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1. 发明申请

WO2006012124A8 LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGETED SURFACE MATERIAL AND ARTICLE PRODUCED THEREBY 审中-公开
公开(公告)号：WO2006012124A8
公开(公告)日：2006-03-23
申请号：PCT/US2005021955
申请日：2005-06-21
申请人： GSI LUMONICS CORP , GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
发明人： GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
IPC分类号： B23K26/36 , G01Q30/02 , G01Q60/00
CPC分类号： G06K1/126 , B23K26/0084 , B23K26/0624 , B23K26/0676 , B23K26/361 , B23K26/40 , B23K2203/50 , B33Y80/00 , B41M5/24 , H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54453 , H05K1/0266 , H05K3/0026
摘要： A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.

2. 发明申请

WO2006012124A2 LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGETED SURFACE MATERIAL AND ARTICLE PRODUCED THEREBY 审中-公开
标题翻译：用于处理目标表面材料的激光基方法和系统及由其制造的制品
公开(公告)号：WO2006012124A2
公开(公告)日：2006-02-02
申请号：PCT/US2005021955
申请日：2005-06-21
申请人： GSI LUMONICS CORP , GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
发明人： GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
IPC分类号： B23K26/36 , G01Q30/02 , G01Q60/00
CPC分类号： G06K1/126 , B23K26/0084 , B23K26/0624 , B23K26/0676 , B23K26/361 , B23K26/40 , B23K2203/50 , B33Y80/00 , B41M5/24 , H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54453 , H05K1/0266 , H05K3/0026
摘要： A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.
摘要翻译：提供了用于处理目标表面材料和由此制造的物品的基于激光的方法和系统。该系统处理工件区域内的目标表面材料，同时避免对相邻非目标材料的不希望的改变。该系统包括主激光器子系统，该主激光器子系统包括用于产生包括至少一个脉冲的脉冲激光输出的主激光源，该脉冲具有小于1ns的波长和脉冲宽度。输送子系统利用包括至少一个脉冲的脉冲激光输出来照射工件的目标表面材料以纹理目标表面材料。脉冲激光输出具有足够的总注量以在目标表面材料的至少一部分内开始消融，并且脉冲宽度足够短以使围绕该材料的区域和非目标材料基本上没有炉渣。

3. 发明申请

WO2005038995A3 MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
标题翻译：使用PICOSECOND激光的存储器链接处理
公开(公告)号：WO2005038995A3
公开(公告)日：2006-03-16
申请号：PCT/US2004032972
申请日：2004-10-06
申请人： GSI LUMONICS CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H05K3/00 , H01L21/461
CPC分类号： H01L23/5258 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2201/38 , B23K2201/40 , B23K2203/08 , B23K2203/10 , B23K2203/12 , B23K2203/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A laser-based method of removing a target link (107) structure of a circuit fabricated on a substrate (110) includes generating a pulsed laser output (104) at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
摘要翻译：基于激光的方法去除在衬底（110）上制造的电路的目标连接（107）结构包括以小于衬底的吸收边缘的预定波长产生脉冲激光输出（104）。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标结构内的位置处具有足够的功率密度，以减小目标结构的反射率，并将聚焦的激光输出有效地耦合到目标结构中以去除连接而不损坏基板。

4. 发明申请

WO2005038994A3 LASER-BASED SYSTEM FOR MEMORY LINK PROCESSING WITH PICOSECOND LASERS 审中-公开
标题翻译：基于激光的系统，用于使用PICOSECOND激光进行存储器链接处理
公开(公告)号：WO2005038994A3
公开(公告)日：2006-01-26
申请号：PCT/US2004032661
申请日：2004-10-05
申请人： GSI LUMONICS CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/073 , B23K26/36 , B23K26/38 , B23K26/40 , H01L21/48 , H01L21/66 , H01L21/768 , H01L23/525 , H01S20060101 , H01S3/067 , H01S3/16 , H01S3/23 , H05K3/00
CPC分类号： H01S3/2383 , B23K26/04 , B23K26/0624 , B23K26/0626 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2201/38 , B23K2201/40 , B23K2203/10 , B23K2203/12 , B23K2203/172 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H01S3/0085 , H01S3/06758 , H01S3/1618 , H01S3/23 , H05K3/0026 , H01L2924/00
摘要： A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about (10) picoseconds to less than (1) nanosecond. The pulse duration being within a thermal processing range. The at least one focused output pulse having sufficient power density at a location within the target material to reduce the reflectivity of the target material and efficiently couple the focused output into the target material to remove the target material.
摘要翻译：一种用于在微观区域内处理目标材料而不引起围绕靶材料的至少一种材料的电学或物理特性的不希望的变化的基于激光的系统，该系统包括种子激光器，光学放大器和光束传递系统。用于产生具有第一预定波长的激光脉冲序列的种子激光器。用于放大脉冲序列的至少一部分以获得放大的输出脉冲序列的光放大器。用于将放大的脉冲序列的至少一个脉冲传送和聚焦到目标材料上的光束传送系统。所述至少一个输出脉冲具有在约（10）皮秒至小于（1）纳秒范围内的脉冲持续时间。脉冲持续时间在热处理范围内。所述至少一个聚焦输出脉冲在目标材料内的位置处具有足够的功率密度，以减少目标材料的反射率并有效地将聚焦的输出耦合到目标材料中以去除目标材料。

5. 发明申请

WO2007092803A3 LASER-BASED REMOVAL OF TARGET LINK STRUCTURES 审中-公开
标题翻译：目标链路结构的基于激光的移除
公开(公告)号：WO2007092803A3
公开(公告)日：2008-09-18
申请号：PCT/US2007061592
申请日：2007-02-05
申请人： GSI GROUP CORP , GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
发明人： GU BO , SMART DONALD V , CORDINGLEY JAMES J , LEE JOOHAN , SVETKOFF DONALD J , JOHNSON SHEPARD D , EHRMANN JONATHAN S
IPC分类号： B23K26/40
CPC分类号： B23K26/0736 , B23K26/0624 , B23K26/40 , B23K2203/50
摘要： Laser-based methods and systems for removing one or more target link structures 107 of a circuit fabricated on a substrate 110 includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output ontothe target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：提供了用于去除在基板110上制造的电路的一个或多个目标链路结构107的基于激光的方法和系统，包括产生比基板的吸收边缘小的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传递和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

6. 发明申请

WO2009039184A3 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION 审中-公开
标题翻译：具有高速光束偏转的链接处理
公开(公告)号：WO2009039184A3
公开(公告)日：2010-05-27
申请号：PCT/US2008076694
申请日：2008-09-17
申请人： GSI GROUP CORP , EHRMANN JONATHAN S , GRIFFITHS JOSEPH J , CORDINGLEY JAMES J , SVETKOFF DONALD J , JOHNSON SHEPARD D , PLOTKIN MICHAEL
发明人： EHRMANN JONATHAN S , GRIFFITHS JOSEPH J , CORDINGLEY JAMES J , SVETKOFF DONALD J , JOHNSON SHEPARD D , PLOTKIN MICHAEL
IPC分类号： B23K26/06 , B23K26/08
CPC分类号： B23K26/0869 , B23K26/0344 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K2201/40 , B23K2203/16 , B23K2203/50 , H01L21/76894 , H01L23/5258 , H01L27/10844 , H01L2924/0002 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
摘要翻译：本发明涉及激光加工方法和系统的领域，具体涉及用于激光加工多材料装置的激光加工方法和系统。系统和方法可以利用高速偏转器来改善处理能量窗口和/或提高处理速度。在一些实施例中，偏转器用于束斑的非正交扫描。在一些实施例中，偏转器用于实现目标结构的非同步处理。

7. 发明申请

WO2008103799A3 HIGH-SPEED, PRECISE LASER-BASED MODIFICATION OF ELECTRICAL ELEMENTS 审中-公开
标题翻译：高速，精密激光的电气元件修改
公开(公告)号：WO2008103799A3
公开(公告)日：2008-10-23
申请号：PCT/US2008054534
申请日：2008-02-21
申请人： GSI GROUP CORP , GU BO , SVETKOFF DONALD J
发明人： GU BO , SVETKOFF DONALD J
IPC分类号： G01L21/30 , B44C1/22
CPC分类号： H01C17/242 , B23K26/0622 , B23K26/0624 , B23K26/351
摘要： A method and system for high-speed, precise, laser-based modification of at least one electrical element made of a target material is provided. The system includes a laser subsystem that generates a pulsed laser output wherein each laser pulse has a pulse energy, a laser wavelength within a range of ablation sensitivity of the target material, and a pulse duration short enough to substantially reduce ablation threshold energy density of the target material. The system further includes a beam positioner that selectively irradiates the at least one electrical element with the one or more laser pulses focused into at least one spot so as to cause the one or more laser pulses to selectively ablate a portion of the target material from the at least one element while avoiding both substantial spurious opto- electric effects and undesirable damage to the non-target material.
摘要翻译：提供了一种用于由目标材料制成的至少一个电气元件进行高速，精确，激光修改的方法和系统。该系统包括产生脉冲激光输出的激光子系统，其中每个激光脉冲具有脉冲能量，在目标材料的消融灵敏度范围内的激光波长，以及足够短的脉冲持续时间，以显着减少消融阈值能量密度目标材料该系统还包括一个光束定位器，其选择性地照射至少一个电气元件，该一个或多个激光脉冲聚焦在至少一个光斑中，以便使一个或多个激光脉冲从一个或多个激光脉冲中选择性地烧蚀目标材料的一部分至少一个元件同时避免了大量的虚拟光电效应和对非目标材料的不良损坏。

8. 发明公开

EP1779286A4 LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGETED SURFACE MATERIAL AND ARTICLE PRODUCED THEREBY 有权
标题翻译： FOR由其得到处理靶向定位面的材料和物品基于激光的方法和系统
公开(公告)号：EP1779286A4
公开(公告)日：2008-12-03
申请号：EP05773635
申请日：2005-06-21
申请人： GSI LUMONICS CORP
发明人： GU BO , EHRMANN JONATHAN S , SVETKOFF DONALD J , CAHILL STEVEN P , SULLIVAN KEVIN E
IPC分类号： G06K7/10 , B23K26/00 , B23K26/04 , B23K26/14 , G01Q30/02 , G01Q60/00
CPC分类号： G06K1/126 , B23K26/0084 , B23K26/0624 , B23K26/0676 , B23K26/361 , B23K26/40 , B23K2203/50 , B33Y80/00 , B41M5/24 , H01L23/544 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/54433 , H01L2223/54453 , H05K1/0266 , H05K3/0026
摘要： A laser-based method and system for processing targeted surface material and article produced thereby are provided. The system processes the targeted surface material within a region of a workpiece while avoiding undesirable changes to adjacent non-targeted material. The system includes a primary laser subsystem including a primary laser source for generating a pulsed laser output including at least one pulse having a wavelength and a pulse width less than 1 ns. A delivery subsystem irradiates the targeted surface material of the workpiece with the pulsed laser output including the at least one pulse to texture the targeted surface material. The pulsed laser output has sufficient total fluence to initiate ablation within at least a portion of the targeted surface material and the pulse width is short enough such that the region and the non-targeted material surrounding the material are substantially free of slag.
摘要翻译：提供了用于处理目标表面的材料，并由此产生的制品的基于激光的方法和系统。同时避免相邻非靶向材料不希望的变化的系统处理工件的一个区域内的目标表面的材料。该系统包括一主激光子系统包括用于产生脉冲激光输出包括具有波长和脉冲宽度小于1纳秒的至少一个脉冲的主激光源。甲递送子系统照射所述工件与所述脉冲激光输出包括至少一个脉冲来纹理目标面材料的目标的表面材料。脉冲激光输出具有足够的总能流至目标表面材料和脉冲宽度中的至少一部分内发起消融足够短检查做的区域和围绕该材料的非靶向材料基本上不含熔渣的。

9. 发明申请

WO0198016A3 LASER SYSTEM FOR PROCESSING TARGET MATERIAL 审中-公开
标题翻译：用于加工目标材料的激光系统
公开(公告)号：WO0198016A3
公开(公告)日：2002-06-27
申请号：PCT/US0117543
申请日：2001-05-31
申请人： GEN SCANNING INC , SMART DONALD V , SVETKOFF DONALD J
发明人： SMART DONALD V , SVETKOFF DONALD J
IPC分类号： B23K26/00 , B23K26/06 , B23K26/073 , B23K26/40 , B23K101/36 , B81C1/00 , H01L21/302 , H01L21/3205 , H01L21/768 , H01L23/52 , H01L23/525 , H01S3/00 , H01S3/06 , H01S3/067 , H01S3/23 , H01S3/30 , H01L21/70
CPC分类号： H01S3/2308 , B23K26/0624 , B23K26/0736 , B23K26/40 , B23K2203/50 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/06754 , H01S3/2375 , H01S3/302 , H01S2301/08 , H01L2924/00
摘要： An energy-efficient method and system for processing target material such as microstructures in a microscopic region without causing undesirable changes in electrical and/or physical characteristics of material surrounding the target material is provided. The system includes a controller for generating a processing control signal and a signal generator for generating a modulated drive waveform based on the processing control signal. The waveform has a sub-nanosecond rise time. The system also includes a gain-switched, pulsed semiconductor seed laser having a first wavelength for generating a laser pulse train at a repetition rate. The drive waveform pumps the laser so that each pulse of the pulse train has a predetermined shape. Further, the system includes a fiber amplifier subsystem for optically amplifying the pulse train to obtain an amplified pulse train without significantly changing the predetermined shape of the pulses. The amplified pulses have little distortion and have substantially the same relative temporal power distribution as the original pulse train from the laser. Each of the amplified pulses has a substantially square temporal power density distribution, a sharp rise time, a pulse duration and a fall time. The subsystem also includes a wavelength shifter in the form of an optical fiber for controllably shifting the first wavelength to a second, larger wavelength to obtain an amplified, wavelength-shifted, pulse train.
摘要翻译：提供了一种用于在微观区域中处理诸如微结构的目标材料而不引起围绕目标材料的材料的电气和/或物理特性的不期望的变化的能量效率方法和系统。该系统包括用于产生处理控制信号的控制器和用于基于处理控制信号产生调制的驱动波形的信号发生器。波形具有亚纳秒上升时间。该系统还包括具有用于以重复率产生激光脉冲串的第一波长的增益切换的脉冲半导体种子激光器。驱动波形泵浦激光器，使得脉冲串的每个脉冲具有预定的形状。此外，该系统包括光纤放大器子系统，用于光学放大脉冲串以获得放大的脉冲串，而不显着改变预定形状的脉冲。放大的脉冲具有很小的失真，并且具有与来自激光器的原始脉冲串相当的相对时间功率分布。每个放大的脉冲具有基本上正方形的时间功率密度分布，急剧上升时间，脉冲持续时间和下降时间。子系统还包括光纤形式的波长移位器，用于将第一波长可控地移位到第二较大波长以获得放大的波长偏移脉冲序列。

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