专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2007005275A1 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE 审中-公开
标题翻译：模塑组合物和方法，以及模制品
公开(公告)号：WO2007005275A1
公开(公告)日：2007-01-11
申请号：PCT/US2006/023957
申请日：2006-06-20
申请人： GENERAL ELECTRIC COMPANY , LU, Qiwei , O'BRIEN, Michael , ROCHA-GALICIA, Gerardo , SUSARLA, Prameela
发明人： LU, Qiwei , O'BRIEN, Michael , ROCHA-GALICIA, Gerardo , SUSARLA, Prameela
IPC分类号： C08L63/00 , C08L71/12 , C08K3/36 , H01L23/29
CPC分类号： C08G59/621 , C08L63/00 , C08L71/123 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/31511 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.
摘要翻译：适用于封装固态器件的模塑组合物包括环氧树脂，硬化剂，包含小于5重量％的大于100微米的颗粒的聚（亚芳基醚）树脂和约70至约95重量％的二氧化硅填料，基于组合物的总重量。固化后，与常规模塑组合物相比，该组合物显示出改进的增加的铜附着力和减小的收缩率。

2. 发明申请

WO2006023371A1 FUNCTIONALIZED POLY(ARYLENE ETHER) COMPOSITION AND METHOD 审中-公开
标题翻译：功能性聚（亚乙基醚）组合物和方法
公开(公告)号：WO2006023371A1
公开(公告)日：2006-03-02
申请号：PCT/US2005/028602
申请日：2005-08-11
申请人： GENERAL ELECTRIC COMPANY , BIRSAK, Joop , CHAO, Herbert Shin-I , DUFFEY, Bryan , FRESHOUR, Amy, Rene , INGELBRECHT, Hugo, Gerard, Eduard , LU, Qiwei , O'BRIEN, Michael, Joseph , SUSARLA, Prameela , VALLANCE, Michael , ZARNOCH, Kenneth, Paul
发明人： BIRSAK, Joop , CHAO, Herbert Shin-I , DUFFEY, Bryan , FRESHOUR, Amy, Rene , INGELBRECHT, Hugo, Gerard, Eduard , LU, Qiwei , O'BRIEN, Michael, Joseph , SUSARLA, Prameela , VALLANCE, Michael , ZARNOCH, Kenneth, Paul
IPC分类号： C08G65/48
CPC分类号： C08G65/485 , C08F220/06 , C08F222/1006 , C08F283/06 , C08F283/08 , C08F290/061 , C08F290/062
摘要： A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
摘要翻译：可固化组合物包括烯属不饱和单体和具有两个可聚合基团的聚（亚芳基醚），特性粘度为约0.05至约0.30分升/克。该组合物在模塑期间显示出高流动性和高后固化刚度和冲击强度的改进的组合。该组合物特别适用于制造塑料封装的电子器件。

3. 发明申请

WO2005072958A1 WEATHERABLE MULTILAYER ARTICLES AND METHOD FOR THEIR PREPARATION 审中-公开
标题翻译：耐候多层织物及其制备方法
公开(公告)号：WO2005072958A1
公开(公告)日：2005-08-11
申请号：PCT/US2005/000050
申请日：2005-01-03
申请人： GENERAL ELECTRIC COMPANY , WANG, Hua , LU, Qiwei
发明人： WANG, Hua , LU, Qiwei
IPC分类号： B32B27/08
CPC分类号： B32B27/08 , B32B7/12 , B32B27/32 , B32B27/365 , B32B2307/406 , B32B2307/558 , B32B2307/71 , B32B2307/712 , B32B2307/714 , C08F255/02 , C08L51/06 , C08L53/00 , C08L2666/02 , C08L2666/06 , C09J151/06 , C09J175/04 , Y10T428/31551
摘要： Disclosed are weatherable multilayer articles comprising (i) a coating layer comprising a block copolyestercarbonate comprising structural units derived from at least one 1,3-dihydroxybenzene and at least one aromatic dicarboxylic acid, (ii) a second layer comprising a polymer comprising carbonate structural units, (iii) a substrate layer comprising a polypropylene, and (iv) at least one adhesive layer comprising the reaction product of an amine-functionalized polypropylene and a polyurethane, wherein the coating layer is in contiguous contact with the second layer, and the adhesive layer is in contiguous contact with the second layer and the substrate layer. Also disclosed is a method for making the multilayer article.
摘要翻译：公开了耐候性多层制品，其包含（i）包含嵌段共聚酯碳酸酯的涂层，其包含衍生自至少一种1,3-二羟基苯和至少一种芳族二羧酸的结构单元，（ii）第二层，其包含含有碳酸酯结构单元，（iii）包含聚丙烯的基底层，和（iv）包含胺官能化聚丙烯和聚氨酯的反应产物的至少一个粘合剂层，其中所述涂层与所述第二层连续接触，并且所述粘合剂层与第二层和衬底层连续接触。还公开了制造多层制品的方法。

4. 发明申请

WO2007005346A1 CURABLE COMPOSITION AND METHOD 审中-公开
标题翻译：可固化组合物和方法
公开(公告)号：WO2007005346A1
公开(公告)日：2007-01-11
申请号：PCT/US2006/024666
申请日：2006-06-23
申请人： GENERAL ELECTRIC COMPANY , LU, Qiwei , O'BRIEN, Michael , SUSARLA, Prameela , VALLANCE, Michael
发明人： LU, Qiwei , O'BRIEN, Michael , SUSARLA, Prameela , VALLANCE, Michael
IPC分类号： C08L63/00 , C08L71/10
CPC分类号： C08G65/48 , C08L63/00 , C08L71/10 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A curable resin composition useful for encapsulating solid state devices is describe The composition includes an epoxy resin, a poly(arylene ether) resin, a latent cationi cure catalyst effective to cure the epoxy resin, and about 70 to about 95 weight perce of an inorganic filler, based on the total weight of the curable composition. A metho of encapsulating a solid state device with the composition and encapsulated device prepared with the composition are also described.
摘要翻译：描述了可用于封装固态器件的可固化树脂组合物。该组合物包括环氧树脂，聚（亚芳基醚）树脂，有效固化环氧树脂的潜阳离子固化催化剂和约70至约95重量％的无机填料，基于可固化组合物的总重量。还描述了用组合物制备的组合物和包封装置封装固态装置的方法。

5. 发明申请

WO2007005280A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE 审中-公开
标题翻译：模塑组合物和方法，以及模制品
公开(公告)号：WO2007005280A2
公开(公告)日：2007-01-11
申请号：PCT/US2006/023999
申请日：2006-06-21
申请人： GENERAL ELECTRIC COMPANY , LU, Qiwei , O'BRIEN, Michael , VALLANCE, Michael
发明人： LU, Qiwei , O'BRIEN, Michael , VALLANCE, Michael
IPC分类号： C08G59/68
CPC分类号： C08G59/68 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , Y10T428/31511 , H01L2924/00014 , H01L2924/00
摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (Bl) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B 2a) a diaryl iodonium cation, and (B 2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C 1 -C 12 )-hydrocarbylsulfonates, (C 2 -C 12 )-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C 1 -C 12 )-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)metliyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.
摘要翻译：用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B 2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B 2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 3 - 全氟链烷酸酯，四氟硼酸盐，未取代的和取代的四 - （C 1 -C 12）烷基磺酸盐，（C 2 -C 12 -C 12 - （三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）酰亚胺阴离子及其组合;和（III）和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II））及其组合的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

6. 发明公开

EP1899416A1 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE 审中-公开
标题翻译： FORM组成和程序，成型制品
公开(公告)号：EP1899416A1
公开(公告)日：2008-03-19
申请号：EP06773610.8
申请日：2006-06-20
申请人： General Electric Company
发明人： LU, Qiwei , O'BRIEN, Michael , ROCHA-GALICIA, Gerardo , SUSARLA, Prameela
IPC分类号： C08L63/00 , C08L71/12 , C08K3/36 , H01L23/29
CPC分类号： C08G59/621 , C08L63/00 , C08L71/123 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , Y10T428/31511 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.

7. 发明公开

EP1708878A1 WEATHERABLE MULTILAYER ARTICLES AND METHOD FOR THEIR PREPARATION 审中-公开
标题翻译：耐候性多层制品及其制造方法
公开(公告)号：EP1708878A1
公开(公告)日：2006-10-11
申请号：EP05704894.4
申请日：2005-01-03
申请人： GENERAL ELECTRIC COMPANY
发明人： WANG, Hua , LU, Qiwei
IPC分类号： B32B27/08 , C09J175/02 , C09J175/12 , C09J123/10
CPC分类号： B32B27/08 , B32B7/12 , B32B27/32 , B32B27/365 , B32B2307/406 , B32B2307/558 , B32B2307/71 , B32B2307/712 , B32B2307/714 , C08F255/02 , C08L51/06 , C08L53/00 , C08L2666/02 , C08L2666/06 , C09J151/06 , C09J175/04 , Y10T428/31551
摘要： Disclosed are weatherable multilayer articles comprising (i) a coating layer comprising a block copolyestercarbonate comprising structural units derived from at least one 1,3-dihydroxybenzene and at least one aromatic dicarboxylic acid, (ii) a second layer comprising a polymer comprising carbonate structural units, (iii) a substrate layer comprising a polypropylene, and (iv) at least one adhesive layer comprising the reaction product of an amine-functionalized polypropylene and a polyurethane, wherein the coating layer is in contiguous contact with the second layer, and the adhesive layer is in contiguous contact with the second layer and the substrate layer. Also disclosed is a method for making the multilayer article.

8. 发明公开

EP1943287A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE 审中-公开
标题翻译：模塑材料和方法以及成型制品
公开(公告)号：EP1943287A2
公开(公告)日：2008-07-16
申请号：EP06773626.4
申请日：2006-06-21
申请人： General Electric Company
发明人： LU, Qiwei , O'BRIEN, Michael , VALLANCE, Michael
IPC分类号： C08G59/68
CPC分类号： C08G59/68 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , Y10T428/31511 , H01L2924/00014 , H01L2924/00
摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (Bl) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B 2a) a diaryl iodonium cation, and (B 2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)metliyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

9. 发明公开

EP1902095A1 CURABLE COMPOSITION AND METHOD 审中-公开
标题翻译：固化组合物和方法
公开(公告)号：EP1902095A1
公开(公告)日：2008-03-26
申请号：EP06773931.8
申请日：2006-06-23
申请人： GENERAL ELECTRIC COMPANY (a New York Corporation)
发明人： LU, Qiwei , O'BRIEN, Michael , SUSARLA, Prameela , VALLANCE, Michael
IPC分类号： C08L63/00 , C08L71/10
CPC分类号： C08G65/48 , C08L63/00 , C08L71/10 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/73265 , C08L2666/22 , H01L2924/00014 , H01L2924/00
摘要： A curable resin composition useful for encapsulating solid state devices is describe The composition includes an epoxy resin, a poly(arylene ether) resin, a latent cationi cure catalyst effective to cure the epoxy resin, and about 70 to about 95 weight perce of an inorganic filler, based on the total weight of the curable composition. A metho of encapsulating a solid state device with the composition and encapsulated device prepared with the composition are also described.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式