专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08021965B1 Inter-chip communication 有权
标题翻译：芯片间通信
公开(公告)号：US08021965B1
公开(公告)日：2011-09-20
申请号：US11599374
申请日：2006-11-15
申请人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Liu
发明人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Liu
IPC分类号： H01L21/78 , H01L21/46 , H01L21/301
CPC分类号： H01L24/67 , H01L23/60 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/66 , H01L24/72 , H01L24/73 , H01L24/82 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L25/167 , H01L25/18 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/48227 , H01L2224/49175 , H01L2224/81141 , H01L2224/81224 , H01L2225/0651 , H01L2225/06551 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10156 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H05K1/181 , H05K1/182 , H05K3/326 , H05K3/328 , H05K2201/0314 , H05K2201/10454 , H05K2201/10909 , Y02P70/611 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
摘要翻译：本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

2. 发明授权

US07608919B1 Interconnect packaging systems 有权
标题翻译：互连包装系统
公开(公告)号：US07608919B1
公开(公告)日：2009-10-27
申请号：US11599257
申请日：2006-11-15
申请人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Liu
发明人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Liu
IPC分类号： H01L23/02 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/67 , H01L23/60 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/66 , H01L24/72 , H01L24/73 , H01L24/82 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L25/167 , H01L25/18 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/48227 , H01L2224/49175 , H01L2224/81141 , H01L2224/81224 , H01L2225/0651 , H01L2225/06551 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10156 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H05K1/181 , H05K1/182 , H05K3/326 , H05K3/328 , H05K2201/0314 , H05K2201/10454 , H05K2201/10909 , Y02P70/611 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
摘要翻译：本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

3. 发明授权

US08623700B1 Inter-chip communication 有权
标题翻译：芯片间通信
公开(公告)号：US08623700B1
公开(公告)日：2014-01-07
申请号：US11599283
申请日：2006-11-15
申请人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Liu
发明人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Liu
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L24/67 , H01L23/60 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/66 , H01L24/72 , H01L24/73 , H01L24/82 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L25/167 , H01L25/18 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/48227 , H01L2224/49175 , H01L2224/81141 , H01L2224/81224 , H01L2225/0651 , H01L2225/06551 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10156 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H05K1/181 , H05K1/182 , H05K3/326 , H05K3/328 , H05K2201/0314 , H05K2201/10454 , H05K2201/10909 , Y02P70/611 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
摘要翻译：本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

4. 发明授权

US07612443B1 Inter-chip communication 有权
标题翻译：芯片间通信
公开(公告)号：US07612443B1
公开(公告)日：2009-11-03
申请号：US10933417
申请日：2004-09-03
申请人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Lui
发明人： Gary H. Bernstein , Patrick Fay , Wolfgang Porod , Qing Lui
IPC分类号： H01L23/02 , H01L23/34 , H01L23/04
CPC分类号： H01L24/67 , H01L23/60 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/24 , H01L24/48 , H01L24/49 , H01L24/66 , H01L24/72 , H01L24/73 , H01L24/82 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/16 , H01L25/167 , H01L25/18 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/13099 , H01L2224/48227 , H01L2224/49175 , H01L2224/81141 , H01L2224/81224 , H01L2225/0651 , H01L2225/06551 , H01L2225/06562 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10156 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H05K1/181 , H05K1/182 , H05K3/326 , H05K3/328 , H05K2201/0314 , H05K2201/10454 , H05K2201/10909 , Y02P70/611 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.
摘要翻译：本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

5. 发明授权

US08058906B2 Non-majority MQCA magnetic logic gates and arrays based on misaligned magnetic islands 有权
标题翻译：非多数MQCA磁逻辑门和基于不对准磁岛的阵列
公开(公告)号：US08058906B2
公开(公告)日：2011-11-15
申请号：US12816777
申请日：2010-06-16
申请人： Michael T. Niemier , Mohammad T. Alam , Gary H. Bernstein , Xiaobo Sharon Hu , Wolfgang Porod , Edit Varga
发明人： Michael T. Niemier , Mohammad T. Alam , Gary H. Bernstein , Xiaobo Sharon Hu , Wolfgang Porod , Edit Varga
IPC分类号： H03K19/20 , H03K19/21 , G06F7/50
CPC分类号： G11C11/14 , B82Y10/00 , B82Y25/00 , G11C19/0808 , Y10S977/859 , Y10S977/94
摘要： A non-majority magnetic logic gate device for use in constructing compact and power efficient logical magnetic arrays is presented. The non-majority magnetic logic gate device includes a substrate, symmetrically aligned magnetic islands (SAMIs), at least one misaligned magnetic island (MAMI), magnetic field inputs (MFIs), and at least one magnetic field output (MFO). The SAMIs and MAMI are electrically isolated from each other but are magnetically coupled to one another through their respective magnetic fringe fields. The MAMI is geometrically and/or angularly configured to exhibit a magnetization ground state bias which is dependent upon which direction the applied magnetic clock field is swept. Non-majority logic gates can be made from layouts containing the SAMIs and the MAMI which contain a smaller number of components as comparable majority logic gate layouts.
摘要翻译：提出了一种用于构建紧凑且功率高的逻辑磁阵列的非多数磁逻辑门装置。非多数磁逻辑门装置包括对称对准的磁岛（SAMI），至少一个不对准磁岛（MAMI），磁场输入（MFI）和至少一个磁场输出（MFO））的衬底。 SAMI和MAMI彼此电隔离，但是通过它们各自的磁性边缘磁场彼此磁耦合。 MAMI是几何和/或成角度地构造成表现出取决于施加的磁时钟域被扫描的方向的磁化基态偏置。非多数逻辑门可以由包含较少数量的组件的SAMI和MAMI的布局构成为可比较的多数逻辑门布局。

6. 发明申请

US20100315123A1 NON-MAJORITY MQCA MAGNETIC LOGIC GATES AND ARRAYS BASED ON MISALIGNED MAGNETIC ISLANDS 有权
标题翻译：非主要MQCA磁性门阵列和基于缺陷磁性岛的阵列
公开(公告)号：US20100315123A1
公开(公告)日：2010-12-16
申请号：US12816777
申请日：2010-06-16
申请人： Michael T. Niemier , Mohammad T. Alam , Gary H. Bernstein , Xiaobo Sharon Hu , Wolfgang Porod , Edit Varga
发明人： Michael T. Niemier , Mohammad T. Alam , Gary H. Bernstein , Xiaobo Sharon Hu , Wolfgang Porod , Edit Varga
IPC分类号： H03K19/21 , H03K19/20 , H01L29/82
CPC分类号： G11C11/14 , B82Y10/00 , B82Y25/00 , G11C19/0808 , Y10S977/859 , Y10S977/94
摘要： A non-majority magnetic logic gate device for use in constructing compact and power efficient logical magnetic arrays is presented. The non-majority magnetic logic gate device includes a substrate, symmetrically aligned magnetic islands (SAMIs), at least one misaligned magnetic island (MAMI), magnetic field inputs (MFIs), and at least one magnetic field output (MFO). The SAMIs and MAMI are electrically isolated from each other but are magnetically coupled to one another through their respective magnetic fringe fields. The MAMI is geometrically and/or angularly configured to exhibit a magnetization ground state bias which is dependent upon which direction the applied magnetic clock field is swept. Non-majority logic gates can be made from layouts containing the SAMIs and the MAMI which contain a smaller number of components as comparable majority logic gate layouts.
摘要翻译：提出了一种用于构建紧凑且功率高的逻辑磁阵列的非多数磁逻辑门装置。非多数磁逻辑门装置包括对称对准的磁岛（SAMI），至少一个不对准磁岛（MAMI），磁场输入（MFI）和至少一个磁场输出（MFO））的衬底。 SAMI和MAMI彼此电隔离，但是通过它们各自的磁性边缘磁场彼此磁耦合。 MAMI是几何和/或成角度地构造成表现出取决于施加的磁时钟域被扫描的方向的磁化基态偏置。非多数逻辑门可以由包含较少数量的组件的SAMI和MAMI的布局构成为可比较的多数逻辑门布局。

7. 发明授权

US06594894B1 Planar-processing compatible metallic micro-extrusion process 失效
标题翻译：平面加工兼容的金属微挤出工艺
公开(公告)号：US06594894B1
公开(公告)日：2003-07-22
申请号：US09578064
申请日：2000-05-24
申请人： Gary H. Bernstein , Richard Frankovic
发明人： Gary H. Bernstein , Richard Frankovic
IPC分类号： H01R4302
CPC分类号： B81C1/00492 , B81B2203/0361 , Y10T29/49204 , Y10T29/49213
摘要： Micromachined extrusions on the micrometer scale is realized using compressive stresses resulting from electromigration-induced mass transport in planarized conductors. Extrusions are formed through simple die patterns etched through a passivation layer overlaying the conductors.
摘要翻译：在平面化导体中由电迁移引起的质量传递产生的压缩应力，实现微米尺度上的微机械加工。挤出通过通过覆盖导体的钝化层蚀刻的简单的模具图案形成。

8. 发明授权

US06364889B1 Electronic lancing device 有权
标题翻译：电子穿刺装置
公开(公告)号：US06364889B1
公开(公告)日：2002-04-02
申请号：US09441970
申请日：1999-11-17
申请人： Mohammad A. Kheiri , Joseph E. Ruggiero , Gary H. Bernstein
发明人： Mohammad A. Kheiri , Joseph E. Ruggiero , Gary H. Bernstein
IPC分类号： A61B1714
CPC分类号： A61B5/15194 , A61B5/150022 , A61B5/150183 , A61B5/150412 , A61B5/150824 , A61B5/15113 , A61B5/15123
摘要： It has been discovered that the use of a substantially free-standing voice coil within a lancing device in coordination and combination with a stationary magnet and electronic circuit renders a much improved lancing device. The minimal weight of the free standing voice coil and the attractive forces of the magnet allow the battery-powered electronic circuit to maintain excellent control over the advancement and retraction of a lancet. When the electronic lancing device is initiated by a user, the voltage source within the electronic lancing device provides sufficient current through the voice coil such that the coil and lancet are repulsed from the magnet and propelled into the puncture site. The voltage source subsequently reverses the current through the voice coil to supply sufficient attractive current through the voice coil such that the dwell time of the lancet is minimized and the lancet is retracted from the puncture site and pulled toward the magnet within the housing of the electronic lancing device.
摘要翻译：已经发现，与固定磁体和电子电路协调并组合在采血装置内使用基本上独立的音圈使得大大改进的穿刺装置。独立音圈的最小重量和磁铁的吸引力使得电池供电的电子电路能够对刺血针的前进和缩回保持优异的控制。当电子穿刺装置由用户启动时，电子穿刺装置内的电压源通过音圈提供足够的电流，使得线圈和刺血针从磁体排斥并推进穿刺部位。电压源随后反转通过音圈的电流，以通过音圈提供足够的吸引电流，使得柳叶刀的停留时间最小化，并且刺血针从穿刺位置缩回并被拉向电子机壳内的磁体穿刺装置

9. 发明授权

US4962410A QUADFET-A novel field effect transistor 失效
标题翻译： QUADFET-A型场效应晶体管
公开(公告)号：US4962410A
公开(公告)日：1990-10-09
申请号：US389760
申请日：1989-08-04
申请人： Alfred M. Kriman , Gary H. Bernstein
发明人： Alfred M. Kriman , Gary H. Bernstein
IPC分类号： H01L29/423 , H01L29/772
CPC分类号： H01L29/42316 , H01L29/772
摘要： A quantum diffraction field effect transistor ("QUADFET"), a new class of semiconductors which exploits the phenomenon of electron diffraction to produce novel circuit characteristics.
摘要翻译：量子衍射场效应晶体管（“QUADFET”）是利用电子衍射现象产生新颖电路特性的新一类半导体。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式