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1. 发明授权

US06443179B1 Packaging of electro-microfluidic devices 有权
标题翻译：电微流体装置的包装
公开(公告)号：US06443179B1
公开(公告)日：2002-09-03
申请号：US09790423
申请日：2001-02-21
申请人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , Robert D. Watson
发明人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , Robert D. Watson
IPC分类号： F16K2700
CPC分类号： F16K99/0001 , B01L3/502707 , B01L2200/021 , B01L2300/0636 , B01L2300/0867 , B01L2300/0874 , B01L2300/0887 , F15C5/00 , F16K99/0042 , F16K2099/0074 , F16K2099/0076 , F16K2099/008 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/8592 , H01L2924/01004 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , Y10T137/7504 , Y10T137/87249 , H01L2924/00014 , H01L2924/00
摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译：提出了一种用于包装表面微加工电微流体装置的新架构。这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。该架构模拟和利用电子封装技术。较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。电连接到MIC前面的接合焊盘。

2. 发明授权

US06821819B1 Method of packaging and assembling micro-fluidic device 有权
标题翻译：包装和组装微流体装置的方法
公开(公告)号：US06821819B1
公开(公告)日：2004-11-23
申请号：US10370543
申请日：2003-02-20
申请人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
发明人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
IPC分类号： H01L2144
CPC分类号： H01L23/4334 , H01L23/473 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , Y10T137/87153 , Y10T137/87249 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译：提出了一种用于包装表面微加工电微流体装置的新架构。这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。该架构模拟和利用电子封装技术。较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。电连接到MIC前面的接合焊盘。

3. 发明授权

US06548895B1 Packaging of electro-microfluidic devices 有权
标题翻译：电微流体装置的包装方法
公开(公告)号：US06548895B1
公开(公告)日：2003-04-15
申请号：US09790305
申请日：2001-02-21
申请人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
发明人： Gilbert L. Benavides , Paul C. Galambos , John A. Emerson , Kenneth A. Peterson , Rachel K. Giunta , David Lee Zamora , Robert D. Watson
IPC分类号： H01L2348
CPC分类号： H01L23/4334 , H01L23/473 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/04941 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15173 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , Y10T137/87153 , Y10T137/87249 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging technology. The larger package consists of a circuit board with embedded fluidic channels and standard fluidic connectors (e.g. Fluidic Printed Wiring Board). The embedded channels connect to the smaller package, an Electro-Microfluidic Dual-Inline-Package (EMDIP) that takes fluid to the microfluidic integrated circuit (MIC). The fluidic connection is made to the back of the MIC through Bosch-etched holes that take fluid to surface micromachined channels on the front of the MIC. Electrical connection is made to bond pads on the front of the MIC.
摘要翻译：提出了一种用于包装表面微加工电微流体装置的新架构。这种架构依赖于两个尺寸的包装，从宏观尺度（微升）将流体带入设备规模（皮升）。该架构模拟和利用电子封装技术。较大的封装由具有嵌入式流体通道的电路板和标准流体连接器（例如Fluidic Printed Wiring Board）组成。嵌入式通道连接到较小的封装，即将微流体集成电路（MIC）引入流体的电 - 微流体双列直插封装（EMDIP）。通过博世蚀刻的孔将流体连接制成MIC的背面，该孔将流体接收到MIC前面的表面微加工通道。电连接到MIC前面的接合焊盘。

4. 发明授权

US07004198B1 Micro-fluidic interconnect 有权
标题翻译：微流体互连
公开(公告)号：US07004198B1
公开(公告)日：2006-02-28
申请号：US10894636
申请日：2004-07-20
申请人： Murat Okandan , Paul C. Galambos , Gilbert L. Benavides , Dale L. Hetherington
发明人： Murat Okandan , Paul C. Galambos , Gilbert L. Benavides , Dale L. Hetherington
IPC分类号： F16K37/00
CPC分类号： B01L3/565 , B01J2219/00783 , B01J2219/0081 , B01J2219/00828 , B01L3/5027 , B01L9/527 , B01L2200/027 , B01L2300/0816 , Y10T137/2191 , Y10T137/2224 , Y10T137/8242
摘要： An apparatus for simultaneously aligning and interconnecting microfluidic ports is presented. Such interconnections are required to utilize microfluidic devices fabricated in Micro-Electromechanical-Systems (MEMS) technologies, that have multiple fluidic access ports (e.g. 100 micron diameter) within a small footprint, (e.g. 3 mm×6 mm). Fanout of the small ports of a microfluidic device to a larger diameter (e.g. 500 microns) facilitates packaging and interconnection of the microfluidic device to printed wiring boards, electronics packages, fluidic manifolds etc.
摘要翻译：提出了一种用于同时对准和互连微流体端口的装置。需要这种互连来利用在微机电系统（MEMS）技术中制造的微流体装置，其在小占地面积内（例如3mm×6mm）具有多个流体通路口（例如100微米直径）。微流体装置的小端口到较大直径（例如500微米）的扇出促进微流体装置与印刷线路板，电子封装，流体歧管等的封装和互连。

5. 发明授权

US06886916B1 Piston-driven fluid-ejection apparatus 失效
标题翻译：活塞驱动的流体喷射装置
公开(公告)号：US06886916B1
公开(公告)日：2005-05-03
申请号：US10600008
申请日：2003-06-18
申请人： Paul C. Galambos , Gilbert L. Benavides , Bernhard Jokiel, Jr. , Jerome F. Jakubczak II
发明人： Paul C. Galambos , Gilbert L. Benavides , Bernhard Jokiel, Jr. , Jerome F. Jakubczak II
IPC分类号： B41J2/14 , B41J2/04
CPC分类号： B41J2/14314
摘要： A surface-micromachined fluid-ejection apparatus is disclosed which utilizes a piston to provide for the ejection of jets or drops of a fluid (e.g. for ink-jet printing). The piston, which is located at least partially inside a fluid reservoir, is moveable into a cylindrical fluid-ejection chamber connected to the reservoir by a microelectromechanical (MEM) actuator which is located outside the reservoir. In this way, the reservoir and fluid-ejection chamber can be maintained as electric-field-free regions thereby allowing the apparatus to be used with fluids that are electrically conductive or which may react or break down in the presence of a high electric field. The MEM actuator can comprise either an electrostatic actuator or a thermal actuator.
摘要翻译：公开了一种表面微机械流体喷射装置，其利用活塞来提供喷射或液滴的喷射（例如用于喷墨打印）。至少部分地位于流体储存器内部的活塞可通过位于储存器外部的微机电（MEM）致动器移动到连接到储存器的圆柱形流体排出室中。以这种方式，储存器和流体喷射室可以保持为无电场区域，从而允许该装置与导电的流体一起使用或者可能在存在高电场的情况下反应或分解。 MEM致动器可以包括静电致动器或热致动器。

6. 发明申请

US20130020492A1 ION CHAMBER BASED NEUTRON DETECTORS 有权
标题翻译：基于离子室的中子探测器
公开(公告)号：US20130020492A1
公开(公告)日：2013-01-24
申请号：US13559370
申请日：2012-07-26
申请人： Mark S. Derzon , Paul C. Galambos , Ronald F. Renzi
发明人： Mark S. Derzon , Paul C. Galambos , Ronald F. Renzi
IPC分类号： G01T3/00
CPC分类号： G01T3/008 , G01T3/00 , H01J47/02
摘要： A neutron detector with monolithically integrated readout circuitry, including: a bonded semiconductor die; an ion chamber formed in the bonded semiconductor die; a first electrode and a second electrode formed in the ion chamber; a neutron absorbing material filling the ion chamber; and the readout circuitry which is electrically coupled to the first and second electrodes. The bonded semiconductor die includes an etched semiconductor substrate bonded to an active semiconductor substrate. The readout circuitry is formed in a portion of the active semiconductor substrate. The ion chamber has a substantially planar first surface on which the first electrode is formed and a substantially planar second surface, parallel to the first surface, on which the second electrode is formed. Desirably, the distance between the first electrode and the second electrode may be equal to or less than the 50% attenuation length for neutrons in the neutron absorbing material filling the ion chamber.
摘要翻译：一种具有单片集成读出电路的中子检测器，包括：键合半导体管芯; 形成在所述键合半导体管芯中的离子室; 形成在所述离子室中的第一电极和第二电极; 填充离子室的中子吸收材料; 以及电耦合到第一和第二电极的读出电路。键合的半导体管芯包括结合到有源半导体衬底的蚀刻半导体衬底。读出电路形成在有源半导体衬底的一部分中。离子室具有基本上平面的第一表面，第一电极形成在其上，并且平行于第一表面的基本平坦的第二表面，在其上形成第二电极。理想地，第一电极和第二电极之间的距离可以等于或小于填充离子室的中子吸收材料中的中子的50％的衰减长度。

7. 发明授权

US07713395B1 Dielectrophoretic columnar focusing device 有权
标题翻译：介电泳柱状聚焦装置
公开(公告)号：US07713395B1
公开(公告)日：2010-05-11
申请号：US11401714
申请日：2006-04-11
申请人： Conrad D. James , Paul C. Galambos , Mark S. Derzon
发明人： Conrad D. James , Paul C. Galambos , Mark S. Derzon
IPC分类号： G01N27/453
CPC分类号： B03C5/026
摘要： A dielectrophoretic columnar focusing device uses interdigitated microelectrodes to provide a spatially non-uniform electric field in a fluid that generates a dipole within particles in the fluid. The electric field causes the particles to either be attracted to or repelled from regions where the electric field gradient is large, depending on whether the particles are more or less polarizable than the fluid. The particles can thereby be forced into well defined stable paths along the interdigitated microelectrodes. The device can be used for flow cytometry, particle control, and other process applications, including cell counting or other types of particle counting, and for separations in material control.
摘要翻译：介电电泳柱状聚焦装置使用交叉指向的微电极在流体中的颗粒内产生偶极子的流体中提供空间不均匀的电场。电场导致颗粒被电场梯度大的区域吸引或排斥，这取决于颗粒是否比流体多或少极化。因此，颗粒可以沿着交叉指示的微电极被强制进入明确定义的稳定路径。该装置可用于流式细胞术，粒子控制和其他过程应用，包括细胞计数或其他类型的颗粒计数，以及材料控制中的分离。

8. 发明授权

US07426873B1 Micro electro-mechanical system (MEMS) pressure sensor for footwear 有权
标题翻译：微机电系统（MEMS）用于鞋类的压力传感器
公开(公告)号：US07426873B1
公开(公告)日：2008-09-23
申请号：US11417755
申请日：2006-05-04
申请人： Deepesh K. Kholwadwala , Brandon R. Rohrer , Barry L. Spletzer , Paul C. Galambos , Jason W. Wheeler , Clinton G. Hobart , Richard C. Givler
发明人： Deepesh K. Kholwadwala , Brandon R. Rohrer , Barry L. Spletzer , Paul C. Galambos , Jason W. Wheeler , Clinton G. Hobart , Richard C. Givler
IPC分类号： G01N3/08 , G01B7/16
CPC分类号： A43B3/00 , A43B3/0005 , A61B5/1038 , A61B5/4023 , A61B5/6807 , A61B2562/0247 , A61B2562/028 , A61B2562/046 , G01L1/02 , G01L5/228 , G01N2033/0086 , G01N2203/0089 , G01N2203/0244
摘要： Footwear comprises a sole and a plurality of sealed cavities contained within the sole. The sealed cavities can be incorporated as deformable containers within an elastic medium, comprising the sole. A plurality of micro electro-mechanical system (MEMS) pressure sensors are respectively contained within the sealed cavity plurality, and can be adapted to measure static and dynamic pressure within each of the sealed cavities. The pressure measurements can provide information relating to the contact pressure distribution between the sole of the footwear and the wearer's environment.
摘要翻译：鞋类包括鞋底和包含在鞋底内的多个密封腔。密封空腔可以作为可变形容器结合在包括鞋底的弹性介质内。多个微电子机械系统（MEMS）压力传感器分别容纳在多个密封腔内，并且可以适于测量每个密封空腔内的静态和动态压力。压力测量可以提供与鞋底和穿戴者的环境之间的接触压力分布有关的信息。

9. 发明授权

US07341222B1 Micro-unmanned aerodynamic vehicle 有权
标题翻译：微型无人机动力车
公开(公告)号：US07341222B1
公开(公告)日：2008-03-11
申请号：US11100592
申请日：2005-04-07
申请人： Nigel Reuel , Troy A. Lionberger , Paul C. Galambos , Murat Okandan , Michael S. Baker
发明人： Nigel Reuel , Troy A. Lionberger , Paul C. Galambos , Murat Okandan , Michael S. Baker
IPC分类号： B64C33/00
CPC分类号： B64C39/028 , B64C2201/025 , B64C2201/127
摘要： A MEMS-based micro-unmanned vehicle includes at least a pair of wings having leading wing beams and trailing wing beams, at least two actuators, a leading actuator beam coupled to the leading wing beams, a trailing actuator beam coupled to the trailing wing beams, a vehicle body having a plurality of fulcrums pivotally securing the leading wing beams, the trailing wing beams, the leading actuator beam and the trailing actuator beam and having at least one anisotropically etched recess to accommodate a lever-fulcrum motion of the coupled beams, and a power source.
摘要翻译：一种基于MEMS的微型无人驾驶车辆包括至少一对具有前翼梁和后翼梁的机翼，至少两个致动器，连接到前翼梁的前导执动器梁，耦合到后翼梁具有多个支点的车体，其枢转地固定前翼梁，后翼梁，前导致器梁和拖尾致动器梁，并且具有至少一个各向异性蚀刻的凹部以适应联接梁的杠杆支点运动，和电源。

10. 发明授权

US06406130B1 Fluid ejection systems and methods with secondary dielectric fluid 有权
标题翻译：流体喷射系统和方法与二次介质流体
公开(公告)号：US06406130B1
公开(公告)日：2002-06-18
申请号：US09785160
申请日：2001-02-20
申请人： Arthur M. Gooray , George J. Roller , Joseph M. Crowley , Paul C. Galambos , Frank J. Peter , Kevin R. Zavadil , Richard C. Givler , Leonard M. Carreira
发明人： Arthur M. Gooray , George J. Roller , Joseph M. Crowley , Paul C. Galambos , Frank J. Peter , Kevin R. Zavadil , Richard C. Givler , Leonard M. Carreira
IPC分类号： B41J204
CPC分类号： B41J2/14314 , B41J2002/041
摘要： A fluid ejection system according to this invention operates on the principle of electrostatic or magnetic attraction. In various exemplary embodiments, the fluid ejection system includes a sealed diaphragm arrangement having at least one diaphragm portion and a diaphragm chamber defined at least partially by the at least one diaphragm portion, a nozzle hole located over the at least one diaphragm portion, an ejection chamber defined between the nozzle hole and the least one diaphragm portion and a secondary dielectric fluid reservoir containing a secondary dielectric fluid. The ejection chamber receives a primary fluid to be ejected. The secondary dielectric fluid reservoir is in fluid communication with the diaphragm chamber to supply the secondary dielectric fluid to the diaphragm chamber. In various exemplary embodiments, the secondary dielectric fluid is a liquid, a substantially incompressible fluid, and/or a high performance dielectric fluid having a dielectric constant greater than 1.
摘要翻译：根据本发明的流体喷射系统基于静电或磁吸引的原理进行操作。在各种示例性实施例中，流体喷射系统包括密封隔膜装置，其具有至少一个隔膜部分和至少部分地由至少一个隔膜部分限定的隔膜室，位于至少一个隔膜部分上方的喷嘴孔，限定在喷嘴孔和至少一个隔膜部分之间的腔室以及包含第二介电流体的次级介质流体储存器。喷射室接收要喷射的主要流体。次级介质流体储存器与隔膜室流体连通，以将次级介质流体供应到隔膜室。在各种示例性实施例中，次级介电流体是具有大于1的介电常数的液体，基本上不可压缩的流体和/或高性能介电流体。

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