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    • 1. 发明授权
    • Method for co-registering semiconductor wafers undergoing work in one or
more blind process modules
    • 在一个或多个盲目处理模块中共同对准正在进行工作的半导体晶片的方法
    • US5610102A
    • 1997-03-11
    • US152780
    • 1993-11-15
    • George J. GardopeePaul J. ClapisJoseph P. PrusakSherman K. Poultney
    • George J. GardopeePaul J. ClapisJoseph P. PrusakSherman K. Poultney
    • G01R31/26G01R31/28H01L21/677H01L21/68H01L21/302
    • H01L21/67796G06F2203/0382Y10S148/162Y10S414/136
    • A method for co-registering a semiconductor wafer (14) undergoing work in one or more blind process modules (10), (12) requires a means (16), (18) for consistently and repeatably registering the semiconductor wafer (14) to each process module (10), (12). Given this consistent and repeatable singular wafer registration means (16), (18), the location of the coordinate axes of each process module (10), (12) is determined with respect to the position of the semiconductor wafer (14) that is registered therein. The present invention method provides three approaches for determining the location of these axes: (1) an absolute location of the axes, (2) a relative location of the axes using one blind process module (10) to measure the position of a pattern etched into the semiconductor wafer (14) with another blind process module (12), and (3) a relative location of the axes using one blind process module (10) to measure surface or layer thickness characteristics in the semiconductor wafer (14) as modified by wafer processing. Regardless of which approach is followed, the determination of the location of the coordinate axes in each process module (10), (12) is an effective co-registration of the semiconductor wafer (14).
    • 一种用于共同对准在一个或多个盲工艺模块(10),(12)中进行工作的半导体晶片(14)的方法需要用于将半导体晶片(14)一致地和可重复地对准的装置(16),(18) 每个处理模块(10),(12)。 给定这种一致且可重复的奇异晶片登记装置(16),(18),每个处理模块(10),(12)的坐标轴的位置相对于半导体晶片(14)的位置来确定, 在其中注册。 本发明方法提供了用于确定这些轴的位置的三种方法:(1)轴的绝对位置,(2)使用一个盲处理模块(10)的轴的相对位置,以测量蚀刻的图案的位置 通过另一个盲目处理模块(12)进入半导体晶片(14),和(3)使用一个盲目处理模块(10)的轴的相对位置,以测量半导体晶片(14)中的表面或层厚度特性 通过晶片处理。 不管遵循哪种方法,在每个处理模块(10),(12)中确定坐标轴的位置是半导体晶片(14)的有效共同配准。