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1. 发明授权

US09223305B2 Semiconductor manufacturing system 有权
标题翻译：半导体制造系统
公开(公告)号：US09223305B2
公开(公告)日：2015-12-29
申请号：US13617950
申请日：2012-09-14
申请人： Gaku Ikeda , Koichi Miyashita , Takamasa Chikuma , Satoshi Gomi , Chunmui Li , Kunio Takano
发明人： Gaku Ikeda , Koichi Miyashita , Takamasa Chikuma , Satoshi Gomi , Chunmui Li , Kunio Takano
IPC分类号： G01N21/88 , G01N21/75 , G01N21/95 , G06F3/00 , G05B19/4065
CPC分类号： G05B19/4065 , G05B2219/32226 , Y02P90/14
摘要： A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.
摘要翻译：半导体制造系统包括：电路，被配置为执行：显示用于选择包括具有操作项目和/或检查项目的检查项目的检查集合的屏幕; 检索检查项目，按照工作流程顺序排列检查项目，并在屏幕上显示每个检查项目，其中执行属性指示每个检查项目是“自动”还是“手动”执行; 接收检查开始命令并从存储单元读取第一检查项目。电路还执行与以下情况（a）至（d）相对应的步骤，直到不再有检查项目：（a）作为操作项目的读出检查项目和“自动”; （b）作为操作项目的读出检查项目和“手册”; （c）读出的检查项目是检查项目和“自动”; 和（d）读出的检查项目是检查项目和“手册”。

2. 发明申请

US20130013240A1 SEMICONDUCTOR MANUFACTURING SYSTEM 有权
标题翻译：半导体制造系统
公开(公告)号：US20130013240A1
公开(公告)日：2013-01-10
申请号：US13617950
申请日：2012-09-14
申请人： Gaku Ikeda , Koichi Miyashita , Takamasa Chikuma , Satoshi Gomi , Chunmui Li , Kunio Takano
发明人： Gaku Ikeda , Koichi Miyashita , Takamasa Chikuma , Satoshi Gomi , Chunmui Li , Kunio Takano
IPC分类号： G01N37/00 , G06F19/00
CPC分类号： G05B19/4065 , G05B2219/32226 , Y02P90/14
摘要： A semiconductor manufacturing system includes a program for inspecting a device of the system executing: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The program also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.
摘要翻译：半导体制造系统包括用于检查执行系统的装置的程序：显示用于选择包括具有操作项目和/或检查项目的检查项目的检查集合的屏幕; 检索检查项目，按照工作流程顺序排列检查项目，并在屏幕上显示每个检查项目，其中执行属性指示每个检查项目是自动还是手动执行; 接收检查开始命令并从存储单元读取第一检查项目。该程序还执行与以下情况（a）至（d）相对应的步骤，直到不再有检查项目：（a）作为操作项目的读出检查项目并自动; （b）读出的检查项目是操作项目和手册; （c）读出检查项目为检查项目并自动; 和（d）读出的检查项目是检查项目和手册。

3. 发明申请

US20090259335A1 Substrate Processing System 审中-公开
标题翻译：基板加工系统
公开(公告)号：US20090259335A1
公开(公告)日：2009-10-15
申请号：US12085572
申请日：2006-11-28
申请人： Gaku Ikeda , Keiji Osada , Kunio Takano
发明人： Gaku Ikeda , Keiji Osada , Kunio Takano
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67745
摘要： When a wafer (W101) to be returned from a second cluster (12) to a first cluster (10) is delivered to a pass area (PA), a vacuum transfer robot (RB1) in the first cluster (10) performs serial transportation in the first cluster (10) preferentially while keeping the wafer (W101) at the pass area (PA). Subsequently, the vacuum transfer robot (RB1), holding a wafer (W104) to be sent from the first cluster (10) to the second cluster (12) by one arm thereof, receives the wafer (W101) existing in the pass area (PA) by the other arm thereof and delivers the wafer (W104) to the pass area (PA) instead, through pick and place operation. According to the procedure, throughput of continuous processing employing a plurality of process modules of two clusters (multi-chamber apparatuses) (10, 12) is improves as much as possible.
摘要翻译：当从第二集群（12）返回到第一集群（10）的晶片（W101）被传送到通过区域（PA）时，第一集群（10）中的真空传送机器人（RB1）执行串行传输在第一簇（10）中优先地将晶片（W101）保持在通过区域（PA）。随后，将通过其一个臂将从第一簇（10）发送到第二簇（12）的晶片（W104）的真空传送机器人（RB1）接收存在于通过区域中的晶片（W101） PA），并通过拾取和放置操作将晶片（W104）传送到通过区域（PA）。根据该过程，尽可能地提高采用多个集群的多个处理模块（多室装置）（10,12）的连续处理的吞吐量。

4. 发明授权

US07630785B2 Substrate processing system for setting uniform module cycle length and access control time lag in two pipeline processing systems 有权
标题翻译：基板处理系统，用于在两个流水线处理系统中设置均匀的模块周期长度和访问控制时滞
公开(公告)号：US07630785B2
公开(公告)日：2009-12-08
申请号：US11300309
申请日：2005-12-15
申请人： Gaku Ikeda
发明人： Gaku Ikeda
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32077 , G05B2219/32306 , G05B2219/45032 , Y02P90/083 , Y02P90/20
摘要： In a substrate processing system according to the present invention, module cycle periods at a plurality of process modules PM1 through PM4 connected around a transfer module TM having installed therein a vacuum pressure-side transfer robot RB1, each representing the sum of a wafer stay time including the wafer processing time and an attendant busy time during which the wafer is transferred before and after the wafer stay time, are all set to a uniform length. The vacuum pressure-side transfer robot RB1 takes out a processed wafer Wi and carries a next wafer Wi+1 to be processed next by executing a pick and place operation for each of the process modules PM1 through PM4 during a single access to the process module.
摘要翻译：在根据本发明的基板处理系统中，在安装有真空压力侧传送机器人RB1的传送模块TM周围连接的多个处理模块PM1至PM4的模块循环周期中，每个处理模块PM1至PM4表示晶片停留时间之和包括晶片处理时间和晶片在晶片停留时间之前和之后转移的伴随忙时间都被设置为均匀的长度。真空压力侧传送机器人RB1在处理模块单次访问期间，通过对每个处理模块PM1至PM4执行拾取和放置操作，从而处理处理后的晶片Wi并携带待处理的下一晶片Wi + 1 。

5. 发明申请

US20060155412A1 Substrate processing system and substrate processing program 有权
标题翻译：基板加工系统和基板加工程序
公开(公告)号：US20060155412A1
公开(公告)日：2006-07-13
申请号：US11300309
申请日：2005-12-15
申请人： Gaku Ikeda
发明人： Gaku Ikeda
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , G05B2219/32077 , G05B2219/32306 , G05B2219/45032 , Y02P90/083 , Y02P90/20
摘要： In a substrate processing system according to the present invention, module cycle periods at a plurality of process modules PM1 through PM4 connected around a transfer module TM having installed therein a vacuum pressure-side transfer robot RB1, each representing the sum of a wafer stay time including the wafer processing time and an attendant busy time during which the wafer is transferred before and after the wafer stay time, are all set to a uniform length. The vacuum pressure-side transfer robot RB1 takes out a processed wafer Wi and carries a next wafer Wi+1 to be processed next by executing a pick and place operation for each of the process modules PM1 through PM4 during a single access to the process module.
摘要翻译：在根据本发明的衬底处理系统中，在安装有真空的转移模块TM周围连接的多个处理模块PM1至PM4的多个模块循环周期分别表示包括晶片处理时间的晶片停留时间与在晶片停留时间之前和之后传送晶片的伴随忙时间之和的压力侧传送机器人RB 1 设置为一致的长度。真空压力侧输送机械手RB 1＆gt;取出处理后的晶片W＆lt; i＆gt;并携带下一个待处理的晶圆W 1 + 1＆lt; 1＆gt; 通过在对处理模块的单次访问期间执行针对每个处理模块PM _{1 至PM <4>的拾取和放置操作。}

6. 发明申请

US20060222236A1 Substrate positioning device, substrate positioning method and program 有权
标题翻译：基板定位装置，基板定位方法及程序
公开(公告)号：US20060222236A1
公开(公告)日：2006-10-05
申请号：US11384299
申请日：2006-03-21
申请人： Keiji Osada , Yasuhiko Nishinakayama , Gaku Ikeda , Hiroyuki Takahashi
发明人： Keiji Osada , Yasuhiko Nishinakayama , Gaku Ikeda , Hiroyuki Takahashi
IPC分类号： G06K9/00
CPC分类号： G03F9/7011 , H01L21/681
摘要： Noise reduction processing for detecting the circumferential edge of a wafer W placed on a rotary stage with a light-transmitting sensor, obtaining detection values provided by the light-transmitting sensor as substrate edge shape data, detecting sudden abnormal data in the substrate edge shape data, eliminating the detected sudden abnormal data and interpolating the substrate edge shape data with estimated data generated based upon surrounding data in place of the abnormal data, notch mark judgment processing for detecting a notch mark candidate in the substrate edge shape data having undergone the noise reduction processing and making a decision as to whether or not the sets of data corresponding to the notch mark candidate area satisfies a predetermined judgment condition, and substrate positioning processing for positioning the substrate based upon a notch mark that satisfies the predetermined judgment conditions are executed.
摘要翻译：利用透光传感器检测设置在旋转台上的晶片W的周缘的降噪处理，获得由透光传感器提供的检测值作为基板边缘形状数据，检测基板边缘形状数据中的突然异常数据消除检测到的突然异常数据，并且利用基于周围数据而生成的估计数据代替异常数据来内插基板边缘形状数据，用于检测已经经历了降噪的基板边缘形状数据中的切痕标记候补的切口标记判断处理处理并确定与凹口标记候选区域相对应的数据组是否满足预定判断条件，并且执行用于基于满足预定判断条件的凹口标记来定位衬底的衬底定位处理。

7. 发明申请

US20100080444A1 PROCESSING APPARATUS, PROCESSING METHOD, METHOD OF RECOGNIZING TARGET OBJECT AND STORAGE MEDIUM 审中-公开
标题翻译：处理装置，处理方法，识别目标对象和存储介质的方法
公开(公告)号：US20100080444A1
公开(公告)日：2010-04-01
申请号：US12614065
申请日：2009-11-06
申请人： Hirofumi Yamaguchi , Katsuhito Hirose , Gaku Ikeda
发明人： Hirofumi Yamaguchi , Katsuhito Hirose , Gaku Ikeda
IPC分类号： G06K9/00 , H01L21/68
CPC分类号： H01L21/681 , H01L21/67748
摘要： A CCD detector 30 captures an image of an arc shape of an outer periphery of a semiconductor wafer W that is on standby position W1 close to an inlet of a processing unit 1. A calculation unit 40 detects, from the captured image of the arc shape, positional data on multiple positions of the shape, obtains a phantom circle of the semiconductor wafer W, calculates center coordinates of the phantom circle, and calculates “information on positional displacement” of the semiconductor wafer W at the standby position W1. A controller 50 controls a transfer unit 12 based on the “information on displacement” to correct the position of the semiconductor wafer W on the processing unit 1.
摘要翻译： CCD检测器30捕获位于处于处理单元1的入口附近的待机位置W1的半导体晶片W的外周的弧形的图像。计算单元40从捕获的图像中检测出弧形，形状的多个位置的位置数据，得到半导体晶片W的假想圆，计算假想圆的中心坐标，并计算待机位置W1处的半导体晶片W的“位置偏移信息”。控制器50基于“关于位移的信息”来控制传送单元12，以校正处理单元1上的半导体晶片W的位置。

8. 发明授权

US07672502B2 Substrate positioning device, substrate positioning method and program 有权
标题翻译：基板定位装置，基板定位方法及程序
公开(公告)号：US07672502B2
公开(公告)日：2010-03-02
申请号：US11384299
申请日：2006-03-21
申请人： Keiji Osada , Yasuhiko Nishinakayama , Gaku Ikeda , Hiroyuki Takahashi
发明人： Keiji Osada , Yasuhiko Nishinakayama , Gaku Ikeda , Hiroyuki Takahashi
IPC分类号： G06K9/00
CPC分类号： G03F9/7011 , H01L21/681
摘要： Noise reduction processing for detecting the circumferential edge of a wafer W placed on a rotary stage with a light-transmitting sensor, obtaining detection values provided by the light-transmitting sensor as substrate edge shape data, detecting sudden abnormal data in the substrate edge shape data, eliminating the detected sudden abnormal data and interpolating the substrate edge shape data with estimated data generated based upon surrounding data in place of the abnormal data, notch mark judgment processing for detecting a notch mark candidate in the substrate edge shape data having undergone the noise reduction processing and making a decision as to whether or not the sets of data corresponding to the notch mark candidate area satisfies a predetermined judgment condition, and substrate positioning processing for positioning the substrate based upon a notch mark that satisfies the predetermined judgment conditions are executed.
摘要翻译：用透光传感器检测放置在旋转台上的晶片W的周缘的降噪处理，获得由透光传感器提供的检测值作为基板边缘形状数据，检测基板边缘形状数据中的突然异常数据消除检测到的突然异常数据，并且利用基于周围数据而生成的估计数据代替异常数据来内插基板边缘形状数据，用于检测已经经历了降噪的基板边缘形状数据中的切痕标记候补的切口标记判断处理处理并确定与凹口标记候选区域相对应的数据组是否满足预定判断条件，并且执行用于基于满足预定判断条件的凹口标记来定位衬底的衬底定位处理。

9. 发明申请

US20080171142A1 Film Deposition Method And Film Deposition System 审中-公开
标题翻译：膜沉积法和膜沉积系统
公开(公告)号：US20080171142A1
公开(公告)日：2008-07-17
申请号：US11883075
申请日：2006-01-11
申请人： Kenji Matsumoto , Tomoyuki Sakoda , Masayuki Nasu , Gaku Ikeda
发明人： Kenji Matsumoto , Tomoyuki Sakoda , Masayuki Nasu , Gaku Ikeda
IPC分类号： B05D5/12 , C23C16/02
CPC分类号： C23C16/40 , C23C16/409 , C23C16/44 , C23C16/52 , H01L21/02197 , H01L21/02271 , H01L21/31691
摘要： There is provided a film deposition method of depositing a multielement metal oxide film capable of depositing a multielement metal oxide film having a desired composition and a desired thickness in an improved repeatability. A film deposition method deposits a multielement metal oxide film on a surface of a workpiece by a film depositing process including supplying organometallic source gases generated by atomizing a plurality of organometallic compounds into a processing vessel capable of being evacuated. A dummy film deposition process corresponding to at least three cycles of the film deposition process is carried out by placing a dummy workpiece in the processing vessel and supplying the organometallic source gases into the processing vessel immediately before starting the film deposition process for depositing a multielement metal oxide film on the workpiece. Thus a multielement metal oxide film having a desired composition and a desired thickness can be deposited in an improved repeatability.
摘要翻译：提供一种沉积多元金属氧化物膜的膜沉积方法，其能够以改善的重复性沉积具有所需组成和所需厚度的多元素金属氧化物膜。膜沉积方法通过膜沉积方法将多元素金属氧化物膜沉积在工件的表面上，所述膜沉积方法包括将通过将多个有机金属化合物雾化产生的有机金属源气体提供到能够被抽真空的处理容器中。通过将虚拟工件放置在处理容器中并将有机金属源气体立即在开始成膜过程之前将有机金属源气体供给到处理容器中，以沉积多元素金属工件上的氧化膜。因此，可以以改进的重复性沉积具有所需组成和所需厚度的多元素金属氧化物膜。

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