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    • 9. 发明授权
    • Structure for mounting and dismounting an equipment unit
    • 用于安装和拆卸设备单元的结构
    • US06431667B1
    • 2002-08-13
    • US09444289
    • 1999-11-22
    • Kenji Okumura
    • Kenji Okumura
    • E05B6546
    • G06F1/184G06F1/187
    • In a structure for mounting and dismounting an equipment unit from an apparatus body including a plate-like frame formed with a slot at a preselected end and a bore contiguous with the slot for receiving the equipment unit via the slot, the equipment unit includes a front panel and a pair of mounting members. The mounting members are positioned at opposite sides of the front panel, and each contacts, when the equipment unit is received in the apparatus body, the inner periphery of the frame at one end and is exposed to the outside of apparatus body at the other end. The mounting members each are rotatable in a direction in which the equipment unit is inserted into the apparatus body.
    • 在用于将设备单元从设备本体安装和拆卸的结构中,所述设备主体包括在预选端形成有槽的板状框架和与所述槽相邻的孔,用于经由所述槽接收所述设备单元,所述设备单元包括前部 面板和一对安装构件。 安装构件位于前面板的相对侧,并且当设备单元被容纳在设备主体中时,每个接触件在一端处在框架的内周边并且在另一端暴露于设备主体的外部 。 安装构件各自可以在设备单元插入设备主体的方向上旋转。
    • 10. 发明授权
    • Method for producing semiconductors
    • 半导体制造方法
    • US5118642A
    • 1992-06-02
    • US645441
    • 1991-01-24
    • Akira YoshinoKenji OkumuraYoshinori OhmoriToshiharu Ohnishi
    • Akira YoshinoKenji OkumuraYoshinori OhmoriToshiharu Ohnishi
    • C30B25/14
    • C30B25/14Y10S117/902Y10S148/056
    • A reactant gas is fed to a dispersing chamber which is disposed under a reaction chamber, and both disposed within a vacuum chamber. The reactant gas is dispersed and then fed through a plurality of communicating holes to the reaction chamber. A second reactant gas is fed to a lower dispersing chamber. After dispersion, this second gas is fed through pipes through the first dispersing chamber and into the reaction chamber around the first reaction gas. Said first reactant gas is blown off downward from the end opening of the feeding pipe and dispersed in parallel along the collar portion and dispersed homogeneously in the first reactant gas dispersing chamber, and in the state, is introduced to the reaction chamber via communicating holes.
    • 将反应气体供给到分散室,该分散室设置在反应室下方,并且都设置在真空室内。 反应物气体被分散,然后通过多个连通孔进入反应室。 第二反应气体被供给到下分散室。 分散后,该第二气体通过管道通过第一分散室进料并进入第一反应气体周围的反应室。 所述第一反应气体从所述进料管的端部开口向下吹出,并沿着所述套环部分平行分散并均匀地分散在所述第一反应气体分散室中,并且在所述状态下,通过所述连通孔引入所述反应室。