A buffering layer can be provided intermediate the thin film transistor layer and the fluorine containing layer, with the buffering layer being transmissive of fluorine from the fluorine containing layer during the annealing. Preferably, the annealing temperature is both sufficiently high to drive fluorine from the fluorine containing layer into the polycrystalline thin film layer and incorporate fluorine within the grain boundaries to passivate said grain boundaries, but sufficiently low to prevent chemical reaction of the fluorine containing layer with the polycrystalline thin film layer.
    • 相对于衬底形成薄膜晶体管的方法包括:a)在衬底上提供多晶材料的薄膜晶体管层,所述多晶材料包括晶界; b)在多晶薄膜层附近提供含氟层; c)在一段温度和一段时间内退火含氟层,所述时间段有效地将氟从含氟层驱动到多晶薄膜层中,并且在晶界内引入氟以钝化所述晶界; 以及d)提供与所述薄膜晶体管层可操作地相邻的晶体管栅极。 薄膜晶体管可以被制造为底部门控或顶部门控。 可以在薄膜晶体管层和含氟层之间设置缓冲层,缓冲层在退火期间从含氟层透过氟。 优选地,退火温度足够高以将氟从含氟层驱动到多晶薄膜层中并且在晶界内引入氟以使所述晶界钝化,但是足够低以防止含氟层与 多晶薄膜层。
    • 4. 发明授权
    • High dielectric constant capacitor and method of manufacture
    • 高介电常数电容器及其制造方法
    • US5335138A
    • 1994-08-02
    • US17385
    • 1993-02-12
    • Gurtej SandhuPierre Fazan
    • Gurtej SandhuPierre Fazan
    • H01L21/02H01L27/108H01G1/01H01L27/00
    • H01L28/55H01L27/10808H01L28/60H01L28/75
    • A high storage capacity capacitor for a semiconductor structure includes a barrier layer formed on a polysilicon electrode, a lower electrode, a dielectric layer, and an upper electrode. The dielectric material is formed of a high dielectric constant material such as BaSrTiO.sub.3. In order to protect the barrier layer from oxidation during deposition of the dielectric layer and to provide a smooth surface geometry for depositing the dielectric layer, conducting or insulating spacers are formed on the sidewalls of the barrier layer and lower electrode. A smooth dielectric layer can thus be formed that is less susceptible to current leakage. In addition, the insulating spacers can be formed to completely fill a space between adjacent capacitors and to provide a completely planar surface.
    • 用于半导体结构的高存储容量电容器包括形成在多晶硅电极,下电极,电介质层和上电极上的阻挡层。 介电材料由高介电常数材料如BaSrTiO3形成。 为了在沉积介电层期间保护阻挡层不被氧化,并且为了沉积电介质层提供平滑的表面几何形状,在阻挡层和下电极的侧壁上形成导电或绝缘间隔物。 因此可以形成较不易受电流泄漏影响的平滑介电层。 此外,绝缘间隔物可以形成为完全填充相邻电容器之间的空间并提供完全平坦的表面。
    • 9. 发明授权
    • Methods of forming a non-volatile resistive oxide memory array
    • 形成非易失性电阻氧化物存储器阵列的方法
    • US08637113B2
    • 2014-01-28
    • US13354163
    • 2012-01-19
    • Gurtej SandhuJohn SmytheBhaskar Srinivasan
    • Gurtej SandhuJohn SmytheBhaskar Srinivasan
    • C23C18/00C23C20/00C23C28/00C23C30/00H01C17/06
    • H01L27/101H01L21/0271Y10S438/947
    • A method of forming a non-volatile resistive oxide memory array includes forming a plurality of one of conductive word lines or conductive bit lines over a substrate. Metal oxide-comprising material is formed over the plurality of said one of the word lines or bit lines. A series of elongated trenches is provided over the plurality of said one of the word lines or bit lines. A plurality of self-assembled block copolymer lines is formed within individual of the trenches in registered alignment with and between the trench sidewalls. A plurality of the other of conductive word lines or conductive bit lines is provided from said plurality of self-assembled block copolymer lines to form individually programmable junctions comprising said metal oxide-comprising material where the word lines and bit lines cross one another.
    • 形成非易失性电阻氧化物存储器阵列的方法包括在衬底上形成多个导电字线或导电位线。 含金属氧化物的材料形成在多条所述一条字线或位线中。 在多个所述一条字线或位线之间提供一系列细长的沟槽。 多个自组装嵌段共聚物线形成在沟槽中的各个内,与沟槽侧壁之间对准并且在沟槽侧壁之间形成。 从所述多个自组装嵌段共聚物线路提供多个导电字线或导电位线,以形成包含所述金属氧化物的材料的单独可编程的结,其中字线和位线彼此交叉。