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    • 7. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • 半导体器件及其制造方法
    • US20120199891A1
    • 2012-08-09
    • US13499960
    • 2010-10-04
    • Masahiko SuzukiHirohiko NishikiYoshimasa ChikamaYoshifumi OhtaTetsuya AitaOkifumi NakagawaTakeshi Hara
    • Masahiko SuzukiHirohiko NishikiYoshimasa ChikamaYoshifumi OhtaTetsuya AitaOkifumi NakagawaTakeshi Hara
    • H01L29/78H01L21/336
    • H01L29/7869G02F1/1368H01L29/66969H01L29/78606
    • A semiconductor device includes: a gate electrode (3) arranged on a substrate (1); a gate insulating layer (5) deposited over the gate electrode (3); an island of an oxide semiconductor layer (7) formed on the gate insulating layer (5) and including a channel region (7c) and first and second contact regions (7s, 7d) located on right- and left-hand sides of the channel region (7c); a source electrode (11) electrically connected to the first contact region (7s); a drain electrode (13) electrically connected to the second contact region (7d); and a protective layer (9) which is arranged on, and in contact with, the oxide semiconductor layer (7). The protective layer (9) covers the channel region (7c) on the surface of the oxide semiconductor layer (7), the sidewalls (7e) thereof located in a channel width direction with respect to the channel region (7c), and other portions (7f) thereof between the channel region (7c) and the sidewalls (7e). As a result, the hysteresis characteristic of a TFT that uses an oxide semiconductor can be improved and its reliability can be increased.
    • 半导体器件包括:布置在衬底(1)上的栅电极(3); 沉积在栅电极(3)上的栅极绝缘层(5); 形成在所述栅极绝缘层(5)上并且包括沟道区(7c)的氧化物半导体层(7)的岛和位于所述沟道的右侧和左侧的第一和第二接触区(7s,7d) 区域(7c); 电连接到第一接触区域(7s)的源电极(11); 电连接到第二接触区域(7d)的漏电极(13); 以及设置在所述氧化物半导体层(7)上并与所述氧化物半导体层(7)接触的保护层(9)。 保护层(9)覆盖氧化物半导体层(7)的表面上的沟道区域(7c),其侧壁(7e)相对于沟道区域(7c)位于沟道宽度方向,其它部分 (7f)之间的沟道区域(7f)。 结果,可以提高使用氧化物半导体的TFT的滞后特性,并且可以提高其可靠性。