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1. 发明授权

US06269510B1 Post CMP clean brush with torque monitor 失效
标题翻译：后置CMP清洁刷与扭矩监视器
公开(公告)号：US06269510B1
公开(公告)日：2001-08-07
申请号：US09225073
申请日：1999-01-04
申请人： Gary Joseph Beardsley , Timothy Scott Bullard , Cuc Kim Huynh , Theodore Gerard van Kessel , David Louis Walker
发明人： Gary Joseph Beardsley , Timothy Scott Bullard , Cuc Kim Huynh , Theodore Gerard van Kessel , David Louis Walker
IPC分类号： A46B1304
CPC分类号： H01L21/67259 , H01L21/67046 , H01L21/67253 , Y10S134/902
摘要： An apparatus for and method of detecting the presence of a brush used in a semiconductor wafer cleaner for post-CMP processing is described. Semiconductor wafers are loaded into the wet environment of the wafer cleaner, affixed to a rotatable fixture and rotated at high speed. The rotatable fixture is effectuated by a servo motor linked to a servo controller and a torque monitor. A first torque on the rotating wafer is calculated prior to the start of the brush cleaning cycle. During the brush cleaning cycle, as the brush within the brush cleaner contacts the rotating wafer, the torque on the wafer increases and a second torque is calculated. If, during the brush cleaning cycle, the second torque calculation is substantially equal to the first torque calculation, the brush cleaner is not contacting the wafer and cleaning has not progressed. A tool user can be notified to reaffix the brush within the cleaner. When the second torque calculation is greater than expected, the tool user can be notified that the brush downforce has been improperly set. Inadequate removal of CMP residue is detected before entire wafer lots have passed through an ineffective brush cleaning cycle prior to an inspection point.
摘要翻译：描述了用于检测用于后CMP处理的半导体晶片清洁器中的刷子的存在的装置和方法。将半导体晶片装载到晶片清洁器的湿润环境中，固定到可旋转夹具并以高速旋转。可旋转夹具由连接到伺服控制器和扭矩监视器的伺服电机实现。在刷清洁循环开始之前计算旋转晶片上的第一转矩。在刷清洁循环期间，当刷子清洁器内的刷子接触旋转晶片时，晶片上的扭矩增加并且计算第二转矩。如果在刷清洁循环期间，第二扭矩计算基本上等于第一扭矩计算，则刷清洁器不接触晶片，并且清洁没有进行。可以通知工具用户以清理清洁剂中的刷子。当第二扭矩计算大于预期时，可以通知工具用户刷子下压力未正确设置。在整个晶片批次在检查点之前通过无效的刷子清洁循环之前，检测到不充分的CMP残留物的去除。

2. 发明授权

US06179693B2 In-situ/self-propelled polishing pad conditioner and cleaner 失效
标题翻译：原位/自推进抛光垫调节剂和清洁剂
公开(公告)号：US06179693B2
公开(公告)日：2001-01-30
申请号：US09166785
申请日：1998-10-06
申请人： Gary Joseph Beardsley , Cuc Kim Huynh , David Louis Walker
发明人： Gary Joseph Beardsley , Cuc Kim Huynh , David Louis Walker
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B53/013 , B24B53/12
摘要： A non-motorized polishing pad conditioner and cleaner having a free-wheeling conditioner head with a plurality of channels to direct the flow of a cleansing fluid; a hollow shaft connected to a fluid source; and a conditioning pad to facilitate loosening the debris found on a polishing pad wherein the pad conditioner and cleaner is self-propelled upon contact with a rotating polishing pad. A cantilever may be used to attach the conditioner and cleaner adjacent to the polishing apparatus. The cantilever may contain a motorized element for extending and retracting the conditioner and cleaner over the radius of a polishing pad such that the entire surface of the polishing pad may be conditioned and cleaned. A method of conditioning and cleaning a polishing pad while simultaneously polishing a silicon wafer is also described.
摘要翻译：一种非机动化抛光垫调节剂和清洁器，具有具有多个通道以引导清洗流体流动的续流调节头; 连接到流体源的空心轴; 以及调节垫以便于松动在抛光垫上发现的碎屑，其中垫调节剂和清洁剂在与旋转的抛光垫接触时自行推进。可以使用悬臂将附着在抛光装置上的护发素和清洁剂。悬臂可以包含用于在调整器和清洁器的半径上延伸和缩回抛光垫的电动元件，使得抛光垫的整个表面可以被调节和清洁。还描述了在同时抛光硅晶片的同时调整和清洁抛光垫的方法。

3. 发明授权

US06352596B2 Post CMP cleaning method using a brush cleaner with torque monitor 失效
标题翻译：后CMP清洁方法使用带有扭矩监视器的清洁刷
公开(公告)号：US06352596B2
公开(公告)日：2002-03-05
申请号：US09876583
申请日：2001-06-07
申请人： Gary Joseph Beardsley , Timothy Scott Bullard , Cuc Kim Huynh , Theodore Gerard van Kessel , David Louis Walker
发明人： Gary Joseph Beardsley , Timothy Scott Bullard , Cuc Kim Huynh , Theodore Gerard van Kessel , David Louis Walker
IPC分类号： A46B1304
CPC分类号： H01L21/67259 , H01L21/67046 , H01L21/67253 , Y10S134/902
摘要： A method of detecting the presence of a brush used in a semiconductor wafer cleaner for post-CMP processing is described. Semiconductor wafers are loaded into the wet environment of the wafer cleaner, affixed to a rotatable fixture and rotated at high speed. The rotatable fixture is effectuated by a servo motor linked to a servo controller and a torque monitor. A first torque on the rotating wafer is calculated prior to the start of the brush cleaning cycle. During the brush cleaning cycle, as the brush within the brush cleaner contacts the rotating wafer, the torque on the wafer increases and a second torque is calculated. If, during the brush cleaning cycle, the second torque calculation is substantially equal to the first torque calculation, the brush cleaner is not contacting the wafer and cleaning has not progressed. A tool user can be notified to reaffix the brush within the cleaner. When the second torque calculation is greater than expected, the tool user can be notified that the brush downforce has been improperly set. Inadequate removal of CMP residue is detected before entire wafer lots have passed through an ineffective brush cleaning cycle prior to an inspection point.
摘要翻译：描述了用于后CMP处理的用于半导体晶片清洁器中的刷子的存在的方法。将半导体晶片装载到晶片清洁器的湿润环境中，固定到可旋转夹具并以高速旋转。可旋转夹具由连接到伺服控制器和扭矩监视器的伺服电机实现。在刷清洁循环开始之前计算旋转晶片上的第一转矩。在刷清洁循环期间，当刷子清洁器内的刷子接触旋转晶片时，晶片上的扭矩增加并且计算第二转矩。如果在刷清洁循环期间，第二扭矩计算基本上等于第一扭矩计算，则刷清洁器不接触晶片，并且清洁没有进行。可以通知工具用户以清理清洁剂中的刷子。当第二扭矩计算大于预期时，可以通知工具用户刷子下压力未正确设置。在整个晶片批次在检查点之前通过无效的刷子清洁循环之前，检测到不充分的CMP残留物的去除。

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