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    • 3. 发明授权
    • Pulsed gas plasma-enhanced chemical vapor deposition of silicon
    • 脉冲气体等离子体增强化学气相沉积硅
    • US5242530A
    • 1993-09-07
    • US740759
    • 1991-08-05
    • John BateyJohn J. BolandGregory N. Parsons
    • John BateyJohn J. BolandGregory N. Parsons
    • C23C16/24C23C16/04C23C16/44C23C16/455C23C16/50C23C16/515C23C16/52C30B25/16C30B29/06H01L21/20H01L21/205
    • C23C16/45523C23C16/04C23C16/52H01L21/02381H01L21/02532H01L21/0262H01L21/02639
    • A substrate having silicon receptive surface areas is maintained in a plasma enhanced chemical vapor deposition (PECVD) chamber at a temperature, and under sufficient gas flow, pressure and applied energy conditions to form a gas plasma. The gas plasma is typically made up of hydrogen, but may be made up of mixtures of hydrogen with other gasses. A discontinuous flow of silane gas of predetermined duration and predetermined time spacing is introduced to produce at least one timed pulse of silane gas containing plasma, whereby a thin layer of silicon is deposited on the receptive areas of the substrate. The thin layer of silicon is exposed to the hydrogen gas plasma between the brief deposition time cycles and may result in the modification of the silicon layer by the hydrogen plasma. The surface modification may include at least one of etching, surface hydrogenation, surface bond reconstruction, bond strain relaxation, and crystallization, and serves the purpose of improving the silicon film for use in, for example, electronic devices. Repeated time pulses of silane gas and subsequent hydrogen plasma exposure cycles can result in selective deposition of silicon on predetermined receptive areas of a patterned substrate. Selective deposition of silicon can serve the purpose of simplifying electronic device manufacturing, such as, for example, the fabrication of amorphous silicon thin film transistors with low contact resistance in a single PECVD pump-down procedure.
    • 具有硅接受表面积的衬底在等离子体增强化学气相沉积(PECVD)室中保持在温度和足够的气体流量,压力和施加的能量条件下以形成气体等离子体。 气体等离子体通常由氢组成,但也可由氢与其它气体的混合物组成。 引入具有预定持续时间和预定时间间隔的不连续的硅烷气流,以产生至少一个含有等离子体的硅烷气体的定时脉冲,由此在衬底的接收区域上沉积薄层硅。 硅薄层在短暂的沉积时间周期之间暴露于氢气等离子体,可能导致氢等离子体对硅层的修饰。 表面改性可以包括蚀刻,表面氢化,表面键重建,键合应变松弛和结晶中的至少一种,并且用于改进用于例如电子器件的硅膜的目的。 硅烷气体的重复时间脉冲和随后的氢等离子体暴露周期可导致硅在图案化衬底的预定接收区域上的选择性沉积。 硅的选择性沉积可以用于简化电子器件制造的目的,例如在单个PECVD抽真空方法中制造具有低接触电阻的非晶硅薄膜晶体管。