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1. 发明授权

US08446004B2 Power light emitting die package with reflecting lens and the method of making the same 有权
公开(公告)号：US08446004B2
公开(公告)日：2013-05-21
申请号：US12215319
申请日：2008-06-26
申请人： Ban P. Loh , Gerald H. Negley
发明人： Ban P. Loh , Gerald H. Negley
IPC分类号： H01L23/34
CPC分类号： H01L33/644 , H01L33/486 , H01L33/58 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

2. 发明授权

US08123375B2 Tile for solid state lighting 有权
标题翻译：瓷砖用于固态照明
公开(公告)号：US08123375B2
公开(公告)日：2012-02-28
申请号：US12093698
申请日：2006-11-17
申请人： Gerald H. Negley , Paul E. Sims , Ban P. Loh
发明人： Gerald H. Negley , Paul E. Sims , Ban P. Loh
IPC分类号： F21V23/00
CPC分类号： H05B33/0803 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , G02F1/133603 , G02F2001/133613 , G09F9/35 , H01L2224/49175 , H01L2224/8592 , H05B33/0821 , H05K1/142 , H05K1/181 , H05K3/0058 , Y10S362/80
摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.
摘要翻译：固态照明瓦（10）包括具有平坦表面的基板。第一多个固态发光器件（LED）在衬底上。第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24）瓦。第二多个LED在基板上。所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第一颜色的LED在所述瓷砖的第一端具有阴极接触（28），在所述第二颜色的第二端具有阳极接触（26）瓦。

3. 发明授权

US07456499B2 Power light emitting die package with reflecting lens and the method of making the same 有权
标题翻译：具有反射镜的功率发光管芯封装及其制造方法
公开(公告)号：US07456499B2
公开(公告)日：2008-11-25
申请号：US10861929
申请日：2004-06-04
申请人： Ban P. Loh , Gerald H. Negley
发明人： Ban P. Loh , Gerald H. Negley
IPC分类号： H01L23/10
CPC分类号： H01L33/644 , H01L33/486 , H01L33/58 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.
摘要翻译：公开了一种发光管芯封装及其制造方法。模具封装包括引线框架，至少一个发光器件（LED），成型体和透镜。引线框架包括多个引线并且具有顶侧和底侧。引线框架的一部分限定了安装垫。 LED装置安装在安装垫上。成型体与引线框架的一部分一体化并且在引线框架的顶侧上限定开口，围绕安装垫的开口。成型体还包括在引线框的底侧上的闩锁。透镜与成型体相连。复合透镜用作反射器和成像工具，用于收集和引导由LED发射的光以获得期望的光谱和发光性能。

4. 发明授权

US07280288B2 Composite optical lens with an integrated reflector 有权
标题翻译：具有集成反射镜的复合光学透镜
公开(公告)号：US07280288B2
公开(公告)日：2007-10-09
申请号：US10861639
申请日：2004-06-04
申请人： Ban P. Loh , Gerald H. Negley
发明人： Ban P. Loh , Gerald H. Negley
IPC分类号： G02B17/00 , F21V5/04
CPC分类号： G02B3/00 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A composite optical lens is disclosed. The composite optical lens includes a concave bottom surface adapted to receive light, reflective surface adapted to reflect the received light, and optical surface through which the reflected light leaves the optical lens. The concave bottom surface defines a concave cavity allowing placement of at least a portion of a light emitting device within the concave cavity. The concave bottom surface, the optical surface, or both may have predetermined optical finish to operate on the light such as diffusing or focusing the light. The reflective surface can be coated, designed, or both for total internal reflection effect.
摘要翻译：公开了一种复合光学透镜。复合光学透镜包括适于接收光的凹底表面，适于反射接收的光的反射表面以及反射光通过该表面离开光学透镜的光学表面。凹形底表面限定了凹腔，其允许在凹腔内放置发光器件的至少一部分。凹底面，光学表面或两者可以具有预定的光学光洁度以在光上操作，例如漫射或聚焦光。反射表面可以被涂覆，设计或两者用于全内反射效果。

5. 发明申请

US20090219714A1 Tile for Solid State Lighting 有权
标题翻译：固态照明瓷砖
公开(公告)号：US20090219714A1
公开(公告)日：2009-09-03
申请号：US12093698
申请日：2006-11-17
申请人： Gerald H. Negley , Paul E. Sims , Ban P. Loh
发明人： Gerald H. Negley , Paul E. Sims , Ban P. Loh
IPC分类号： F21V9/00 , F21S4/00
CPC分类号： H05B33/0803 , F21K9/00 , F21Y2105/10 , F21Y2115/10 , G02F1/133603 , G02F2001/133613 , G09F9/35 , H01L2224/49175 , H01L2224/8592 , H05B33/0821 , H05K1/142 , H05K1/181 , H05K3/0058 , Y10S362/80
摘要： A solid state lighting tile (10) includes a substrate having a planar surface. A first plurality of solid state light emitting devices (LEDs) are on the substrate. The first plurality of LEDs (19) are connected in series to form a first string of LEDs of a first color having an anode contact (22) at a first end of the tile and a cathode contact (24) at a second end of the tile. A second plurality of LEDs are on the substrate. The second plurality of LEDs (21) are connected in series to form a second string of LEDs of the first color having a cathode contact (28) at the first end of the tile and an anode contact (26) at the second end of the tile.
摘要翻译：固态照明瓦（10）包括具有平坦表面的基板。第一多个固态发光器件（LED）在衬底上。第一组多个LED（19）串联连接以形成第一颜色的第一串LED，在第一端具有阳极触点（22），在第二端的第二端处形成阴极触点（24）瓦。第二多个LED在基板上。所述第二多个LED（21）串联连接以形成所述第一颜色的第二串LED，所述第二颜色的LED在所述瓦片的第一端处具有阴极触点（28），并且在所述第二颜色的第二端处具有阳极触点（26）瓦。

6. 发明申请

US20110210360A1 TRANSMISSIVE OPTICAL ELEMENTS INCLUDING PHOSPHOR PATTERNS THEREIN 审中-公开
标题翻译：传输光学元件，其中包括磷光体图案
公开(公告)号：US20110210360A1
公开(公告)日：2011-09-01
申请号：US13074942
申请日：2011-03-29
申请人： Gerald H. Negley , Ban P. Loh
发明人： Gerald H. Negley , Ban P. Loh
IPC分类号： H01L33/44
CPC分类号： H01L33/642 , F21V29/763 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48465 , H05K1/053 , H01L2224/48091 , H01L2924/00014
摘要： A transmissive optical element includes a transparent plastic member, such as a shell or a dome-shaped shell, including a phosphor pattern dispersed therein that can produce an indicia. The transmissive optical element may be combined with a semiconductor light emitting device, a mounting substrate, an encapsulant and inner and/or outer coatings.
摘要翻译：透射光学元件包括透明塑料构件，例如外壳或圆顶形外壳，包括分散在其中的能够产生标记的磷光体图案。透射光学元件可以与半导体发光器件，安装衬底，密封剂和内部和/或外部涂层组合。

7. 发明授权

US07777247B2 Semiconductor light emitting device mounting substrates including a conductive lead extending therein 有权
标题翻译：半导体发光器件的安装基板包括在其中延伸的导电引线
公开(公告)号：US07777247B2
公开(公告)日：2010-08-17
申请号：US11035716
申请日：2005-01-14
申请人： Ban P. Loh , Gerald H. Negley , Yankun Fu
发明人： Ban P. Loh , Gerald H. Negley , Yankun Fu
IPC分类号： H01L29/24 , H01L23/34
CPC分类号： H01L33/486 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/01019 , H01L2924/01068 , H01L2924/12041 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.
摘要翻译：用于半导体发光器件的安装衬底包括导热安装块。安装块在其第一面中具有被构造成在其中安装半导体发光器件并且将由其中安装的半导体发光器件发射的光反射离开空腔的空腔。插入安装块的导电引线延伸到空腔中。导电引线与安装块电隔离，并且在空腔中具有暴露的接触部分。导电引线可以是多个导电引线，每个导电引线在空腔中的不同位置具有暴露的接触部分。也可以提供相关的包装方法。

8. 发明申请

US20080283861A1 Power light emitting die package with reflecting lens and the method of making the same 有权
公开(公告)号：US20080283861A1
公开(公告)日：2008-11-20
申请号：US12215319
申请日：2008-06-26
申请人： Ban P. Loh , Gerald H. Negley
发明人： Ban P. Loh , Gerald H. Negley
IPC分类号： H01L33/00
CPC分类号： H01L33/644 , H01L33/486 , H01L33/58 , H01L33/642 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

9. 发明授权

US08608349B2 Power surface mount light emitting die package 有权
标题翻译：功率表面贴装发光管芯封装
公开(公告)号：US08608349B2
公开(公告)日：2013-12-17
申请号：US13023263
申请日：2011-02-08
申请人： Ban P. Loh
发明人： Ban P. Loh
IPC分类号： F21V3/00
CPC分类号： H01L33/58 , H01L33/54 , H01L33/641 , H01L2924/0002 , Y10S362/80 , H01L2924/00
摘要： A light emitting die package includes a substrate, a reflector plate, and a lens. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad, and includes a reflective surface to direct light from the LED in a desired direction. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).
摘要翻译：发光管芯封装包括基板，反射板和透镜。衬底具有用于将外部电源连接到安装衬垫上的发光二极管（LED）的迹线。反射板耦合到基板并且基本上围绕安装焊盘，并且包括反射表面以在期望的方向上引导来自LED的光。透镜相对于反射板自由移动，并且能够被润湿并粘附到其上的密封剂升高或降低，并且被放置在距离LED芯片最佳距离处。在操作期间由LED产生的热量通过基板（作为底部散热器）和反射板（作为顶部散热器）两者而被从LED引出。

10. 发明申请

US20120061702A1 Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants 有权
标题翻译：用于半导体发光器件的基座和形成封装发光器件的方法，包括分配密封剂
公开(公告)号：US20120061702A1
公开(公告)日：2012-03-15
申请号：US13149197
申请日：2011-05-31
申请人： Peter S. Andrews , Ban P. Loh , Nicholas W. Medendorp, JR. , Bernd P. Keller
发明人： Peter S. Andrews , Ban P. Loh , Nicholas W. Medendorp, JR. , Bernd P. Keller
IPC分类号： H01L33/58 , H01L33/52
CPC分类号： H01L33/54 , H01L33/486 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/10253 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
摘要翻译：用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。第一和第二弯液面控制特征可以与管芯附接垫基本共面。封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂。还公开了方法实施例。

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