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    • 10. 发明授权
    • Methods and apparatus for modular computer construction
    • 模块化计算机构建方法与装置
    • US5349132A
    • 1994-09-20
    • US14983
    • 1993-02-08
    • Wayne H. MillerBradley C. HelmWayman M. LeeBraxton L. LathropJimmy A. MeltonRobert D. Chapman
    • Wayne H. MillerBradley C. HelmWayman M. LeeBraxton L. LathropJimmy A. MeltonRobert D. Chapman
    • G06F1/16G06F1/18G06F1/20H05K9/00
    • G06F1/181G06F1/182G06F1/20
    • A modular enclosure for personal computer systems, and methods for assembly of an enclosure. The enclosure substantially comprises a base, a unitary internal frame, a front and a back panel, and a U-shaped top cover. Frame-mounting snaps and cruciform members located on forward and rear portions of the frame mate to complimentary receiving openings in the base. Front and rear panels are mounted to the base, frame, and top cover by a plurality of panel-mounting snaps and hooks. A base electromagnetic interference (EMI) shield at the periphery of the shield having a plurality of planar tabbed fingers with hemispherical domes formed therein is then fitted and secured to the base such that the lateral edges of the fingers are recessed below a peripherally extending rim on the base. Thereafter, the internal frame is snapped into place upon the base, and a rear panel having an EMI shield fitted and secured to the base and frame by panel-mounting snaps and hooks. A front panel having a front EMI shield is then mounted and secured to the top cover. The top cover assembly is then lowered onto the base-frame assembly and slideably moved rearward until the rear edges of the top cover assembly contact a plurality of contact fingers formed in the rear EMI shield, the top cover assembly resting upon on the domes of the base EMI shield.
    • 用于个人计算机系统的模块化外壳以及用于组装外壳的方法。 外壳基本上包括基座,整体内部框架,前面板和后面板以及U形顶盖。 位于框架的前部和后部的框架安装卡扣和十字形构件配合到基座中的互补的接收开口。 前面板和后面板通过多个面板安装的卡扣和钩子安装到基座,框架和顶盖上。 屏蔽体周围的基本电磁干扰(EMI)屏蔽件具有形成在其中的具有半球形圆顶的多个平面片状指状物,然后被装配并固定到基座,使得指状物的侧边缘在周边延伸的边缘下凹下 的基地。 此后,内部框架卡扣在基座上的适当位置,并且具有EMI屏蔽的后面板通过面板安装卡扣和钩子装配并固定到基座和框架。 然后将具有前EMI屏蔽的前面板安装并固定到顶盖。 顶盖组件然后下降到基架组件上并可向后滑动,直到顶盖组件的后边缘接触形成在后EMI屏蔽件中的多个接触指尖,顶盖组件搁置在顶盖组件的圆顶上 基础EMI屏蔽。