专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2017180693A1 METHOD OF FORMING AN ARRAY OF A MULTI-DEVICE UNIT CELL 审中-公开
标题翻译：形成多器件单元的阵列的方法
公开(公告)号：WO2017180693A1
公开(公告)日：2017-10-19
申请号：PCT/US2017/027125
申请日：2017-04-12
申请人： GLO AB , POKHRIYAL, Anusha
发明人： POKHRIYAL, Anusha , FARRENS, Sharon N.
IPC分类号： H01L27/15 , H01L23/00
摘要： Backplane-side bonding structures including a common metal are formed on a backplane. Multiple source coupons are provided such that each source coupon includes a transfer substrate and an array of devices to be transferred. Each array of devices are arranged such that each array includes a unit cell structure including multiple devices of the same type and different types of bonding structures including different metals that provide different eutectic temperatures with the common metal. Different types of devices can be sequentially transferred to the backplane by sequentially applying the supply coupons and selecting devices providing progressively higher eutectic temperatures between respective bonding pads and the backplane-side bonding structures. Previously transferred devices stay on the backplane during subsequent transfer processes, enabling formation of arrays of different devices on the backplane.
摘要翻译：包括公共金属的背板侧接合结构形成在背板上。提供多个来源优惠券，使得每个来源优惠券包括转移基板和待转移的一系列设备。设备的每个阵列被布置为使得每个阵列包括单元单元结构，该单元单元结构包括相同类型的多个器件和不同类型的键合结构，该键合结构包括与普通金属提供不同共晶温度的不同金属。通过顺序地施加供应券并选择在相应键合焊盘和背板侧键合结构之间提供逐渐更高的共晶温度的器件，可以将不同类型的器件顺序地转移到底板。之前传输的设备会在后续传输过程中留在背板上，从而在背板上形成不同设备的阵列。

2. 发明申请

WO2016100662A1 LIGHT EMITTING DIODE ARRAY ON A BACKPLANE AND METHOD OF MAKING THEREOF 审中-公开
标题翻译：背板上的发光二极管阵列及其制作方法
公开(公告)号：WO2016100662A1
公开(公告)日：2016-06-23
申请号：PCT/US2015/066372
申请日：2015-12-17
申请人： GLO AB , GARDNER, Nathan F. , KISH, JR., Fredrick A. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel Bryce , DANESH, Fariba , GALLAGHER, Timothy , FARRENS, Sharon N.
发明人： GARDNER, Nathan F. , KISH, JR., Fredrick A. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel Bryce , DANESH, Fariba , GALLAGHER, Timothy , FARRENS, Sharon N.
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L25/0753 , H01L24/97 , H01L25/50 , H01L27/156 , H01L33/0095 , H01L33/62 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/81 , H01L2224/81001 , H01L2224/95
摘要： A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.
摘要翻译：提供了可选地具有阶梯式水平表面和任选地嵌入金属互连结构的背板。第一导电接合结构形成在第一台阶水平表面上。第一转印衬底上的第一发光器件设置在第一导电接合结构上，并且第一发光器件的第一子集结合到第一导电接合结构。可以使用激光照射来选择性地将第一发光器件的第一子集与第一转移衬底分离，而第一发光器件的第二子集保持附着到第一转移衬底。每个附加传输基板上的附加设备可以使用相同的方法与背板上的附加导电接合结构接合，只要附加设备不存在于与先前存在的第一发光设备或背板上的设备重叠的位置处粘接位置。

3. 发明申请

WO2021119060A1 PARTIAL LASER LIFTOFF PROCESS DURING DIE TRANSFER AND STRUCTURES FORMED BY THE SAME 审中-公开
公开(公告)号：WO2021119060A1
公开(公告)日：2021-06-17
申请号：PCT/US2020/063895
申请日：2020-12-09
申请人： GLO AB
发明人： POKHRIYAL, Anusha , GALLAGHER, Timothy
IPC分类号： H01L33/00 , H01L23/00 , H01L33/48 , H01L25/075
摘要： A transfer method includes providing a first light emitting diode on a first substrate, performing a partial laser liftoff of the first light emitting diode from the first substrate, laser bonding the first light emitting diode to the backplane after performing the partial laser liftoff, and separating the first substrate from the first light emitting diode after the laser bonding.

4. 发明申请

WO2016100657A3 METHOD OF MAKING A LIGHT EMITTING DIODE ARRAY ON A BACKPLANE 审中-公开
公开(公告)号：WO2016100657A3
公开(公告)日：2016-06-23
申请号：PCT/US2015/066362
申请日：2015-12-17
申请人： GLO AB , GARDNER, Nathan F. , KISH, Fredrick A., JR. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel , DANESH, Fariba , GALLAGHER, Timothy
发明人： GARDNER, Nathan F. , KISH, Fredrick A., JR. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel , DANESH, Fariba , GALLAGHER, Timothy
IPC分类号： H05B37/00 , H05B33/14 , H01L33/00
摘要： A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate. Additional devices on each additional transfer substrate can be bonded to additional conductive bonding structures on the backplane employing the same method provided that the additional devices are not present in positions that would overlap with pre-existing first light emitting devices or devices on the backplane at a bonding position.

5. 发明申请

WO2019199547A1 LED BACKPLANE HAVING PLANAR BONDING SURFACES AND METHOD OF MAKING THEREOF 审中-公开
公开(公告)号：WO2019199547A1
公开(公告)日：2019-10-17
申请号：PCT/US2019/025622
申请日：2019-04-03
申请人： GLO AB
发明人： DANESH, Fariba , GALLAGHER, Timothy , POKHRIYAL, Anusha , LAU, Tsun
IPC分类号： H01L25/075 , H01L33/48 , H01L33/36 , H01L33/62 , H01L33/00
摘要： A backplane can have a non-planar top surface. Insulating material portions including planar top surface regions located within a same horizontal plane are formed over the backplane. A two-dimensional array of metal plate clusters is formed over the insulating material portions. Each of the metal plate clusters includes a plurality of metal plates. Each metal plate includes a horizontal metal plate portion overlying a planar top surface region and a connection metal portion connected to a respective metal interconnect structure in the backplane. A two-dimensional array of light emitting device clusters is bonded to the backplane through respective bonding structures. Each light emitting device cluster includes a plurality of light emitting devices overlying a respective metal plate cluster.

6. 发明申请

WO2017175051A1 THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER 审中-公开
标题翻译：通过背面激光照射进行模子转移
公开(公告)号：WO2017175051A1
公开(公告)日：2017-10-12
申请号：PCT/IB2017/000334
申请日：2017-03-20
申请人： GLO AB
发明人： FARRENS, Sharon, N. , POKHRIYAL, Anusha
IPC分类号： H01L33/00 , H01L25/075
摘要： Light emitting devices (10) can be disposed on the front side of a transparent backplane (32). A laser beam (77, 87, 97) can be irradiated through the transparent backplane (32) and onto a component located on the front side of the transparent backplane (32). In one embodiment, the component may be a solder material (48) portion that is reflowed to bond the light emitting devices (10) to the transparent backplane (32). In another embodiment, the component may be a solder material (48) bonded to a defective bonded light emitting device (10). In this case, the laser irradiation can reflow the solder material (48) to dissociate the defective bonded light emitting device (10) from the transparent backplane (32). In yet another embodiment, the component may be a device component (62A) that is electrically modified by the laser irradiation.
摘要翻译：发光器件（10）可以设置在透明背板（32）的前侧上。激光束（77,87,97）可以通过透明背板（32）照射并且照射到位于透明背板（32）的前侧上的部件上。在一个实施例中，部件可以是回流焊接材料（48）部分以将发光器件（10）结合到透明背板（32）。在另一个实施例中，部件可以是结合到有缺陷的键合发光器件（10）的焊料材料（48）。在这种情况下，激光照射可以回流焊料材料（48）以将有缺陷的键合发光器件（10）从透明背板（32）分离。在又一个实施例中，该部件可以是通过激光照射而电改变的装置部件（62A）。

7. 发明申请

WO2017142877A1 METHOD OF SELECTIVELY TRANSFERRING LED DIE TO A BACKPLANE USING HEIGHT CONTROLLED BONDING STRUCTURES 审中-公开
标题翻译：利用高度受控结合结构选择性地将LED模片转移到背板的方法
公开(公告)号：WO2017142877A1
公开(公告)日：2017-08-24
申请号：PCT/US2017/017830
申请日：2017-02-14
申请人： GLO AB , POKHRIYAL, Anusha , FARRENS, Sharon N. , GALLAGHER, Timothy
发明人： POKHRIYAL, Anusha , FARRENS, Sharon N. , GALLAGHER, Timothy
IPC分类号： H01L33/00 , H01L21/677 , H01L33/62
CPC分类号： H01L25/50 , H01L21/67144 , H01L21/6835 , H01L24/81 , H01L24/83 , H01L25/0753 , H01L25/167 , H01L33/005 , H01L33/62 , H01L2221/68322 , H01L2221/68327 , H01L2221/68354 , H01L2221/68368 , H01L2221/68381 , H01L2224/81224 , H01L2224/81815 , H01L2224/83224 , H01L2224/83815 , H01L2933/0066
摘要： Selective transfer of dies including semiconductor devices to a target substrate can be performed employing local laser irradiation. Coining of at least one set of solder material portions can be employed to provide a planar surface-to-surface contact and to facilitate bonding of adjoining pairs of bond structures. Laser irradiation on the solder material portions can be employed to sequentially bond selected pairs of mated bonding structures, while preventing bonding of devices not to be transferred to the target substrate. Additional laser irradiation can be employed to selectively detach bonded devices, while not detaching devices that are not bonded to the target substrate. The transferred devices can be pressed against the target substrate during a second reflow process so that the top surfaces of the transferred devices can be coplanar. Wetting layers of different sizes can be employed to provide a trapezoidal vertical cross-sectional profile for reflowed solder material portions.
摘要翻译：可以使用局部激光照射来执行包括半导体器件的裸片到目标衬底的选择性传输。可采用至少一组焊料材料部分的压印来提供平面的表面对表面接触并促进邻接的成对键合结构的键合。在焊料材料部分上的激光照射可以用于依次键合选定的成对的配合键合结构，同时防止不转移到目标衬底的器件的键合。可以使用额外的激光照射来选择性地分离键合器件，同时不分离未键合到目标衬底的器件。被转移的器件可以在第二次回流过程中被压向目标基板，使得被转移的器件的顶表面可以共面。可以采用不同尺寸的润湿层来为回流的焊接材料部分提供梯形的垂直横截面轮廓。

8. 发明授权

EP3235347B1 METHOD OF MAKING A LIGHT EMITTING DIODE ARRAY ON A BACKPLANE 有权转让
公开(公告)号：EP3235347B1
公开(公告)日：2020-05-13
申请号：EP15871062.4
申请日：2015-12-17
申请人： GLO AB
发明人： GARDNER, Nathan F. , KISH, Fredrick A., JR. , MODRIC, Miljenko , POKHRIYAL, Anusha , THOMPSON, Daniel , DANESH, Fariba
IPC分类号： H01L25/075 , H01L23/00 , H01L25/00 , H01L33/00 , H01L33/62

9. 发明公开

EP3776655A1 LED BACKPLANE HAVING PLANAR BONDING SURFACES AND METHOD OF MAKING THEREOF 审中-实审转让
公开(公告)号：EP3776655A1
公开(公告)日：2021-02-17
申请号：EP19784675.1
申请日：2019-04-03
申请人： GLO AB
发明人： DANESH, Fariba , GALLAGHER, Timothy , POKHRIYAL, Anusha , LAU, Tsun
IPC分类号： H01L25/075 , H01L33/48 , H01L33/36 , H01L33/62 , H01L33/00

10. 发明公开

EP3440714A1 THROUGH BACKPLANE LASER IRRADIATION FOR DIE TRANSFER 审中-公开
公开(公告)号：EP3440714A1
公开(公告)日：2019-02-13
申请号：EP17721829.4
申请日：2017-03-20
申请人： GLO AB
发明人： FARRENS, Sharon, N. , POKHRIYAL, Anusha
IPC分类号： H01L33/00 , H01L25/075

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式