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1. 发明申请

US20090102040A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20090102040A1
公开(公告)日：2009-04-23
申请号：US11874538
申请日：2007-10-18
申请人： Benedikt Specht , Gottfried Ferber
发明人： Benedikt Specht , Gottfried Ferber
IPC分类号： H01L23/043
CPC分类号： H01L23/043 , H01L21/4817 , H01L23/10 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48747 , H01L2224/48847 , H01L2224/73265 , H01L2224/83801 , H01L2224/85447 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/16151 , H01L2924/16195 , H01L2924/16315 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.
摘要翻译：一种装置包括具有多个限制元件和至少一个支撑元件的壳体。盖子由多个限制元件和至少一个支撑装置弹性变形。至少一个承载至少一个半导体芯片的基板设置在壳体内。

2. 发明授权

US07944033B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US07944033B2
公开(公告)日：2011-05-17
申请号：US11874538
申请日：2007-10-18
申请人： Benedikt Specht , Gottfried Ferber
发明人： Benedikt Specht , Gottfried Ferber
IPC分类号： H01L23/02 , H01L23/48 , H01R13/403
CPC分类号： H01L23/043 , H01L21/4817 , H01L23/10 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48747 , H01L2224/48847 , H01L2224/73265 , H01L2224/83801 , H01L2224/85447 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/16151 , H01L2924/16195 , H01L2924/16315 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An apparatus includes a housing with a plurality of restraining elements and at least one supporting element. A cover is elastically deformed by the plurality of restraining elements and the at least one supporting means. At least one substrate carrying at least one semiconductor chip is provided within the housing.
摘要翻译：一种装置包括具有多个限制元件和至少一个支撑元件的壳体。盖子由多个限制元件和至少一个支撑装置弹性变形。至少一个承载至少一个半导体芯片的基板设置在壳体内。

3. 发明申请

US20060272797A1 Cooling device for an electric component 审中-公开
标题翻译：电气部件冷却装置
公开(公告)号：US20060272797A1
公开(公告)日：2006-12-07
申请号：US11435530
申请日：2006-05-17
申请人： Gottfried Ferber , Benedikt Specht
发明人： Gottfried Ferber , Benedikt Specht
IPC分类号： F28F7/00
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A cooling device has a cooling element (3) and a pressing device (4) which presses the component (1) against the cooling element (3). The pressing device (4) is resilient and is connected to the cooling element in a positive fit in order to produce fixing means which fix the component (1) to the cooling element in a reliable manner, the fixing means being easy to produce and compact.
摘要翻译：冷却装置具有冷却元件（3）和将部件（1）压靠在冷却元件（3）上的按压装置（4）。按压装置（4）是弹性的并以正配合连接到冷却元件，以便产生固定装置，该固定装置以可靠的方式将部件（1）固定到冷却元件上，固定装置易于制造和紧凑。

4. 发明授权

US07851267B2 Power semiconductor module method 有权
标题翻译：功率半导体模块方法
公开(公告)号：US07851267B2
公开(公告)日：2010-12-14
申请号：US11874550
申请日：2007-10-18
申请人： Benedikt Specht , Gottfried Ferber
发明人： Benedikt Specht , Gottfried Ferber
IPC分类号： H01L21/00
CPC分类号： H01L21/4817 , H01L23/043 , H01L23/10 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48747 , H01L2224/48847 , H01L2224/73265 , H01L2224/83192 , H01L2224/83801 , H01L2224/85447 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12032 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/16151 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.
摘要翻译：一种用于组装功率模块的方法包括：提供具有多个接收元件的壳体。至少一个承载至少一个半导体芯片的基板设置在壳体内。提供至少一个支撑元件。弹性应力盖布置在所述至少一个支撑元件上，并且所述盖被释放，使得所述弹性应力盖被所述至少一个支撑元件和所述多个接收元件约束。

5. 发明申请

US20090104734A1 POWER SEMICONDUCTOR MODULE METHOD 有权
标题翻译：功率半导体模块方法
公开(公告)号：US20090104734A1
公开(公告)日：2009-04-23
申请号：US11874550
申请日：2007-10-18
申请人： Benedikt Specht , Gottfried Ferber
发明人： Benedikt Specht , Gottfried Ferber
IPC分类号： H01L21/60
CPC分类号： H01L21/4817 , H01L23/043 , H01L23/10 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48747 , H01L2224/48847 , H01L2224/73265 , H01L2224/83192 , H01L2224/83801 , H01L2224/85447 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12032 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/16151 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.
摘要翻译：一种用于组装功率模块的方法包括：提供具有多个接收元件的壳体。至少一个承载至少一个半导体芯片的基板设置在壳体内。提供至少一个支撑元件。弹性应力盖布置在所述至少一个支撑元件上，并且所述盖被释放，使得所述弹性应力盖被所述至少一个支撑元件和所述多个接收元件约束。

6. 发明申请

US20060226531A1 Power semiconductor module 审中-公开
标题翻译：功率半导体模块
公开(公告)号：US20060226531A1
公开(公告)日：2006-10-12
申请号：US11329571
申请日：2006-01-11
申请人： Thomas Passe , Gottfried Ferber , Benedikt Specht
发明人： Thomas Passe , Gottfried Ferber , Benedikt Specht
IPC分类号： H01L23/52
CPC分类号： H01L23/49861 , H01L24/49 , H01L25/16 , H01L2224/0603 , H01L2224/4903 , H01L2224/49171 , H01L2924/00014 , H01L2924/13055 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H05K1/0306 , H05K3/4092 , H05K2201/0397 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A semiconductor power module has a support (1), whereon are formed conductor strips (5, 6, 7, 8) by applying a structure on an electrically conductive layer (3) applied on one side (2) of the support. A semiconductor power module can be manufactured easily and economically enabling several mounting technologies by using a homogeneous base support. Therefore, the conductor strips (5, 6, 7, 8), as integral elements of the conductor circuit have loose ends (6a, 7a, 8a) detached from the side (2) of the support, the ends of the conductor strips extending outside the support (1) and forming external connections.
摘要翻译：半导体功率模块具有通过在施加在支撑体的一侧（2）上的导电层（3）上施加结构而形成导体条（5,6,7,8）的支撑件（1）。半导体功率模块可以容易且经济地制造，通过使用均匀的基座支撑来实现多种安装技术。因此，作为导体电路的整体元件的导体条（5,6,7,8）具有从支撑件的侧面（2）分离的松散端部（6a，7a，8a），导体条延伸到支撑件（1）外部并形成外部连接。

7. 发明授权

US08656666B2 Tool holder and plate assembly and method for producing tool holder and plate assembly 有权
标题翻译：刀架和板组件及其制造方法
公开(公告)号：US08656666B2
公开(公告)日：2014-02-25
申请号：US12955245
申请日：2010-11-29
申请人： Martin Schulte , Benedikt Specht
发明人： Martin Schulte , Benedikt Specht
IPC分类号： E06B3/00 , E06B1/68 , B60J10/02
CPC分类号： E06B1/68 , B60J10/265 , B60J10/30 , B60J10/70
摘要： The invention relates to a clamping holder as well as to a pane assembly comprising such a clamping holder and to a method for producing such a pane assembly. Pane assemblies, which are injection molded on the edge side by a frame section, are known in the state of the art. In response to the production of the pane assembly, a retaining strip, which is embedded into the frame section through this after the injection molding process, is furthermore inserted into the injection molding tool. A retaining clamp, by means of which trim can be attached to the pane assembly in a clamping manner, must be attached to the retaining strip after the completion of the pane assembly. To avoid the requirement of subsequently attaching a retaining clamp, provision is made for a clamping holder comprising a connecting section and a clamp section, which is embodied such that connecting section and clamp section can together be inserted into an injection molding tool.
摘要翻译：本发明涉及一种夹持夹具以及包括这种夹持夹具的窗格组件以及用于生产这种窗格组件的方法。在边缘侧由框架部分注射成型的叶片组件在现有技术中是已知的。响应于玻璃板组件的生产，在注射成型工艺之后通过其嵌入框架部分中的保持条进一步插入到注射成型工具中。通过该夹具可以以夹紧方式连接到窗格组件上，在夹板完成后，必须将固定夹固定在保持条上。为了避免随后附接固定夹具的要求，提供一种包括连接部分和夹紧部分的夹持夹持件，其实现为使得连接部分和夹紧部分可以一起插入注射模制工具中。

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