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1. 发明申请

US20120123611A1 SYSTEM FOR IDENTIFYING THE COMPONENTS OF A VEHICLE 有权
标题翻译：识别车辆部件的系统
公开(公告)号：US20120123611A1
公开(公告)日：2012-05-17
申请号：US13232604
申请日：2011-09-14
申请人： Giuseppe Grasso , Viviana Oliva , Davide Giuseppe Patti
发明人： Giuseppe Grasso , Viviana Oliva , Davide Giuseppe Patti
IPC分类号： G06F7/00
CPC分类号： B60R25/00
摘要： A system for identifying a plurality of components of a vehicle that includes a plurality of non-volatile memories for storing identifiers associated with the plurality of vehicle components, a controller of the plurality of the vehicle components, a communication network configured for connecting the controller to the plurality of memories, and an identifiers memory including a portion to store a list of a plurality of type-approved identifiers associated with the plurality of type-approved vehicle components. The controller receives the identifiers, reads from the portion of the identifiers memory the list of type-approved identifiers, and checks if the identifiers of the plurality of components are included in the list of the type-approved identifiers, and when the controller detects that an identifier associated with a component out of the plurality of components is not included in the list, the controller blocks operation of the component.
摘要翻译：一种用于识别车辆的多个部件的系统，包括用于存储与所述多个车辆部件相关联的标识符的多个非易失性存储器，所述多个车辆部件的控制器，被配置为将所述控制器连接到所述多个存储器以及标识符存储器，其包括用于存储与所述多个型式认可的车辆部件相关联的多个型式认可标识符的列表的部分。控制器接收标识符，从标识符的一部分读取类型认可标识符的列表，并检查多个组件的标识符是否包括在类型认可的标识符的列表中，并且当控制器检测到与多个组件中的组件相关联的标识符不包括在列表中，控制器阻止组件的操作。

2. 发明授权

US09002534B2 System for identifying the components of a vehicle 有权
标题翻译：用于识别车辆部件的系统
公开(公告)号：US09002534B2
公开(公告)日：2015-04-07
申请号：US13232604
申请日：2011-09-14
申请人： Davide Giuseppe Patti , Viviana Oliva
发明人： Giuseppe Grasso , Davide Giuseppe Patti
IPC分类号： G06F21/00 , B60R25/00
CPC分类号： B60R25/00
摘要： A system for identifying a plurality of components of a vehicle that includes a plurality of non-volatile memories for storing identifiers associated with the plurality of vehicle components, a controller of the plurality of the vehicle components, a communication network configured for connecting the controller to the plurality of memories, and an identifiers memory including a portion to store a list of a plurality of type-approved identifiers associated with the plurality of type-approved vehicle components. The controller receives the identifiers, reads from the portion of the identifiers memory the list of type-approved identifiers, and checks if the identifiers of the plurality of components are included in the list of the type-approved identifiers, and when the controller detects that an identifier associated with a component out of the plurality of components is not included in the list, the controller blocks operation of the component.
摘要翻译：一种用于识别车辆的多个部件的系统，包括用于存储与所述多个车辆部件相关联的标识符的多个非易失性存储器，所述多个车辆部件的控制器，被配置为将所述控制器连接到所述多个存储器以及标识符存储器，其包括用于存储与所述多个型式认可的车辆部件相关联的多个型式认可标识符的列表的部分。控制器接收标识符，从标识符的一部分读取类型认可标识符的列表，并检查多个组件的标识符是否包括在类型认可的标识符的列表中，并且当控制器检测到与多个组件中的组件相关联的标识符不包括在列表中，控制器阻止组件的操作。

3. 发明授权

US08878594B2 IGBT device with buried emitter regions 有权
标题翻译：具有埋地发射极区域的IGBT器件
公开(公告)号：US08878594B2
公开(公告)日：2014-11-04
申请号：US13300010
申请日：2011-11-18
申请人： Davide Giuseppe Patti
发明人： Davide Giuseppe Patti
IPC分类号： H01L29/739 , H03K17/12 , H03K17/16 , H01L29/08
CPC分类号： H01L29/7395 , H01L29/0804 , H01L29/0834 , H01L29/1095 , H01L29/66333
摘要： An embodiment of an IGBT device is integrated in a chip of semiconductor material including a substrate of a first type of conductivity, an active layer of a second type of conductivity formed on an inner surface of the substrate, a body region of the first type of conductivity extending within the active layer from a front surface thereof opposite the inner surface, a source region of the second type of conductivity extending within the body region from the front surface, a channel region being defined within the body region between the source region and the active layer, a gate element insulated from the front surface extending over the channel region, a collector terminal contacting the substrate on a rear surface thereof opposite the inner surface, an emitter terminal contacting the source region and the body region on the front surface, and a gate terminal contacting the gate element.
摘要翻译： IGBT器件的实施例集成在半导体材料的芯片中，该半导体材料的芯片包括第一导电类型的衬底，形成在衬底的内表面上的第二类导电性的有源层，第一类型的主体区域在活性层内从与内表面相反的前表面延伸的导电性，第二类型的导电源的源区从前表面延伸到体区内，沟道区被限定在源区与源区之间活性层，与在沟道区域上延伸的前表面绝缘的栅极元件，在与内表面相反的后表面上接触衬底的集电极端子，与源极区域和前表面上的体区域接触的发射极端子，以及栅极端子接触栅极元件。

4. 发明授权

US08803145B2 Bond pad monitoring structure and related method of detecting significant alterations 有权
标题翻译：债券垫监测结构及相关检测方法的重大变更
公开(公告)号：US08803145B2
公开(公告)日：2014-08-12
申请号：US13599271
申请日：2012-08-30
申请人： Davide Giuseppe Patti , Manuela Larosa
发明人： Davide Giuseppe Patti , Manuela Larosa
IPC分类号： H01L29/10
CPC分类号： H01L22/34 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05093 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/48599 , H01L2924/00014 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A passive bond pad condition sense structure may be configured to be electrically stimulated and tested for detecting an anomalous or altered electrical characteristic caused by stress or aging of the bond pad capacitively coupled to it. The related bond pad condition testing or monitoring system may include relatively simple stimulating and sensing circuits that may be wholly embedded in the integrated circuit device.
摘要翻译：无源接合焊盘状态检测结构可以被配置为电刺激和测试，以检测由与其电容耦合的接合焊盘的应力或老化引起的异常或改变的电特性。相关的焊盘条件测试或监视系统可以包括可以完全嵌入在集成电路器件中的相对简单的刺激和感测电路。

5. 发明授权

US08459554B2 Large area monitoring device 有权
标题翻译：大面积监控设备
公开(公告)号：US08459554B2
公开(公告)日：2013-06-11
申请号：US13240606
申请日：2011-09-22
申请人： Manuela La Rosa , Davide Giuseppe Patti
发明人： Manuela La Rosa , Davide Giuseppe Patti
IPC分类号： G06K7/00
CPC分类号： G06K19/07749 , G06K19/0723 , Y10T29/49018
摘要： A monitoring device may include a core cell including a detection circuit, and a radio frequency (RF) tag antenna configured to exchange data with a data acquisition reader device, and a single-tier corolla having sensor cells around the core cell and covering a monitoring area. The sensor cells may be configured to convert a change of a parameter at the cell location. The detection circuit may be configured to detect a change in the parameter and location based upon excitation by the reader device.
摘要翻译：监视装置可以包括核心小区，其包括检测电路，以及被配置为与数据采集读取装置交换数据的射频（RF）标签天线，以及在核心小区周围具有传感器单元并覆盖监视的单层花冠区。传感器单元可以被配置为转换单元位置处的参数的改变。检测电路可以被配置为基于读取器装置的激励来检测参数和位置的变化。

6. 发明申请

US20120132711A1 LARGE AREA MONITORING DEVICE 有权
标题翻译：大面积监测装置
公开(公告)号：US20120132711A1
公开(公告)日：2012-05-31
申请号：US13240606
申请日：2011-09-22
申请人： Manuela LA ROSA , Davide Giuseppe Patti
发明人： Manuela LA ROSA , Davide Giuseppe Patti
IPC分类号： G06K7/00 , H01P11/00
CPC分类号： G06K19/07749 , G06K19/0723 , Y10T29/49018
摘要： A monitoring device may include a core cell including a detection circuit, and a radio frequency (RF) tag antenna configured to exchange data with a data acquisition reader device, and a single-tier corolla having sensor cells around the core cell and covering a monitoring area. The sensor cells may be configured to convert a change of a parameter at the cell location. The detection circuit may be configured to detect a change in the parameter and location based upon excitation by the reader device.
摘要翻译：监视装置可以包括核心小区，其包括检测电路，以及被配置为与数据采集读取装置交换数据的射频（RF）标签天线，以及在核心小区周围具有传感器单元并覆盖监视的单层花冠区。传感器单元可以被配置为转换单元位置处的参数的改变。检测电路可以被配置为基于读取器装置的激励来检测参数和位置的变化。

7. 发明申请

US20130048982A1 BOND PAD MONITORING STRUCTURE AND RELATED METHOD OF DETECTING SIGNIFICANT ALTERATIONS 有权
标题翻译： BOND PAD监测结构及相关方法检测重要变更
公开(公告)号：US20130048982A1
公开(公告)日：2013-02-28
申请号：US13599271
申请日：2012-08-30
申请人： Davide Giuseppe Patti , Manuela Larosa
发明人： Davide Giuseppe Patti , Manuela Larosa
IPC分类号： H01L23/544 , H01L21/28 , H01L23/48
CPC分类号： H01L22/34 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05093 , H01L2224/45144 , H01L2224/48453 , H01L2224/48463 , H01L2224/48599 , H01L2924/00014 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A passive bond pad condition sense structure may be configured to be electrically stimulated and tested for detecting an anomalous or altered electrical characteristic caused by stress or aging of the bond pad capacitively coupled to it. The related bond pad condition testing or monitoring system may include relatively simple stimulating and sensing circuits that may be wholly embedded in the integrated circuit device.
摘要翻译：无源接合焊盘状态检测结构可以被配置为电刺激和测试，以检测由与其电容耦合的接合焊盘的应力或老化引起的异常或改变的电特性。相关的焊盘条件测试或监视系统可以包括可以完全嵌入在集成电路器件中的相对简单的刺激和感测电路。

8. 发明授权

US08878366B2 Contact pad 有权
标题翻译：接触垫
公开(公告)号：US08878366B2
公开(公告)日：2014-11-04
申请号：US13543992
申请日：2012-07-09
申请人： Davide Giuseppe Patti
发明人： Davide Giuseppe Patti
IPC分类号： H01L29/72 , H01L23/00 , H01L29/417 , H01L29/45 , H01L29/66 , H01L29/78
CPC分类号： H01L24/05 , H01L24/03 , H01L24/45 , H01L24/48 , H01L29/41741 , H01L29/456 , H01L29/66712 , H01L29/7802 , H01L2224/04042 , H01L2224/05166 , H01L2224/05184 , H01L2224/05556 , H01L2224/05624 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48463 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/00 , H01L2224/05599
摘要： A contact pad for an electronic device integrated in a semiconductor material chip is formed from a succession of protruding elements. Each protruding element extends transversally to a main surface of the chip and has a rounded terminal portion. Adjacent pairs protruding elements define an opening which is partially filled with a first conductive material to form a contact structure that is in electrical contact with an integrated electronic device formed in the chip. A layer of a second conductive material is deposited to cover said protruding elements and the contact structures so as to form the contact pad.
摘要翻译：集成在半导体材料芯片中的用于电子设备的接触焊盘由一系列突出元件形成。每个突出元件横向延伸到芯片的主表面并且具有圆形的端子部分。相邻的对突出元件限定开口，其部分地填充有第一导电材料，以形成与形成在芯片中的集成电子器件电接触的接触结构。沉积第二导电材料层以覆盖所述突出元件和接触结构以形成接触垫。

9. 发明申请

US20120217655A1 ELECTRONIC DEVICE FOR HIGH POWER APPLICATIONS 有权
标题翻译：用于大功率应用的电子设备
公开(公告)号：US20120217655A1
公开(公告)日：2012-08-30
申请号：US13369803
申请日：2012-02-09
申请人： Davide Giuseppe Patti , Agatino Minotti
发明人： Davide Giuseppe Patti , Agatino Minotti
IPC分类号： H01L23/52
CPC分类号： H01L23/49575 , H01L23/49562 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05554 , H01L2224/32245 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/8485 , H01L2924/00014 , H01L2924/10161 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： An electronic device includes a first semi-conductor die, a second semi-conductor die and an electrically conductive element. The electrically conductive element includes a first electrically conductive part interposed at least partially between the first semi-conductor die and the second semi-conductor die, wherein said first part is electrically coupled to the first semi-conductor die. The electrically conductive element further includes a second electrically conductive part electrically coupled to the first part, wherein said second part extends from at least part of the first part. The first part is an electrically conductive strap between the dice, and the second part is clip extending from at least part of the strap.
摘要翻译：电子设备包括第一半导体裸片，第二半导体裸片和导电元件。导电元件包括至少部分插入在第一半导体管芯和第二半导体管芯之间的第一导电部件，其中所述第一部件电耦合到第一半导体管芯。导电元件还包括电耦合到第一部分的第二导电部分，其中所述第二部分从第一部分的至少一部分延伸。第一部分是在骰子之间的导电带，并且第二部分是从至少一部分带延伸的夹子。

10. 发明授权

US09145294B2 Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof 有权
标题翻译：包括基于纳米管的界面连接层的电子装置及其制造方法
公开(公告)号：US09145294B2
公开(公告)日：2015-09-29
申请号：US13170908
申请日：2011-06-28
申请人： Davide Giuseppe Patti , Alessandro Mascali
发明人： Davide Giuseppe Patti , Alessandro Mascali
IPC分类号： H01L21/44 , B82Y10/00 , B82Y30/00 , F28D11/00 , F28F21/02 , H01L23/36 , H01L23/373 , H01L23/48 , H01L23/495 , H01L23/00
CPC分类号： B82Y10/00 , B82Y30/00 , F28D11/00 , F28F21/02 , F28F2255/20 , H01L23/36 , H01L23/373 , H01L23/48 , H01L23/49513 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/11 , H01L2224/13078 , H01L2224/1319 , H01L2224/13193 , H01L2224/1403 , H01L2224/14505 , H01L2224/16105 , H01L2224/16145 , H01L2224/29078 , H01L2224/29193 , H01L2224/32245 , H01L2224/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2224/81345 , H01L2224/81385 , H01L2224/81897 , H01L2224/83191 , H01L2224/83193 , H01L2224/83365 , H01L2224/83385 , H01L2224/838 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An electronic device including a first region belonging to a semiconductor device having a first surface; a second region having a second surface; and an adhesion layer, set between the first and second regions, including first fibrils each having respective first and second ends. The first fibrils extend between the first and second surfaces and are fixed in a chemico-physical way to the first and second surfaces at the respective first and second ends.
摘要翻译：一种电子设备，包括属于具有第一表面的半导体器件的第一区域; 具有第二表面的第二区域; 以及设置在第一和第二区域之间的粘合层，包括第一原纤维，每个具有相应的第一和第二末端。第一原纤维在第一表面和第二表面之间延伸，并且以化学物理方式固定到相应的第一和第二端处的第一和第二表面。

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