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    • 6. 发明授权
    • Housing for electronic device and method of making the housing
    • 电子设备外壳和外壳制作方法
    • US08241480B2
    • 2012-08-14
    • US12563246
    • 2009-09-21
    • Gang HuangYan-Min WangQiang Wang
    • Gang HuangYan-Min WangQiang Wang
    • C25D5/02B01D57/02
    • C25D13/04C25D5/56C25D13/14C25D13/20H05K5/0243
    • A method of making a housing, comprising the steps of: providing a transparent plastic substrate, the substrate having an outer surface and an inner surface; coating at least portions of the outer surface with a photosensitizer; activating the substrate by using an energy ray to irradiate areas of the outer surface covered with the photosensitizer to form a conductive medium layer thereon; electroplating the activated substrate, an electroplated coating formed on the irradiated area in a predetermined pattern; forming an electrophoretic coating on the surface of the electroplated coating by an electrophoresis process; and forming a paint coating on the inner surface of the substrate. A housing made by the present method is provided.
    • 一种制造壳体的方法,包括以下步骤:提供透明塑料基底,所述基底具有外表面和内表面; 用光敏剂涂覆外表面的至少部分; 通过使用能量射线来照射被光敏剂覆盖的外表面的区域来激活基板,以在其上形成导电介质层; 电镀活化的基底,以预定图案形成在照射区域上的电镀涂层; 通过电泳方法在电镀涂层的表面上形成电泳涂层; 并在基材的内表面上形成涂料。 提供了通过本方法制成的壳体。