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    • 4. 发明申请
    • FULL FAULT TOLERANT ARCHITECTURE FOR ORGANIC ELECTRONIC DEVICES
    • 用于有机电子设备的全面容错架构
    • WO2006104544A1
    • 2006-10-05
    • PCT/US2006/002275
    • 2006-01-24
    • GENERAL ELECTRIC COMPANYLIU, JieDUGGAL, Anil, Raj
    • LIU, JieDUGGAL, Anil, Raj
    • H05B33/08G09G3/32
    • G09G3/006G09G3/3208G09G2330/08H01L27/3202H01L27/3204H01L51/5203
    • An organic device package (10) that provides full fault tolerance against both electrical shorts and electrical opens is presented. An organic device package (10) comprising a plurality of groups (12, 14, 16) of organic electronic elements electrically coupled in series, where at least one of the plurality of groups (12, 14, 16) of organic electronic elements comprises a plurality of sub-groups (20, 22) of organic electronic elements electrically coupled in parallel, and where at least one of the plurality of sub-groups (20, 22) of organic electronic elements comprises a plurality of organic electronic elements (24) electrically coupled in series. A plurality of organic electronic elements (24) may be electrically connected in a series arrangement to form series blocks. Likewise, a plurality of organic electronic elements may be electrically connected in a parallel arrangement to form parallel blocks. Further, various embodiments are contemplated where a plurality of series blocks and parallel blocks may be nested to provide a grid network having increased flexibility and fault tolerance. In addition, employing the various embodiments of the organic device package (10), full fault tolerance against electrical shorts and electrical opens without the use of a fuse that advantageously circumvents the limitations of current techniques may be achieved.
    • 提出了一种针对电气短路和电气开路提供全面故障容限的有机器件封装(10)。 一种有机器件封装(10),包括多个电耦合的有机电子元件组(12,14,16),其中所述多个有机电子元件组(12,14,16)中的至少一个包括 多个子组(20,22)的有机电子元件并联电耦合,并且其中有机电子元件的多个子组(20,22)中的至少一个包括多个有机电子元件(24) 串联电耦合。 多个有机电子元件(24)可以以串联方式电连接以形成串联块。 同样地,多个有机电子元件可以并联布置电连接以形成平行块。 此外,可以想到各种实施例,其中可以嵌套多个串联块和并行块以提供具有增加的灵活性和容错的网格网络。 此外,采用有机器件封装(10)的各种实施例,可以实现针对电短路和电气开路的全部容错,而不使用有利地避免当前技术限制的保险丝。
    • 10. 发明申请
    • AN ORGANIC ORGANIC ELECTRO-OPTIC DEVICE AND METHOD FOR MAKING THE SAME
    • 有机有机电光器件及其制造方法
    • WO2005045950A1
    • 2005-05-19
    • PCT/US2004/035683
    • 2004-10-27
    • GENERAL ELECTRIC COMPANY (a New York corporation)LIU, JieDUGGAL, Anil, Raj
    • LIU, JieDUGGAL, Anil, Raj
    • H01L51/40
    • H01L51/0024H01L27/3202H01L27/3204H01L51/0037H01L51/0038H01L51/0039H01L51/5036H01L51/5203H01L51/5268H01L51/56Y02E10/549Y02P70/521Y10T428/31504
    • The present invention directed to an organic light emitting device and method for making the same. The method comprises the steps of: forming a first component (21) comprising at least one first material (202) on a first substrate (200); forming a second component (21) comprising at least one second material (208) on a second substrate (206), wherein at least one opening (216) is formed through the second component (22); forming a third component (23); and laminating the first component (21), the second component (22) and the third component (23) together such that the second component (22) is located between the first component (21) and the third component (23), the at least one first material (202) and the at least one second material (208) form at least part of an organic electro-optic device located between the first substrate (200) and the second substrate (206), the third component (23) is bonded to the second component (22), and the third component (23) is bonded to the first component (21) through the at least one opening (216).
    • 本发明涉及一种有机发光器件及其制造方法。 该方法包括以下步骤:在第一基板(200)上形成包括至少一个第一材料(202)的第一部件(21); 在第二基板(206)上形成包括至少一个第二材料(208)的第二部件(21),其中通过第二部件(22)形成至少一个开口(216); 形成第三部件(23); 并且将所述第一部件(21),所述第二部件(22)和所述第三部件(23)层叠在一起,使得所述第二部件(22)位于所述第一部件(21)和所述第三部件(23)之间, 至少一个第一材料(202)和至少一个第二材料(208)形成位于第一基板(200)和第二基板(206)之间的有机电光装置的至少一部分,第三部件(23) 被结合到第二部件(22)上,并且第三部件(23)通过至少一个开口(216)结合到第一部件(21)。