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    • 4. 发明授权
    • High density multi-lead surface mount interconnect and devices including same
    • 高密度多引线表面贴装互连和包括其的器件
    • US07059867B1
    • 2006-06-13
    • US11094582
    • 2005-03-30
    • Bernard C. McDermottDermot O. Dobbyn
    • Bernard C. McDermottDermot O. Dobbyn
    • H01R12/00
    • H01R12/57H01R12/52
    • A multi-lead surface mount interconnect. The interconnect includes a carrier, a first lead connected to the carrier, and a second lead connected to the carrier. The carrier defines a first receiving area and a second receiving area. The first lead includes a first planar surface for connection to a first printed circuit board and a second planar surface for connection to a second printed circuit board. The first planar surface is opposite the second planar surface. The second lead includes a third planar surface for connection to the first printed circuit board and a fourth planar surface for connection to the second printed circuit board. The third planar surface is opposite the fourth planar surface. The first planar surface is coplanar with the third planar surface. The second planar surface is coplanar with the fourth planar surface.
    • 多引脚表面贴装互连。 互连包括载体,连接到载体的第一引线和连接到载体的第二引线。 载体定义第一接收区域和第二接收区域。 第一引线包括用于连接到第一印刷电路板的第一平面表面和用于连接到第二印刷电路板的第二平面。 第一平面与第二平面相对。 第二引线包括用于连接到第一印刷电路板的第三平面表面和用于连接到第二印刷电路板的第四平面。 第三平面与第四平面相对。 第一平面与第三平表面共平面。 第二平面与第四平表面共平面。