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1. 发明授权

US07084532B2 Decoupling of actuators for positioning an object 有权
标题翻译：用于定位物体的执行器的去耦
公开(公告)号：US07084532B2
公开(公告)日：2006-08-01
申请号：US10792472
申请日：2004-03-03
申请人： Gary Peter Widdowson , Man Chung Raymond Ng , Yen Hsi Terry Tang
发明人： Gary Peter Widdowson , Man Chung Raymond Ng , Yen Hsi Terry Tang
IPC分类号： H02K41/00
CPC分类号： H02K41/031 , H02K2201/18
摘要： The invention provides an apparatus and a method for positioning an object coupled to a first support structure and a second support structure. A first actuator drives the first support structure along a first axis and a second actuator drives the first support structure along a second axis orthogonal to the first axis. A third actuator comprising a forcer and a stator is provided for driving the second support structure that is guided for movement relative to the first support structure along a third axis orthogonal to the first and second axes. The forcer is coupled to the second support structure and is movable with respect to the stator, and the stator is relatively stationary and decoupled from the second support structure.
摘要翻译：本发明提供一种用于定位耦合到第一支撑结构和第二支撑结构的物体的装置和方法。第一致动器沿着第一轴驱动第一支撑结构，第二致动器沿着与第一轴正交的第二轴驱动第一支撑结构。第三致动器包括一个锻炼器和一个定子，用于驱动第二支撑结构，该第二支撑结构被引导以相对于第一支撑结构沿着与第一和第二轴正交的第三轴线移动。推进器联接到第二支撑结构并且可相对于定子移动，并且定子相对静止并与第二支撑结构分离。

2. 发明授权

US07179346B2 Semiconductor apparatus with multiple delivery devices for components 有权
标题翻译：具有用于部件的多个输送装置的半导体装置
公开(公告)号：US07179346B2
公开(公告)日：2007-02-20
申请号：US10454259
申请日：2003-06-03
申请人： Kui Kam Lam , Man Chung Raymond Ng , Yen Hsi Terry Tang
发明人： Kui Kam Lam , Man Chung Raymond Ng , Yen Hsi Terry Tang
IPC分类号： B32B37/00 , H01L21/52
CPC分类号： H01L21/67144 , Y10T156/1092 , Y10T156/1097 , Y10T156/12 , Y10T156/1707 , Y10T156/1754 , Y10T156/1776
摘要： An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.
摘要翻译：提供了一种装置，用于在半导体处理期间将组件从元件供应部件中的拾取位置传送到接收器（例如管芯焊盘）上的放置位置。其包括第一输送装置和第二输送装置，其可操作以将部件从拾取位置交替地转移到放置位置。第二输送装置围绕穿过拾取位置和放置位置的线布置成与第一输送装置相对。

3. 发明授权

US07648901B2 Manufacturing process and apparatus therefor utilizing reducing gas 有权
标题翻译：利用还原气的制造方法及其装置
公开(公告)号：US07648901B2
公开(公告)日：2010-01-19
申请号：US11536051
申请日：2006-09-28
申请人： Ping Liang Tu , Deming Liu , Kui Kam Lam , Man Chung Raymond Ng
发明人： Ping Liang Tu , Deming Liu , Kui Kam Lam , Man Chung Raymond Ng
IPC分类号： H01L21/44
CPC分类号： B23K1/008 , B23K2101/40
摘要： A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.
摘要翻译：因此，提供了一种制造工艺和装置，用于在加工期间处理包括可氧化材料的电子装置。电子设备位于室内并用加热器加热处理温度。通过在加工温度下处理电子装置的同时供应包含乙醇酸蒸汽的气体，在室中产生还原性气氛。

4. 发明授权

US06991967B2 Apparatus and method for die attachment 有权
标题翻译：模具附件的装置和方法
公开(公告)号：US06991967B2
公开(公告)日：2006-01-31
申请号：US10785293
申请日：2004-02-23
申请人： Deming Liu , Ran Fu , Kui Kam Lam , Man Chung Raymond Ng , Wai Yuen Cheung
发明人： Deming Liu , Ran Fu , Kui Kam Lam , Man Chung Raymond Ng , Wai Yuen Cheung
IPC分类号： H01L21/44
CPC分类号： H01L24/83 , H01L21/67132 , H01L23/49861 , H01L24/29 , H01L24/75 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/83191 , H01L2224/83801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H01L2924/30107 , H01L2924/00 , H01L2924/00015
摘要： The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.
摘要翻译：本发明提供一种用于芯片附着到包括非金属材料的基板上的设备，以及适于接收具有共晶涂层的模具的金属材料。提供加热导管，通过该加热导管可移动基板，以将金属材料加热至共晶接合温度，以便于在模具附着位置处与模具和金属材料之间的结合。在将模具附接到金属材料上之前，在芯片附着位置处的感应加热装置将基板的金属材料加热至共晶粘合温度。

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