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    • 2. 发明申请
    • CAPACITOR AND A METHOD OF MANUFACTURING A CAPACITOR
    • 电容器和制造电容器的方法
    • US20100237465A1
    • 2010-09-23
    • US12669733
    • 2008-07-18
    • Paul Ronald StribleyMark ParsonsGraham Chapman
    • Paul Ronald StribleyMark ParsonsGraham Chapman
    • H01L29/92H01L21/02
    • H01G4/33H01L28/40
    • A device comprises a substrate (22); a first MiM capacitor (10,20,11) disposed over the substrate; and a second MiM capacitor (10′,20′,11) disposed over the first MiM capacitor. The first MiM capacitor and the second MiM capacitor are electrically connected in parallel. The two MiM capacitors are vertically stacked one above the other.Each MiM capacitor comprises an interconnection layer (10,10′) of the CMOS process as one plate and a thinner conductive layer (11,11′) as the second plate, with an insulating layer (20,20′) disposed therebetween. This allows each MiM capacitor to be formed between two CMOS process interconnection layers.The second plate of the second MiM capacitor is substantially co-extensive with the second plate of the first MiM capacitor, and is disposed substantially directly over the second plate of the first MiM capacitor. The same mask may be used to pattern the second plate of the second MiM capacitor and the second plate of the first MiM capacitor. This minimises the number of masks required, and so minimises the mask investment cost.
    • 一种器件包括衬底(22); 设置在所述衬底上的第一MiM电容器(10,20,11) 以及设置在所述第一MiM电容器上的第二MiM电容器(10',20',11)。 第一个MiM电容器和第二个MiM电容器并联电连接。 两个MiM电容器垂直堆叠在一起。 每个MiM电容器包括作为一个板的CMOS工艺的互连层(10,10')和作为第二板的较薄的导电层(11,11'),其间设置绝缘层(20,20')。 这允许在两个CMOS工艺互连层之间形成每个MiM电容器。 第二MiM电容器的第二板与第一MiM电容器的第二板基本上共同扩展,并且基本上直接布置在第一MiM电容器的第二板上。 可以使用相同的掩模来图案化第二MiM电容器的第二板和第一MiM电容器的第二板。 这最大限度地减少了掩模所需的数量,从而最小化掩模投资成本。
    • 3. 发明申请
    • VAPOR DISPERSIBLE PLASTIC FILM WITH PAINT ADHERENCE & CLING
    • 蒸气不均匀塑料薄膜与涂料粘合
    • US20110174439A1
    • 2011-07-21
    • US13039939
    • 2011-03-03
    • Graham Chapman
    • Graham Chapman
    • B32B5/16B32B5/00B32B27/08
    • B32B27/08B05D1/322B32B7/02B32B27/32Y10T156/10Y10T428/24975Y10T428/25Y10T428/251Y10T428/258Y10T428/259Y10T428/269
    • A co-extruded plastic film comprises an outer layer formed of a high density polymer or co-polymer having a high surface energy, such as a medium molecular weight high density polyethylene that is corona treated or includes a relatively polar polymer, a core layer preferably formed of a polyolefin, which can include linear low density polyethylene or a foamed polymer preferably produced by an endothermic blowing agent, and an inner layer formed of a polymer having good cling properties that includes a filler of sufficiently large particle size and in a sufficiently large amount that vapors can escape laterally from under the film. This film allows vapors to disperse and can also be moisture absorbent and vapor permeable. The film also has the benefit that one surface has high paint adherence and the opposite surface clings to a substrate while having good lateral transmissivity of vapors.
    • 共挤塑料膜包括由具有高表面能的高密度聚合物或共聚物形成的外层,例如经电晕处理或包含相对极性的聚合物的中等分子量的高密度聚乙烯,芯层优选 由聚烯烃形成,其可以包括优选由吸热发泡剂制备的线性低密度聚乙烯或发泡聚合物,以及由具有良好粘附性的聚合物形成的内层,该内层包括足够大的粒径和足够大的填料 蒸汽量可以从电影下方横向逃脱。 该膜允许蒸气分散并且也可以是吸湿性和透气性的。 该膜还具有以下优点:一个表面具有高的涂料粘附性,并且相反的表面粘附到基底上,同时具有良好的蒸气的横向透射率。
    • 4. 发明申请
    • VAPOR DISPERSIBLE PLASTIC FILM WITH PAINT ADHERENCE & CLING
    • 蒸气不均匀塑料薄膜与涂料粘合
    • US20100003463A1
    • 2010-01-07
    • US12301413
    • 2007-03-09
    • Graham Chapman
    • Graham Chapman
    • B32B3/10B32B5/16
    • B32B5/20B32B7/02B32B27/065B32B27/08B32B27/16B32B27/20B32B27/306B32B27/32B32B2264/102B32B2264/104B32B2307/538B32B2307/724B32B2307/726B32B2605/00Y10T428/24612Y10T428/24893Y10T428/24975
    • A co-extruded plastic film comprises an outer layer formed of a high density polymer or co-polymer having a high surface energy, such as a medium molecular weight high density polyethylene that is corona treated or includes a relatively polar polymer; a core layer preferably formed of a polyolefin, which can include linear low density polyethylene or a foamed polymer preferably produced by an endothermic blowing agent; and an inner layer formed of a polymer or co-polymer having good static or physical cling properties that includes a filler of sufficiently large particle size and in a sufficiently large amount that water vapor can escape laterally from under the film. The inner layer also can include a desiccant and can be embossed. This film allows vapors to disperse and can also be moisture absorbent and vapor permeable. The film also has the benefit that one surface has high paint adherence and the opposite surface clings to a substrate, typically a painted metal or simple metal surface.
    • 共挤塑料膜包括由具有高表面能的高密度聚合物或共聚物形成的外层,例如经电晕处理或包含相对极性的聚合物的中等分子量的高密度聚乙烯; 优选由聚烯烃形成的芯层,其可以包括线性低密度聚乙烯或优选​​由吸热发泡剂制备的发泡聚合物; 以及由具有良好静态或物理粘附性质的聚合物或共聚物形成的内层,其包括足够大粒度的填料,并且足够大的量使得水蒸汽可以从膜下方横向脱离。 内层还可以包括干燥剂并且可以压花。 该膜允许蒸气分散并且也可以是吸湿性和透气性的。 该膜还具有以下优点:一个表面具有高涂料粘附性,并且相对表面粘附于基底,通常为涂漆的金属或简单的金属表面。
    • 6. 发明申请
    • VAPOR DISPERSIBLE PLASTIC FILM WITH PAINT ADHERENCE & CLING
    • 蒸气不均匀塑料薄膜与涂料粘合
    • US20130130005A1
    • 2013-05-23
    • US13737499
    • 2013-01-09
    • Graham Chapman
    • Graham Chapman
    • B32B27/08B32B7/02
    • B32B27/08B05D1/322B32B7/02B32B27/32Y10T156/10Y10T428/24975Y10T428/25Y10T428/251Y10T428/258Y10T428/259Y10T428/269
    • A co-extruded plastic film comprises an outer layer formed of a high density polymer or co-polymer having a high surface energy, such as a medium molecular weight high density polyethylene that is corona treated or includes a relatively polar polymer, a core layer preferably formed of a polyolefin, which can include linear low density polyethylene or a foamed polymer preferably produced by an endothermic blowing agent, and an inner layer formed of a polymer that includes a filler of sufficiently large particle size and in a sufficiently large amount that vapors can escape laterally from under the film. This film allows vapors to disperse and can also be moisture absorbent and vapor permeable. The film also has the benefit that one surface has high paint adherence and the opposite surface clings to a substrate while having good lateral transmissivity of vapors.
    • 共挤塑料膜包括由具有高表面能的高密度聚合物或共聚物形成的外层,例如经电晕处理或包含相对极性的聚合物的中等分子量的高密度聚乙烯,芯层优选 由聚烯烃形成,其可以包括线性低密度聚乙烯或优选​​由吸热发泡剂制成的发泡聚合物,以及由聚合物形成的内层,所述内层包括具有足够大的粒径并且足够大量的填料,所述填料的蒸气可以 从电影下方横向逃脱。 该膜允许蒸气分散并且也可以是吸湿性和透气性的。 该膜还具有以下优点:一个表面具有高的涂料粘附性,并且相反的表面粘附到基底上,同时具有良好的蒸汽横向透射率。
    • 9. 发明授权
    • Capacitor and a method of manufacturing a capacitor
    • 电容器和制造电容器的方法
    • US08378451B2
    • 2013-02-19
    • US12669733
    • 2008-07-18
    • Paul Ronald StribleyMark ParsonsGraham Chapman
    • Paul Ronald StribleyMark ParsonsGraham Chapman
    • H01L29/92
    • H01G4/33H01L28/40
    • A device comprises a substrate (22); a first MiM capacitor (10,20,11) disposed over the substrate; and a second MiM capacitor (10′,20′,11) disposed over the first MiM capacitor. The first MiM capacitor and the second MiM capacitor are electrically connected in parallel. The two MiM capacitors are vertically stacked one above the other.Each MiM capacitor comprises an interconnection layer (10,10′) of the CMOS process as one plate and a thinner conductive layer (11,11′) as the second plate, with an insulating layer (20,20′) disposed therebetween. This allows each MiM capacitor to be formed between two CMOS process interconnection layers.The second plate of the second MiM capacitor is substantially co-extensive with the second plate of the first MiM capacitor, and is disposed substantially directly over the second plate of the first MiM capacitor. The same mask may be used to pattern the second plate of the second MiM capacitor and the second plate of the first MiM capacitor. This minimizes the number of masks required, and so minimizes the mask investment cost.
    • 一种器件包括衬底(22); 设置在所述衬底上的第一MiM电容器(10,20,11) 以及设置在所述第一MiM电容器上的第二MiM电容器(10',20',11)。 第一个MiM电容器和第二个MiM电容器并联电连接。 两个MiM电容器垂直堆叠在一起。 每个MiM电容器包括作为一个板的CMOS工艺的互连层(10,10')和作为第二板的较薄的导电层(11,11'),其间设置绝缘层(20,20')。 这允许在两个CMOS工艺互连层之间形成每个MiM电容器。 第二MiM电容器的第二板与第一MiM电容器的第二板基本上共同扩展,并且基本上直接布置在第一MiM电容器的第二板上。 可以使用相同的掩模来图案化第二MiM电容器的第二板和第一MiM电容器的第二板。 这最大限度地减少了掩模所需的数量,从而最小化掩模投资成本。