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1. 发明申请

WO2006028597A3 LASER SEPARATION OF ENCAPSULATED SUBMOUNT 审中-公开
公开(公告)号：WO2006028597A3
公开(公告)日：2006-03-16
申请号：PCT/US2005/026417
申请日：2005-07-26
申请人： GELcore LLC , SAKRISON, Michael , GAO, Xiang , SHELTON, Bryan, S. , ELIASHEVICH, Ivan
发明人： SAKRISON, Michael , GAO, Xiang , SHELTON, Bryan, S. , ELIASHEVICH, Ivan
IPC分类号： H01L21/00 , H01L21/44 , H01L21/46 , H01L27/14 , H01L23/495 , H01L31/0232
摘要： In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a laser. The sub-mount wafer (14) is fractured along the fracture initiating trenches (30, 32).

2. 发明公开

EP1905104A1 LASER LIFT-OFF LED WITH IMPROVED LIGHT EXTRACTION 审中-公开
标题翻译：激光剥离具有改善的光提取LED
公开(公告)号：EP1905104A1
公开(公告)日：2008-04-02
申请号：EP06787150.9
申请日：2006-07-11
申请人： Gelcore LLC , Gao, Xiang , Venugopalan, Hari S. , Eliashevich, Ivan
发明人： GAO, Xiang , VENUGOPALAN, Hari S. , ELIASHEVICH, Ivan , SACKRISON, Michael
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A light emitting device includes a stack of semiconductor layers defining a light emitting pn junction and a dielectric layer disposed over the stack of semiconductor layers. The dielectric layer has a refractive index substantially matching a refractive index of the stack of semiconductor layers. The dielectric layer has a principal surface distal from the stack of semiconductor layers. The distal principal surface includes patterning, roughening, or texturing configured to promote extraction of light generated in the stack of semiconductor layers.

3. 发明申请

WO2007009042A1 LASER LIFT-OFF LED WITH IMPROVED LIGHT EXTRACTION 审中-公开
标题翻译：具有改进的光提取的激光提升LED
公开(公告)号：WO2007009042A1
公开(公告)日：2007-01-18
申请号：PCT/US2006/027205
申请日：2006-07-11
申请人： GELCORE LLC , GAO, Xiang , VENUGOPALAN, Hari, S. , ELIASHEVICH, Ivan , SACKRISON, Michael
发明人： GAO, Xiang , VENUGOPALAN, Hari, S. , ELIASHEVICH, Ivan , SACKRISON, Michael
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/62 , H01L33/64 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： A light emitting device includes a stack of semiconductor layers defining a light emitting pn junction and a dielectric layer disposed over the stack of semiconductor layers. The dielectric layer has a refractive index substantially matching a refractive index of the stack of semiconductor layers. The dielectric layer has a principal surface distal from the stack of semiconductor layers. The distal principal surface includes patterning, roughening, or texturing configured to promote extraction of light generated in the stack of semiconductor layers.
摘要翻译：发光器件包括限定发光pn结的半导体层的叠层和设置在半导体层堆叠上的电介质层。电介质层的折射率基本上与半导体层叠层的折射率相匹配。电介质层具有远离半导体层堆叠的主表面。远端主表面包括图案化，粗糙化或纹理化，其被配置为促进在半导体层堆叠中产生的光的提取。

4. 发明申请

WO2005057672A2 SURFACE MOUNT LIGHT EMITTING CHIP PACKAGE 审中-公开
标题翻译：表面安装发光芯片包装
公开(公告)号：WO2005057672A2
公开(公告)日：2005-06-23
申请号：PCT/US2004/041392
申请日：2004-12-09
申请人： GELCORE, LLC , WEAVER, Stanton, Earl, Jr. , CHEN, Chen-Lun Hsing , KOLODIN, Boris , STECHER, Thomas, Elliot , REGINELLI, James , HAITKO, Deborah, Ann , GAO, Xiang , ELIASHEVICH, Ivan
发明人： WEAVER, Stanton, Earl, Jr. , CHEN, Chen-Lun Hsing , KOLODIN, Boris , STECHER, Thomas, Elliot , REGINELLI, James , HAITKO, Deborah, Ann , GAO, Xiang , ELIASHEVICH, Ivan
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2924/10253 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.
摘要翻译：表面安装发光封装包括具有顶部和底部主表面的芯片载体。至少一个发光芯片附着到芯片载体的顶部主表面。连接到芯片载体的顶部主表面的引线框架。当表面安装到相关联的支撑件时，芯片载体的底部主表面与相关联的支撑件热接触，而没有引导框架介于其间。

5. 发明申请

WO2002063348A3 IMPROVED LIGHT EXTRACTION EFFICIENCY OF GaN BASED LEDs 审中-公开
公开(公告)号：WO2002063348A3
公开(公告)日：2002-08-15
申请号：PCT/US2001/050632
申请日：2001-10-19
申请人： EMCORE CORPORATION , ELIASHEVICH, Ivan , WANG, Michael
发明人： ELIASHEVICH, Ivan , WANG, Michael
IPC分类号： H01L33/00
摘要： An optoelectronic device has a semiconductor structure (10) on a substrate (12). The shape of the device in plan is that of a quadrilateral having two acute included angles (α1, α2) and two obtuse included angles (α1, α2). One of the electrode-pad units (31) is located distally from the vertices of the quadrilateral. The device may have a transparent electrode (32).

6. 发明申请

WO2008033563A2 SUPPORT FOR FLIP-CHIP BONDING A LIGHT EMITTING CHIP 审中-公开
标题翻译：支持闪光芯片连接发光芯片
公开(公告)号：WO2008033563A2
公开(公告)日：2008-03-20
申请号：PCT/US2007/020194
申请日：2007-09-14
申请人： LUMINATION LLC , KOLODIN, Boris , HSING, Michael , WEAVER, Stanton, Earl, Jr., , ELIASHEVICH, Ivan , AANEGOLA, Srinath, K.
发明人： KOLODIN, Boris , HSING, Michael , WEAVER, Stanton, Earl, Jr., , ELIASHEVICH, Ivan , AANEGOLA, Srinath, K.
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/62 , H01L2224/48463 , H01L2224/73265 , H01L2924/01079 , H01L2924/10253 , H01L2924/00
摘要： In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10', 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36') of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.
摘要翻译：在发光器件中，发光芯片（12,112）包括堆叠的半导体层（14）和设置在半导体层堆叠上的电极（24,141,142）。支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。导电芯片附接材料（40,41,141,142）凹入到支撑件的大致平坦的表面中，使得附接材料基本不突出在支撑体的大致平坦的表面上方。附着材料提供发光芯片的电极与支撑体的导电路径（36,36'）之间的电连通。可选地，至少半导体层的叠层和发光芯片的电极也凹入到支撑体的大致平坦的表面中。

7. 发明申请

WO2002059983A1 LED PACKAGE HAVING IMPROVED LIGHT EXTRACTION AND METHODS THEREFOR 审中-公开
标题翻译： LED包装具有改进的光提取及其方法
公开(公告)号：WO2002059983A1
公开(公告)日：2002-08-01
申请号：PCT/US2001/043515
申请日：2001-11-16
申请人： EMCORE CORPORATION , ELIASHEVICH, Ivan , SCHWED, Stephen
发明人： ELIASHEVICH, Ivan , SCHWED, Stephen
IPC分类号： H01L33/00
CPC分类号： H01L33/20
摘要： An optoelectronic device (100) includes a stacked structure having a first region (158) of a first conductivity type, a second region (160) of a second conductivity type and a light-emitting p-n junction (162) between those regions. The stacked structure defines a mesa with a top surface (175) and a first electrode-pad unit (174) is disposed on the top surface. The mesa has side surfaces at an upper end of the mesa. The side surfaces have at least one concave radial surface (170) formed therein for optimizing light extraction form the package. One or more radial surfaces may also be formed in the second region of the light-emitting diode and/or in the substantially transparent substrate (150). Packages having such device and methods of making the foregoing are also disclosed.
摘要翻译：光电子器件（100）包括具有第一导电类型的第一区域（158）和第二导电类型的第二区域（160）和这些区域之间的发光p-n结（162）的堆叠结构。层叠结构限定具有顶表面（175）的台面，并且第一电极 - 垫单元（174）设置在顶表面上。台面在台面的上端具有侧面。侧表面具有形成在其中的至少一个凹形径向表面（170），用于优化从包装中的光提取。也可以在发光二极管的第二区域和/或基本上透明的基板（150）中形成一个或多个径向表面。还公开了具有这样的装置和制造前述的方法的包装。

8. 发明申请

WO2002041362A3 LASER SEPARATED DIE WITH TAPERED SIDEWALLS FOR IMPROVED LIGHT EXTRACTION 审中-公开
公开(公告)号：WO2002041362A3
公开(公告)日：2002-05-23
申请号：PCT/US2001/043326
申请日：2001-11-16
申请人： EMCORE CORPORATION , ELIASHEVICH, Ivan , GOTTFRIED, Mark
发明人： ELIASHEVICH, Ivan , GOTTFRIED, Mark
IPC分类号： B23K26/38
摘要： A method for separating individual optoelectronic devices, such as LEDs, from a wafer includes directing a laser beam (256) having a width toward a major surface of the semiconductor wafer. The laser beam has an image with a first portion of a first energy per unit width and a second portion of a second energy per unit width less than the first energy. The laser beam image (266) cuts into the first major surface of the semiconductor wafer to produce individual devices.

9. 发明申请

WO2002071450A2 LED LEAD FOR IMPROVED LIGHT EXTRACTION 审中-公开
标题翻译： LED引线用于改善光提取
公开(公告)号：WO2002071450A2
公开(公告)日：2002-09-12
申请号：PCT/US2002/006494
申请日：2002-03-05
申请人： EMCORE CORPORATION , ELIASHEVICH, Ivan , BROWN, Michael, G.
发明人： ELIASHEVICH, Ivan , BROWN, Michael, G.
IPC分类号： H01L
CPC分类号： H01L33/385 , H01L24/05 , H01L33/44 , H01L2224/04042 , H01L2224/0603 , H01L2224/48463 , H01L2924/12032 , H01L2924/12041 , H01L2924/00
摘要： Light emitting diodes (LEDs) are provided with electrode and pad structures, wich result in improved light extraction for the LED. The LED may be foremd as a die withan upper contact surface (28) and a lower contact surface (20,22). A mesa (24) including at least one generally vertical edge surface (26) projects upwardly from the lower contact surface. First and second pads (32, 34) are disposed on teh lower contact surface. The second pad desirably does not make ohmic contact with the lower contact surface. A conductive lead (36) is in bridging contact with the second pad and the upper contact surface of the mesa.
摘要翻译：发光二极管（LED）具有电极和焊盘结构，从而改善了LED的光提取。 LED可以被预先确定为具有上接触表面（28）和下接触表面（20,22）的模具。包括至少一个大致竖直的边缘表面（26）的台面（24）从下接触表面向上突出。第一和第二垫（32,34）设置在下接触表面上。理想的是第二焊盘不与下接触表面欧姆接触。导电引线（36）与第二焊盘和台面的上接触表面桥接接触。

10. 发明申请

WO2002041364A3 LED PACKAGES HAVING IMPROVED LIGHT EXTRACTION 审中-公开
公开(公告)号：WO2002041364A3
公开(公告)日：2002-05-23
申请号：PCT/US2001/044046
申请日：2001-11-14
申请人： EMCORE CORPORATION , ELIASHEVICH, Ivan , KARLICEK, Robert, F., Jr. , VENUGOPALAN, Hari
发明人： ELIASHEVICH, Ivan , KARLICEK, Robert, F., Jr. , VENUGOPALAN, Hari
IPC分类号： H01L33/00
摘要： A light-emitting microelectronic package includes a light-emitting diode (110) having a first region (114) of a first conductivity type, a second region (116) of a second conductivity type, and a light-emitting p-n junction (118) between the first and second regions. The light-emitting diode defines a lower contact surface (120) and a mesa (122) projecting upwardly from the lower contact surface. The first region (114) of a first conductivity type is disposed in the mesa (122) and defines a top surface of the mesa, and the second region (116) of a second conductivity type defines the lower contact surface that substantially surrounds the mesa (122). The mesa includes at least one sidewall (130) extending between the top surface (124) of the mesa and the lower contact surface (120), the at least one sidewall (130) having a roughened surface for optimizing light extraction from the package.

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