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    • 6. 发明授权
    • Method for fabricating nanocoils
    • 制造纳米线的方法
    • US07514301B2
    • 2009-04-07
    • US11524246
    • 2006-09-21
    • Garrett A. StoraskaRobert S. Howell
    • Garrett A. StoraskaRobert S. Howell
    • H01L21/00H01L21/84
    • H01L27/1203B81C1/0019B82Y10/00B82Y30/00H01F41/041H01L21/84H01L27/10
    • A method for fabricating nanocoils and improved nanocoils fabricated therefrom. Embodiments of the method utilizing deep reactive ion etching (DRIE). A method for fabricating nanocoils includes providing a silicon-on-insulator (SOI) wafer, in which SOI wafer includes buried oxide layer, patterning one or more devices into a layer of silicon on top of the buried oxide layer, depositing tensile stressed nitride layer on the top silicon layer, patterning coiling arm structure on top silicon layer, patterning an overlapping etch window mask on bottom side of SOI wafer using, in which patterning overlapping etch window mask removes SOI wafer and exposes buried oxide layer in width greater than coiling arm structure, and releasing coiling arm structure so that coiling arm coils to form nanocoil. In embodiments, DRIE is utilized to pattern the overlapping etch window mask.
    • 一种用于制造纳米线和由其制造的改进的纳米薄膜的方法。 利用深反应离子蚀刻(DRIE)的方法的实施例。 制造纳米线的方法包括提供绝缘体上硅(SOI)晶片,其中SOI晶片包括掩埋氧化物层,将一个或多个器件图案化成掩埋氧化物层顶部的硅层,沉积拉应力氮化物层 在顶层硅层上,在顶部硅层上图案化卷取臂结构,在SOI晶片的底侧上构图重叠的蚀刻窗口掩模,其中图案化重叠的蚀刻窗口掩模移除SOI晶片并暴露出大于卷取臂的宽度的掩埋氧化物层 结构和释放卷取臂结构,使卷绕臂线圈形成纳米油。 在实施例中,DRIE用于对重叠的蚀刻窗口掩模进行图案化。
    • 8. 发明申请
    • METHOD FOR FABRICATING NANOCOILS
    • 制备纳米微粒的方法
    • US20090053860A1
    • 2009-02-26
    • US11524246
    • 2006-09-21
    • Garrett A. StoraskaRobert S. Howell
    • Garrett A. StoraskaRobert S. Howell
    • H01L21/00
    • H01L27/1203B81C1/0019B82Y10/00B82Y30/00H01F41/041H01L21/84H01L27/10
    • A method for fabricating nanocoils and improved nanocoils fabricated therefrom. Embodiments of the method utilizing deep reactive ion etching (DRIE). A method for fabricating nanocoils includes providing a silicon-on-insulator (SOI) wafer, in which SOI wafer includes buried oxide layer, patterning one or more devices into a layer of silicon on top of the buried oxide layer, depositing tensile stressed nitride layer on the top silicon layer, patterning coiling arm structure on top silicon layer, patterning an overlapping etch window mask on bottom side of SOI wafer using, in which patterning overlapping etch window mask removes SOI wafer and exposes buried oxide layer in width greater than coiling arm structure, and releasing coiling arm structure so that coiling arm coils to form nanocoil. In embodiments, DRIE is utilized to pattern the overlapping etch window mask.
    • 一种用于制造纳米线和由其制造的改进的纳米薄膜的方法。 利用深反应离子蚀刻(DRIE)的方法的实施例。 制造纳米线的方法包括提供绝缘体上硅(SOI)晶片,其中SOI晶片包括掩埋氧化物层,将一个或多个器件图案化成掩埋氧化物层顶部的硅层,沉积拉应力氮化物层 在顶层硅层上,在顶部硅层上图案化卷取臂结构,在SOI晶片的底侧上构图重叠的蚀刻窗口掩模,其中图案化重叠的蚀刻窗口掩模移除SOI晶片并使掩埋氧化物层的宽度大于卷取臂 结构和释放卷取臂结构,使卷绕臂线圈形成纳米油。 在实施例中,DRIE用于对重叠的蚀刻窗口掩模进行图案化。
    • 9. 发明授权
    • System for fabricating nanocoils using a wet etch technique
    • 使用湿蚀刻技术制造纳米线的系统
    • US07871529B2
    • 2011-01-18
    • US12693875
    • 2010-01-26
    • Garrett A. StoraskaRobert S. Howell
    • Garrett A. StoraskaRobert S. Howell
    • H01L27/08
    • H01L27/1203B81C1/0019B82Y10/00B82Y30/00H01F41/041H01L21/84H01L27/10
    • Novel applications of nanocoil technology and novel methods of fabricating nanocoils for use in such applications and others. Such applications include microscopic electro-mechanical systems (MEMS) devices including nanocoil mirrors, nanocoil actuators and nanocoil antenna arrays. Inductors or traveling wave tubes fabricated from nanocoils are also included. A method for fabricating nanocoils with a desired pitch includes determining a desired pitch for fabricated nanocoil, selecting coiling arm orientation in which coiling arm orientation is arm angle between coiling arm an crystalline orientation of underlying substrate, whereby coiling arm orientation affects pitch of fabricated nanocoil, patterning coiling arm structure with selected coiling arm orientation, and, releasing coiling arm, whereby fabricated nanocoil is formed.
    • 纳米线技术的新应用和制造纳米线的新方法用于这些应用和其他应用。 这样的应用包括微观机电系统(MEMS)装置,包括纳米油镜,纳米线驱动器和纳米线圈天线阵列。 还包括由纳米体系制造的电感器或行波管。 用于制造具有期望间距的纳米线圈的方法包括确定制造的纳米线圈的期望间距,选择卷取臂取向,其中卷取臂取向是卷绕臂之间的臂角,下面基底的结晶取向,由此卷取臂取向影响制造的纳米线的间距, 以选定的卷取臂取向构图卷取臂结构,以及释放卷取臂,从而形成制造的纳米油。
    • 10. 发明授权
    • Methods for fabricating nanocoils
    • 制造纳米线的方法
    • US07601620B2
    • 2009-10-13
    • US11524244
    • 2006-09-21
    • Garrett A. StoraskaRobert S. Howell
    • Garrett A. StoraskaRobert S. Howell
    • H01L21/00
    • H01L27/1203B81C1/0019B82Y10/00B82Y30/00H01F41/041H01L21/84H01L27/10
    • Improved nanocoils, systems and methods for fabricating nanocoils. Embodiments enable wet etching techniques for releasing coiling arm structures and forming nanocoils. A method for fabricating nanocoils includes providing a silicon-on-insulator (SOI) wafer in which SOI wafer includes a buried oxide layer, patterning one or more devices onto a silicon device layer on top of the buried oxide layer, depositing a tensile stressed layer on the silicon device layer so that stressed layer and silicon device layer form a stressed coiling bi-layer, patterning a coiling arm structure on the stressed coiling bi-layer, depositing a metal encapsulation layer on the stressed coiling bi-layer, and releasing the coiling arm structure so that coiling arm coils to form nanocoil. A system for fabricating nanocoils includes a substrate, a coiling arm structure including, a buried oxide layer deposited on the substrate, a stressed coiling bi-layer attached to the buried oxide layer including a silicon device layer that includes one or more devices defined thereon and a stressed nitride layer that provides a tensile coiling stress, and a metal encapsulation layer that protects stressed nitride layer from hydrofluoric (HF) acid used to release the coiling arm structure from the substrate during the wet etch technique so that coiling arm structure coils into nanocoil when released. Improved nanocoils may be fabricated according to these and other methods and systems.
    • 改进的纳米体系,制备纳米线的系统和方法。 实施例可以实现用于释放卷取臂结构和形成纳米油的湿蚀刻技术。 一种制造纳米薄膜的方法包括提供绝缘体上硅(SOI)晶片,其中SOI晶片包括掩埋氧化物层,将一个或多个器件图案化到掩埋氧化物层顶部的硅器件层上,沉积拉伸应力层 在硅器件层上,使得应力层和硅器件层形成应力卷绕双层,在应力卷绕双层上构图卷绕臂结构,在应力卷绕双层上沉积金属封装层,并释放 卷取臂结构,使卷绕臂线圈形成纳米线。 一种用于制造纳米线的系统包括基底,包括沉积在基底上的掩埋氧化物层的卷取臂结构,附着到掩埋氧化物层的应力卷绕双层,包括硅器件层,该硅器件层包括一个或多个在其上限定的器件, 提供拉伸卷取应力的应力氮化物层和在湿法蚀刻技术期间保护应力氮化物层免受氢氟酸(HF)酸从衬底释放卷取臂结构的金属封装层,使得卷取臂结构卷材成纳米油 释放时 根据这些和其他方法和系统可以制造改进的纳米薄膜。