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1. 发明申请

US20060007553A1 Device for producing a bundled light flux 有权
标题翻译：用于产生捆束光通量的装置
公开(公告)号：US20060007553A1
公开(公告)日：2006-01-12
申请号：US10529706
申请日：2003-09-01
申请人： Georg Bogner , Herbert Breinich , Bernd Ludewig , Ralf Mayer , Heinrich Noll , Jorg-Erich Sorg
发明人： Georg Bogner , Herbert Breinich , Bernd Ludewig , Ralf Mayer , Heinrich Noll , Jorg-Erich Sorg
IPC分类号： G02B27/14
CPC分类号： G02F1/133603 , G02F1/133605 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2924/00
摘要： The invention relates to a device for producing a bundled light flux. According to the invention, a light source consisting of a light emitting diode matrix (1, 2, 3) is provided, an optical device for bundling and scattering the light produced by the light-emitting diodes is arranged between the light source and a light outlet (9, 18), the device for bundling and scattering comprises a latticed reflector (5) which respectively forms a light channel for each matrix point, the walls (6) of said light channel being reflective, and the end of each light channel, facing the light source (1, 2, 3), contains a convergent lens (4).
摘要翻译：本发明涉及一种用于产生束状光通量的装置。根据本发明，提供了一种由发光二极管阵列（1,2,3）组成的光源，用于将由发光二极管产生的光聚束和散射的光学装置设置在光源和光出口（9,18），用于捆绑和散射的装置包括网格反射器（5），其分别形成每个矩阵点的光通道，所述光通道的壁（6）是反射性的，并且每个光通道的端部面对光源（1,2,3），包含会聚透镜（4）。

2. 发明授权

US07312927B2 Head-up display 有权
标题翻译：平视显示
公开(公告)号：US07312927B2
公开(公告)日：2007-12-25
申请号：US10529706
申请日：2003-09-01
申请人： Georg Bogner , Herbert Breinich , Bernd Ludewig , Ralf Mayer , Heinrich Noll , Jörg-Erich Sorg
发明人： Georg Bogner , Herbert Breinich , Bernd Ludewig , Ralf Mayer , Heinrich Noll , Jörg-Erich Sorg
IPC分类号： G02B27/14 , G02B27/10 , G02B5/02 , G01D11/28 , F21V5/00
CPC分类号： G02F1/133603 , G02F1/133605 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2924/00
摘要： A straw holder for supporting a drinking straw in the mouth of a bottle is presented. The holder includes a straw support portion dimensioned for placement across the mouth of a bottle. The straw support portion includes an aperture designed to receive a straw therethrough and to vertically support the straw with respect to the support portion. The holder further includes a bottle retaining portion that includes at least one turn extending around the retaining portion. The at least one turn includes a first turn having an end attached to the straw support portion.
摘要翻译：本发明涉及一种用于产生捆束光束的装置。根据本发明，提供了由发光二极管阵列组成的光源，用于将由发光二极管产生的光聚束和散射的光学装置设置在光源和光出口之间。用于捆绑和散射的装置包括网格反射器，其分别形成每个矩阵点的光通道，所述光通道的壁是反射的，并且面对光源的每个光通道的端部包含会聚透镜。

3. 发明授权

US08042964B2 Illumination device having luminous spots formed by light emitting diodes 有权
标题翻译：具有由发光二极管形成的发光点的照明装置
公开(公告)号：US08042964B2
公开(公告)日：2011-10-25
申请号：US10529675
申请日：2003-09-01
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll
IPC分类号： G09F13/04
CPC分类号： H05B33/0803 , G02F1/133603 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H05B33/0821 , H01L2924/00 , H01L2924/00014
摘要： An illumination device for backlighting an image reproduction device containing light valves, the illumination device including a plurality of luminous spots arranged in grid format on a flat thermally conductive carrier. Each luminous spot having a plurality of light emitting diodes electrically insulated from one another, and a submount exhibiting good thermal conductivity and being connected to the carrier.
摘要翻译：一种用于背光包含光阀的图像再现装置的照明装置，该照明装置包括在平坦的导热载体上以网格形式布置的多个发光点。每个发光点具有彼此电绝缘的多个发光二极管，以及显示出良好的导热性并与载体连接的底座。

4. 发明授权

US07586190B2 Optoelectronic component and a module based thereon 有权
标题翻译：光电组件和基于此的模块
公开(公告)号：US07586190B2
公开(公告)日：2009-09-08
申请号：US10529626
申请日：2003-09-29
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
IPC分类号： H01L23/34
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48091 , H01L2224/48465 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.
摘要翻译：一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热器（12）的载体（22）上。外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

5. 发明申请

US20060232969A1 Illumination device for backlighting an image reproduction device 有权
标题翻译：照明装置，用于照亮图像再现装置
公开(公告)号：US20060232969A1
公开(公告)日：2006-10-19
申请号：US10529675
申请日：2003-09-01
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll
IPC分类号： F21S13/14
CPC分类号： H05B33/0803 , G02F1/133603 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H05B33/0821 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to an illumination device for backlighting an image reproduction device that contains light valves. Said device is characterised in that light spots formed respectively by at least one light emitting diode are arranged in a grid on a thermally conductive support. The respective surface area of the light spots is less than that of the surface area defined by the grid.
摘要翻译：本发明涉及用于背光包含光阀的图像再现装置的照明装置。所述装置的特征在于，分别由至少一个发光二极管形成的光点以格栅布置在导热支撑件上。光斑的相应表面积小于由栅格限定的表面积的表面积。

6. 发明申请

US20060138621A1 Optoelectronic component and a module based thereon 有权
标题翻译：光电组件和基于此的模块
公开(公告)号：US20060138621A1
公开(公告)日：2006-06-29
申请号：US10529626
申请日：2003-09-29
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll , Matthias Winter
IPC分类号： H01L23/02
CPC分类号： H01L33/64 , H01L33/486 , H01L2224/48091 , H01L2224/48465 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.
摘要翻译：一种具有发射和/或接收电磁辐射的半导体装置（4）的光电子部件（1），其布置在导热连接到散热片（12）的载体（22）上。外部电连接（9）连接到半导体装置（4），其中外部电连接（9）以绝缘方式布置在散热器（12）上距载体（22）一定距离处。这导致了热耗散和光辐射的优化组件，以及在模块中的电接触和包装密度方面。

7. 发明授权

US07726835B2 LED array 有权
标题翻译： LED阵列
公开(公告)号：US07726835B2
公开(公告)日：2010-06-01
申请号：US11816951
申请日：2006-02-06
申请人： Georg Bogner , Moritz Engl , Stefan Grötsch , Patrick Kromotis , Jorg Erich Sorg
发明人： Georg Bogner , Moritz Engl , Stefan Grötsch , Patrick Kromotis , Jorg Erich Sorg
IPC分类号： H01L27/15
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/42 , H01L33/505 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要翻译：在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体，透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

8. 发明申请

US20090103297A1 LED ARRAY 有权
标题翻译： LED阵列
公开(公告)号：US20090103297A1
公开(公告)日：2009-04-23
申请号：US11816951
申请日：2006-02-06
申请人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
发明人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
IPC分类号： F21V33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/42 , H01L33/505 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要翻译：在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体，透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

9. 发明授权

US08890306B2 Light-emitting diode 有权
标题翻译：发光二极管
公开(公告)号：US08890306B2
公开(公告)日：2014-11-18
申请号：US13808300
申请日：2011-05-24
申请人： Joachim Reill , Georg Bogner , Stefan Grötsch
发明人： Joachim Reill , Georg Bogner , Stefan Grötsch
IPC分类号： H01L23/15 , H01L23/08 , H01L33/64 , H01L25/075 , H05K1/02 , H01L23/10 , H05K1/05 , H01L33/62
CPC分类号： H01L25/13 , H01L25/0753 , H01L33/46 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L33/644 , H01L33/647 , H01L2224/48091 , H01L2224/48227 , H05K1/0203 , H05K1/05 , H05K3/445 , H05K2201/10106 , H05K2201/10409 , H01L2924/00014
摘要： A light-emitting diode includes a carrier with a mounting face and includes a metallic basic body and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein an outer face of the metallic basic body includes the mounting face, the at least two light-emitting diode chips connect in parallel with one another, the at least two light-emitting diode chips are embedded in a reflective coating, the reflective coating covering the mounting face and side faces of the light-emitting diode chips, and the light-emitting diode chips protrude with their radiation exit surfaces out of the reflective coating, and the radiation exit surfaces face away from the carrier.
摘要翻译：发光二极管包括具有安装面的载体，并且包括金属基体和至少两个至少两个发光二极管芯片，其至少间接地固定在安装面上，其中金属基体的外表面包括所述至少两个发光二极管芯片彼此并联连接，所述至少两个发光二极管芯片嵌入在反射涂层中，所述反射涂层覆盖所述安装面和所述发光二极管的侧面二极管芯片，并且发光二极管芯片以其辐射出射表面突出出反射涂层，并且辐射出射表面背离载体。

10. 发明授权

US08772065B2 Housing body and method for production thereof 有权
标题翻译：壳体及其制造方法
公开(公告)号：US08772065B2
公开(公告)日：2014-07-08
申请号：US13611890
申请日：2012-09-12
申请人： Georg Bogner , Karlheinz Arndt
发明人： Georg Bogner , Karlheinz Arndt
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L23/49805 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/12044 , H01L2924/181 , H01L2924/3025 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.
摘要翻译：具有上侧（2）的包装体（1），具有与上侧（2）相对的下侧（22），以及连接上侧（2）和下侧（22）的侧表面，并且被设置为安装表面（19），所述封装主体（1）具有多个层（8），所述多个层（8）包含陶瓷材料，并且所述层（23,24,25）的倾斜方向与安装表面（19）的关系。此外，提供了一种用于生产包装体（1）的方法。

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