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    • 3. 发明授权
    • Charge compensation semiconductor device
    • 充电补偿半导体器件
    • US08901642B2
    • 2014-12-02
    • US13414037
    • 2012-03-07
    • Hans WeberFranz Hirler
    • Hans WeberFranz Hirler
    • H01L29/78
    • H01L29/7802H01L29/0634H01L29/1095H01L29/167H01L29/32H01L29/407H01L29/408H01L29/41766H01L29/66727
    • A semiconductor device includes a semiconductor body having a first surface defining a vertical direction and a source metallization arranged on the first surface. In a vertical cross-section the semiconductor body further includes: a drift region of a first conductivity type; at least two compensation regions of a second conductivity type each of which forms a pn-junction with the drift region and is in low resistive electric connection with the source metallization; a drain region of the first conductivity type having a maximum doping concentration higher than a maximum doping concentration of the drift region, and a third semiconductor layer of the first conductivity type arranged between the drift region and the drain region and includes at least one of a floating field plate and a floating semiconductor region of the second conductivity type forming a pn-junction with the third semiconductor layer.
    • 半导体器件包括具有限定垂直方向的第一表面和布置在第一表面上的源极金属化的半导体本体。 在垂直横截面中,半导体主体还包括:第一导电类型的漂移区; 至少两个第二导电类型的补偿区域,每个补偿区域与漂移区域形成pn结并与源极金属化处于低电阻电连接; 具有高于漂移区的最大掺杂浓度的最大掺杂浓度的第一导电类型的漏极区和布置在漂移区和漏极区之间的第一导电类型的第三半导体层,并且包括以下中的至少一个: 浮置场板和第二导电类型的浮置半导体区域形成与第三半导体层的pn结。