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    • 1. 发明申请
    • METHOD AND SYSTEM FOR HIGH-SPEED PRECISE LASER TRIMMING, SCAN LENS SYSTEM FOR USE THEREIN AND ELECTRICAL DEVICE PRODUCED THEREBY
    • 高速精密激光切割方法与系统及其使用的扫描镜头系统及其制造的电气设备
    • WO2006042231A2
    • 2006-04-20
    • PCT/US2005036421
    • 2005-10-07
    • GSI LUMONICS CORPGU BOLENTO JOSEPH VEHRMANN JONATHAN SCOUCH BRUCE LCHU YUN FEEJOHNSON SHEPARD D
    • GU BOLENTO JOSEPH VEHRMANN JONATHAN SCOUCH BRUCE LCHU YUN FEEJOHNSON SHEPARD D
    • G06K7/10
    • H01C17/242B23K26/0622B23K26/082
    • A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.
    • 提供了一种方法,系统和扫描透镜系统,用于高速,基于激光的,精确的激光修剪至少一个电气元件。 该方法包括以重复率产生具有一个或多个激光脉冲的脉冲激光输出。 每个激光脉冲具有脉冲能量,在激光波长范围内的激光波长和脉冲持续时间。 所述方法还包括选择性地照射所述至少一个电气元件,所述一个或多个激光脉冲聚焦在沿着方向具有不均匀强度分布的至少一个点和小至约6微米至约15微米的光点直径上 以使所述一个或多个激光脉冲从所述至少一个元件选择性地去除材料,并激光修整所述至少一个元件,同时避免所述至少一个元件内的实质性微裂纹。 波长足够短以产生小斑点尺寸,紧度公差和高吸收性能所需的短波长益处,但不会如此短,从而导致微裂纹。