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1. 发明授权

US5398863A Shaped lead structure and method 失效
标题翻译：形铅笔结构及方法
公开(公告)号：US5398863A
公开(公告)日：1995-03-21
申请号：US96693
申请日：1993-07-23
申请人： Gary W. Grube , Gaetan Mathieu , Jason Sweis , John A. Grange
发明人： Gary W. Grube , Gaetan Mathieu , Jason Sweis , John A. Grange
IPC分类号： H01L23/12 , B23K20/10 , H01L21/60 , H05K3/34 , B23K31/02
CPC分类号： H01L24/50 , B23K20/10 , B23K2201/40 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082
摘要： In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool horizontally towards the proximal or first end of the lead, thereby forcing the bonding region towards the first end and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end of the lead and again advanced downwardly to secure the lead to the chip contact.
摘要翻译：在半导体内引线接合工艺中，具有引线的连接部件设置在芯片表面上，使得引线位于触点上方。每个引线的接合区域被工具向下压迫与芯片上的接触件接合，而引线的第一或近端保持附接到电介质支撑结构。通过将接合工具水平地朝向引线的近端或第一端移动，从而将引线变形为S形构造，从而迫使接合区朝向第一端并弯曲或弯曲引线。或者，引线通过工具向下弯曲，然后工具可以从引线脱离，从引线的近端移开，并再次向前推进以将引线固定到芯片接触。

2. 发明授权

US06888229B2 Connection components with frangible leads and bus 失效
标题翻译：连接组件采用易碎导线和总线
公开(公告)号：US06888229B2
公开(公告)日：2005-05-03
申请号：US10872105
申请日：2004-06-18
申请人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathieu , Jason Sweis , Laurie Union , David Gibson
发明人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathieu , Jason Sweis , Laurie Union , David Gibson
IPC分类号： H01L21/60 , H01L23/31 , H01L23/495 , H01L23/498 , H05K3/36 , H05K3/40
CPC分类号： H01L24/86 , H01L23/3107 , H01L23/49572 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H05K3/361 , H05K3/4084 , H01L2924/00
摘要： A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure. A semiconductor chip is disposed beneath the bottom surface of the support structure. The leads are adapted to be bonded to contacts on the semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leads from the bus and engage the leads with the contacts of the semiconductor chip.
摘要翻译：半导体芯片安装部件包括适于接合半导体芯片的支撑结构。支撑结构具有顶表面，底表面和延伸穿过支撑结构的间隙，用于限定支撑结构在间隙的相对侧上的第一和第二部分。支撑结构包括在支撑结构的第二部分上沿着间隙布置的至少一个细长总线。支撑结构包括多个导电引线，每个引线具有跨越间隙延伸的连接部分，连接部分具有设置在支撑结构的第一部分上的第一端和固定到总线的第二端。每个引线包括设置在连接部分的第一和第二端之间的易碎部分，该易碎部分的横截面积小于连接部分的横截面面积。间隙在支撑结构的底部表面开口。半导体芯片设置在支撑结构的底表面下方。引线适于通过断开引线的易碎部分而与半导体芯片上的触点接合，从而将引线的第二端与母线断开，并与半导体芯片的触点接合引线。

3. 发明授权

US5915752A Method of making connections to a semiconductor chip assembly 失效
标题翻译：连接到半导体芯片组件的方法
公开(公告)号：US5915752A
公开(公告)日：1999-06-29
申请号：US374559
申请日：1995-05-08
申请人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathieu , Jason Sweis , Laurie Union , David Gibson
发明人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathieu , Jason Sweis , Laurie Union , David Gibson
IPC分类号： H01L21/60 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/50 , H05K1/18 , H05K3/36 , H05K3/40 , H01R43/00
CPC分类号： H01L23/49572 , H01L23/3107 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/01 , H01L2924/01082 , H01L2924/12042 , H05K3/361 , H05K3/4084 , Y10T29/49121 , Y10T29/4913 , Y10T29/49135 , Y10T29/49218 , Y10T29/49222
摘要： A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool which has features adapted to control the position of the lead.
摘要翻译： PCT No.PCT / US93 / 06930 Sec。 371日期1995年5月8日 102（e）日期1995年5月8日PCT提交1993年7月23日PCT公布。出版物WO94 / 03036 日期1994年2月3日用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙（40）的优选电介质支撑结构（70）。引线延伸穿过这些间隙，使得引线被支撑在间隙（66,70）的两侧。因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。优选地，每个引线包括与间隙的一侧相邻的易碎部分（72），并且当引线与触点接合时，易碎部分断裂。引线与芯片上的触点的最终对准由具有适于控制引线位置的特征的焊接工具提供。

4. 发明授权

US6054756A Connection components with frangible leads and bus 有权
标题翻译：连接组件采用易碎导线和总线
公开(公告)号：US6054756A
公开(公告)日：2000-04-25
申请号：US268289
申请日：1999-03-15
申请人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathieu , Jason Sweis , Laurie Union , David Gibson
发明人： Thomas H. DiStefano , Gary W. Grube , Igor Y. Khandros , Gaetan Mathieu , Jason Sweis , Laurie Union , David Gibson
IPC分类号： H01L21/60 , H01L23/31 , H01L23/495 , H01L23/498 , H05K3/36 , H05K3/40 , H01L23/48 , H01L23/52
CPC分类号： H01L24/86 , H01L23/3107 , H01L23/49572 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H05K3/361 , H05K3/4084
摘要： A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap connecting one end of the lead connection section to a bus extending alongside the gap. The frangible section is broken when the lead is engaged with the contact.
摘要翻译：用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙的优选介电支撑结构。引线延伸穿过这些间隙，使得引线支撑在间隙的两侧。因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。优选地，每个引线包括邻近连接引线连接部分的一端与沿着间隙延伸的总线的间隙的一侧相邻的易碎部分。当领导与联系人接触时，易碎部分断裂。

5. 发明授权

US06252301B1 Compliant semiconductor chip assemblies and methods of making same 有权
标题翻译：符合标准的半导体芯片组件及其制造方法
公开(公告)号：US06252301B1
公开(公告)日：2001-06-26
申请号：US09450252
申请日：1999-11-29
申请人： Kenneth B. Gilleo , Gary W. Grube , Gaetan Mathieu
发明人： Kenneth B. Gilleo , Gary W. Grube , Gaetan Mathieu
IPC分类号： H01L2352
CPC分类号： H01L24/83 , H01L23/3114 , H01L23/4985 , H01L24/29 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/45144 , H01L2224/73204 , H01L2224/81191 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/15311 , H01L2924/3011 , H01L2924/351 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05644 , H01L2224/05124
摘要： A semiconductor chip package assembly is mounted to contact pads on a die. A compliant interposer layer is disposed between the die and a dielectric substrate wiring layer. The contacts on the die are connected to terminals on the compliant interposer layer by means of a compliant, conductive polymer extending through apertures in the interposer layer. Compliancy in the interposer layer and in the conductive polymer permits relative movement of the terminals on the dielectric substrate wiring layer to the contacts on the die and hence relieves the shear forces caused by differential thermal expansion. The arrangement provides a compact packaged structure similar to that achieved through flip-ship bonding, but with markedly increased resistance to thermal cycling damage. Further, the packaged structure allows the standardization of the packages such that several companies can make competing chips that are packaged such that the resultant packaged structures are roughly the same as far as the end user is concerned.
摘要翻译：将半导体芯片封装组件安装到管芯上的接触焊盘。在芯片和电介质基板布线层之间设置顺应性插入层。芯片上的触点通过延伸穿过插入层中的孔的柔性导电聚合物连接到顺应性插入层上的端子。插入层和导电聚合物中的兼容性允许电介质基板布线层上的端子相对于模具上的触点的相对运动，并且因此减轻由不同的热膨胀引起的剪切力。该装置提供了类似于通过翻转接合实现的紧凑的封装结构，但是具有显着提高的耐热循环损伤性。此外，封装结构允许包装的标准化，使得几个公司可以制造被包装的竞争芯片，使得最终的封装结构在最终用户方面大致相同。

6. 发明授权

US6020220A Compliant semiconductor chip assemblies and methods of making same 失效
标题翻译：符合标准的半导体芯片组件及其制造方法
公开(公告)号：US6020220A
公开(公告)日：2000-02-01
申请号：US709470
申请日：1996-09-05
申请人： Kenneth B. Gilleo , Gary W. Grube , Gaetan Mathieu
发明人： Kenneth B. Gilleo , Gary W. Grube , Gaetan Mathieu
IPC分类号： H01L21/60 , H01L23/31 , H01L23/498 , H01L21/44
CPC分类号： H01L24/83 , H01L23/3114 , H01L23/4985 , H01L24/29 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/05573 , H01L2224/0558 , H01L2224/1134 , H01L2224/13082 , H01L2224/13144 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/45144 , H01L2224/73204 , H01L2224/81191 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/15311 , H01L2924/3011 , H01L2924/351
摘要： A semiconductor chip package assembly is mounted to contact pads on a die. A compliant interposer layer is disposed between the die and a dielectric substrate wiring layer. The contacts on the die are connected to terminals on the compliant interposer layer by means of a compliant, conductive polymer extending through apertures in the interposer layer. Compliancy in the interposer layer and in the conductive polymer permits relative movement of the terminals on the dielectric substrate wiring layer to the contacts on the die and hence relieves the shear forces caused by differential thermal expansion. The arrangement provides a compact packaged structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage. Further, the packaged structure allows the standardization of the packages such that several companies can make competing chips that are packaged such that the resultant packaged structures are roughly the same as far as the end user is concerned.
摘要翻译：将半导体芯片封装组件安装到管芯上的接触焊盘。在芯片和电介质基板布线层之间设置顺应性插入层。芯片上的触点通过延伸穿过插入层中的孔的柔性导电聚合物连接到顺应性插入层上的端子。插入层和导电聚合物中的兼容性允许电介质基板布线层上的端子相对于模具上的触点的相对运动，并且因此减轻由不同的热膨胀引起的剪切力。该装置提供了类似于通过倒装芯片接合实现的紧凑封装结构，但是具有显着提高的耐热循环损伤性。此外，封装结构允许包装的标准化，使得几个公司可以制造被包装的竞争芯片，使得最终的封装结构在最终用户方面大致相同。

7. 发明申请

US20080042668A1 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 有权
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：US20080042668A1
公开(公告)日：2008-02-21
申请号：US11877466
申请日：2007-10-23
申请人： Benjamin Eldridge , Gary Grube , Eric Hobbs , Gaetan Mathieu , Makarand Shinde , Alexander Slocum , A. Sporck , Thomas Watson
发明人： Benjamin Eldridge , Gary Grube , Eric Hobbs , Gaetan Mathieu , Makarand Shinde , Alexander Slocum , A. Sporck , Thomas Watson
IPC分类号： G01R1/073
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

8. 发明申请

US20070265795A1 Air Bridge Structures And Methods Of Making And Using Air Bridge Structures 失效
标题翻译：空气桥梁结构与制造和使用空气桥梁结构的方法
公开(公告)号：US20070265795A1
公开(公告)日：2007-11-15
申请号：US11382458
申请日：2006-05-09
申请人： Gaetan Mathieu
发明人： Gaetan Mathieu
IPC分类号： G06F19/00
CPC分类号： G06F11/30 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y70/00 , G01R1/07378 , G01R3/00 , G01R31/2889 , H01L2224/48091 , H01L2224/48464 , H01L2924/00014
摘要： A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic device to be tested, and a plurality of electrically conductive data paths connecting the tester interface and the probes. At least one of the data paths can comprise an air bridge structure trace comprising an electrically conductive trace spaced away from an electrically conductive plate by a plurality of pylons.
摘要翻译：根据本发明的一些实施例的探针卡组件可以包括测试器接口，其被配置为与测试控制器进行电连接，多个导电探针被设置成接触要测试的电子设备的端子，以及多个连接测试仪接口和探头的导电数据路径。数据路径中的至少一个可以包括空气桥结构迹线，其包括通过多个塔架与导电板间隔开的导电迹线。

9. 发明申请

US20070054513A1 METHODS OF FABRICATING AND USING SHAPED SPRINGS 审中-公开
标题翻译：制作和使用形状弹簧的方法
公开(公告)号：US20070054513A1
公开(公告)日：2007-03-08
申请号：US11554485
申请日：2006-10-30
申请人： Gaetan Mathieu , Benjamin Eldridge , Stuart Wenzel
发明人： Gaetan Mathieu , Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01R12/00
CPC分类号： H01L24/13 , G01R1/06761 , G01R1/07342 , G01R1/07378 , G01R3/00 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H05K3/326 , H05K3/4092 , H05K2201/0308 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49204 , Y10T29/49222 , Y10T29/49224 , H01L2924/00
摘要： A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.
摘要翻译：一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形。

10. 发明申请

US20060191136A1 Method Of Making Microelectronic Spring Contact Array 审中-公开
标题翻译：制作微电子弹簧接触阵列的方法
公开(公告)号：US20060191136A1
公开(公告)日：2006-08-31
申请号：US11382756
申请日：2006-05-11
申请人： Benjamin Eldridge , Gaetan Mathieu , Carl Reynolds
发明人： Benjamin Eldridge , Gaetan Mathieu , Carl Reynolds
IPC分类号： H01R43/00 , H05K3/10
CPC分类号： G01R1/06744 , G01R1/06733 , G01R3/00 , Y10T29/49139 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224
摘要： A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.
摘要翻译：制造微电子弹簧接触阵列的方法包括在牺牲衬底上形成多个弹簧触点，然后从牺牲衬底释放弹簧触头。每个弹簧触点具有带有基端的细长梁。制造阵列的方法包括在它们已经从牺牲基板完全释放之后将其基端处的弹簧触点附接到基底基板，使得每个触点从基底延伸到其波束的远端。远端与预定阵列的尖端位置对准。在本发明的一个实施例中，通过在牺牲衬底上的牺牲层中图形地形成弹簧触点的轮廓来形成弹簧触点。牺牲层中的图案化凹槽的壁限定弹簧触点的侧面轮廓，并且导电材料沉积在凹部中以形成弹簧触点的细长梁。

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