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    • 4. 发明申请
    • Method of installing IC tag in packaged commodity
    • IC标签在包装商品中的安装方法
    • US20060283748A1
    • 2006-12-21
    • US11448119
    • 2006-06-07
    • Fumio DaioKazunori Haraguchi
    • Fumio DaioKazunori Haraguchi
    • B65D73/00
    • B65D75/366B65D2203/10B65D2575/367
    • An IC tag is installed in a blister pack in which a commodity is stored in a cavity formed in a transparent resin sheet and the periphery of the transparent resin sheet is joined to a backing sheet. The antenna of the IC tag or the connection line in connection with its IC chip is provided at the joint location between the transparent resin sheet and the backing sheet. Once the connection between the transparent resin sheet and the backing sheet is broken and the commodity is taken out, the antenna or the connection line is broken, which disables the IC tag. Therefore, an unlawful item that cannot be identified from its appearance is detected by accessing the IC tag using a reader/writer.
    • 将IC标签安装在泡罩包装中,其中将商品存储在形成在透明树脂片中的空腔中,并且透明树脂片的周边与背衬片接合。 IC标签的天线或与其IC芯片相连的连接线设置在透明树脂片和背衬片之间的接合位置处。 一旦透明树脂片与背衬片之间的连接被破坏并且商品被取出,则天线或连接线断开,这使得IC标签无效。 因此,通过使用读取器/写入器访问IC标签来检测不能从其外观识别的非法项目。