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1. 发明授权

US07875483B2 Manufacturing method of microelectromechanical system 有权
标题翻译：微机电系统制造方法
公开(公告)号：US07875483B2
公开(公告)日：2011-01-25
申请号：US11462225
申请日：2006-08-03
申请人： Konami Izumi , Mayumi Yamaguchi , Fuminori Tateishi
发明人： Konami Izumi , Mayumi Yamaguchi , Fuminori Tateishi
IPC分类号： H01L21/00
CPC分类号： B81C1/0015 , B81B2203/0118 , B81C1/00404 , B81C2201/0109
摘要： To provide a method of easily forming a three-dimensional structure typified by a cantilever by using a thin film formed over an insulating surface, and provide a microelectromechanical system formed by such a method. A three-dimensional structure typified by a cantilever is formed by using a mask having a nonuniform thickness. Specifically, a microstructure is manufactured by processing a structural layer formed over a sacrificial layer by using a mask having a nonuniform thickness and then removing the sacrificial layer. The sacrificial layer can be formed by using a silicon layer or a metal layer.
摘要翻译：提供通过使用形成在绝缘表面上的薄膜来容易地形成以悬臂为代表的三维结构的方法，并提供通过这种方法形成的微机电系统。通过使用具有不均匀厚度的掩模形成由悬臂代表的三维结构。具体地，通过使用具有不均匀厚度的掩模，然后去除牺牲层，通过加工在牺牲层上形成的结构层来制造微结构。牺牲层可以通过使用硅层或金属层形成。

2. 发明授权

US07537953B2 Manufacturing method of microstructure and microelectromechanical system 有权
标题翻译：微结构和微机电系统的制造方法
公开(公告)号：US07537953B2
公开(公告)日：2009-05-26
申请号：US11557353
申请日：2006-11-07
申请人： Fuminori Tateishi , Konami Izumi , Mayumi Yamaguchi
发明人： Fuminori Tateishi , Konami Izumi , Mayumi Yamaguchi
IPC分类号： G01R31/26
CPC分类号： B81C1/00476
摘要： To reduce the number of photomasks which are used to form sacrificial layers for producing spaces of a microstructure, thereby reducing the manufacturing cost. Sacrificial layers are formed by using resist masks which are patterned with the same photomask. Specifically, after forming a first sacrificial layer by etching using a resist mask, a second sacrificial layer is formed by etching using a resist mask which is pattered with same photomask as the resist mask of the first sacrificial layer. By deforming one of the resist masks before etching its corresponding sacrificial layer, for example by increasing or reducing the external dimension of the resist mask, sacrificial layers having different sizes from each other can be formed.
摘要翻译：为了减少用于形成用于形成微结构的空间的牺牲层的光掩模的数量，从而降低制造成本。牺牲层通过使用用相同光掩模图案化的抗蚀剂掩模形成。具体而言，在使用抗蚀剂掩模蚀刻形成第一牺牲层之后，通过使用与第一牺牲层的抗蚀剂掩模相同的光掩模图案化的抗蚀剂掩模进行蚀刻来形成第二牺牲层。在蚀刻其相应的牺牲层之前，通过使抗蚀剂掩模之一变形，例如通过增加或减小抗蚀剂掩模的外部尺寸，可以形成具有彼此不同尺寸的牺牲层。

3. 发明授权

US08822251B2 Micro electro mechanical system, semiconductor device, and manufacturing method thereof 有权
标题翻译：微机电系统，半导体器件及其制造方法
公开(公告)号：US08822251B2
公开(公告)日：2014-09-02
申请号：US12426602
申请日：2009-04-20
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： H01L21/00 , H01L21/30 , H01L21/46
CPC分类号： B60C23/0493 , A61B5/02444 , A61B5/681 , B60C23/04 , B60C23/0408 , B60C23/0411 , B60C23/0413 , B60C23/20 , B81C1/0023 , G01L1/16 , G01L17/00 , H01L21/02118 , H01L21/02175 , H01L21/02183 , H01L21/02186 , H01L21/02189 , H01L21/54 , H01L24/93 , H01L27/20 , H01L35/34 , H01L41/25 , H01L41/311 , H01L41/313 , H01L2924/0002 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , Y10T29/42 , H01L2924/00
摘要： The present invention provides a MEMS and a sensor having the MEMS which can be formed without a process of etching a sacrifice layer. The MEMS and the sensor having the MEMS are formed by forming an interspace using a spacer layer. In the MEMS in which an interspace is formed using a spacer layer, a process for forming a sacrifice layer and an etching process of the sacrifice layer are not required. As a result, there is no restriction on the etching time, and thus the yield can be improved.
摘要翻译：本发明提供一种具有MEMS的MEMS和传感器，该传感器可以在没有蚀刻牺牲层的工艺的情况下形成。具有MEMS的MEMS和传感器通过使用间隔层形成间隙而形成。在使用间隔层形成间隙的MEMS中，不需要用于形成牺牲层的工艺和牺牲层的蚀刻工艺。结果，蚀刻时间没有限制，可以提高成品率。

4. 发明授权

US08552473B2 Micro-electro-mechanical device and manufacturing method for the same 有权
标题翻译：微机电装置及其制造方法相同
公开(公告)号：US08552473B2
公开(公告)日：2013-10-08
申请号：US13287150
申请日：2011-11-02
申请人： Fuminori Tateishi , Konami Izumi , Mayumi Yamaguchi
发明人： Fuminori Tateishi , Konami Izumi , Mayumi Yamaguchi
IPC分类号： H01L29/786
CPC分类号： C08F297/02 , A61J3/00 , B81C1/0023 , H01L27/1214 , H01L27/1218 , H01L27/1255 , H01L27/1262 , H01L27/1266 , Y02P20/582
摘要： It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processsing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
摘要翻译：本发明的目的是提供一种在一个表面上具有微结构和半导体元件的微机电装置。特别地，本发明的目的是提供一种简化在一个表面上形成微结构和半导体元件的工艺的方法。通过在形成半导体元件的工艺中形成绝缘层来形成微结构移动的空间，即微结构的可移动空间。可移动空间可以通过形成具有多个开口的绝缘层并使开口彼此面对地彼此重叠而形成。

5. 发明申请

US20110006784A1 TEST METHOD OF MICROSTRUCTURE BODY AND MICROMACHINE 有权
标题翻译：微结构体和微生物的测试方法
公开(公告)号：US20110006784A1
公开(公告)日：2011-01-13
申请号：US12888617
申请日：2010-09-23
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori TATEISHI
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori TATEISHI
IPC分类号： G01R27/04
CPC分类号： B81C99/004 , G01R31/3025
摘要： It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
摘要翻译：本发明的目的是提供一种微机械结构体的过程，电特性和机械特性的测试方法。提供一种结构体，包括第一导电层，与第一导电层平行设置的第二导电层，以及设置在第一导电层和第二导电层之间的牺牲层或空间。提供连接到结构体的天线; 电力通过天线无线地提供给结构体; 并且从天线产生的电磁波被检测为结构体的特征。

6. 发明授权

US07808253B2 Test method of microstructure body and micromachine 有权
标题翻译：微结构体和微机械的试验方法
公开(公告)号：US07808253B2
公开(公告)日：2010-10-05
申请号：US11565135
申请日：2006-11-30
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： G01R27/32 , G01R31/26
CPC分类号： B81C99/004 , G01R31/3025
摘要： It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
摘要翻译：本发明的目的是提供一种微机械结构体的过程，电特性和机械特性的测试方法。提供一种结构体，包括第一导电层，与第一导电层平行设置的第二导电层，以及设置在第一导电层和第二导电层之间的牺牲层或空间。提供连接到结构体的天线; 电力通过天线无线地提供给结构体; 并且从天线产生的电磁波被检测为结构体的特征。

7. 发明授权

US08558555B2 Test method of microstructure body and micromachine 有权
标题翻译：微结构体和微机械的试验方法
公开(公告)号：US08558555B2
公开(公告)日：2013-10-15
申请号：US12888617
申请日：2010-09-23
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： G01R27/32 , G01R31/26
CPC分类号： B81C99/004 , G01R31/3025
摘要： It is an object to provide a test method of a process, an electric characteristic, and a mechanical characteristic of a structure body in a micromachine without contact. A structure body including a first conductive layer, a second conductive layer provided in parallel to the first conductive layer, and a sacrifice layer or a space provided between the first conductive layer and the second conductive layer is provided; an antenna connected to the structure body is provided; electric power is supplied to the structure body wirelessly through the antenna; and an electromagnetic wave generated from the antenna is detected as a characteristic of the structure body.
摘要翻译：本发明的目的是提供一种微机械结构体的过程，电特性和机械特性的测试方法。提供一种结构体，包括第一导电层，与第一导电层平行设置的第二导电层，以及设置在第一导电层和第二导电层之间的牺牲层或空间。提供连接到结构体的天线; 电力通过天线无线地提供给结构体; 并且从天线产生的电磁波被检测为结构体的特征。

8. 发明授权

US08058145B2 Micro-electro-mechanical device and manufacturing method for the same 有权
标题翻译：微机电装置及其制造方法相同
公开(公告)号：US08058145B2
公开(公告)日：2011-11-15
申请号：US12842061
申请日：2010-07-23
申请人： Fuminori Tateishi , Konami Izumi , Mayumi Yamaguchi
发明人： Fuminori Tateishi , Konami Izumi , Mayumi Yamaguchi
IPC分类号： H01L21/00
CPC分类号： C08F297/02 , A61J3/00 , B81C1/0023 , H01L27/1214 , H01L27/1218 , H01L27/1255 , H01L27/1262 , H01L27/1266 , Y02P20/582
摘要： It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by processing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
摘要翻译：本发明的目的是提供一种在一个表面上具有微结构和半导体元件的微机电装置。特别地，本发明的目的是提供一种简化在一个表面上形成微结构和半导体元件的工艺的方法。通过处理在形成半导体元件的工艺中形成的绝缘层来形成微结构移动的空间，即微结构的可移动空间。可移动空间可以通过形成具有多个开口的绝缘层并使开口彼此面对地彼此重叠而形成。

9. 发明申请

US20100285627A1 MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING METHOD FOR THE SAME 有权
标题翻译：微电子机械装置及其制造方法
公开(公告)号：US20100285627A1
公开(公告)日：2010-11-11
申请号：US12842061
申请日：2010-07-23
申请人： Fuminori TATEISHI , Konami Izumi , Mayumi Yamaguchi
发明人： Fuminori TATEISHI , Konami Izumi , Mayumi Yamaguchi
IPC分类号： H01L21/50
CPC分类号： C08F297/02 , A61J3/00 , B81C1/0023 , H01L27/1214 , H01L27/1218 , H01L27/1255 , H01L27/1262 , H01L27/1266 , Y02P20/582
摘要： It is an object of the present invention to provide a micro-electro-mechanical-device having a microstructure and a semiconductor element over one surface. In particular, it is an object of the present invention to provide a method for simplifying the process of forming the microstructure and the semiconductor element over one surface. A space in which the microstructure is moved, that is, a movable space for the microstructure is formed by procecssing an insulating layer which is formed in a process of forming the semiconductor element. The movable space can be formed by forming the insulating layer having a plurality of openings and making the openings face each other to be overlapped each other.
摘要翻译：本发明的目的是提供一种在一个表面上具有微结构和半导体元件的微机电装置。特别地，本发明的目的是提供一种简化在一个表面上形成微结构和半导体元件的工艺的方法。通过在形成半导体元件的工艺中形成绝缘层来形成微结构移动的空间，即微结构的可移动空间。可移动空间可以通过形成具有多个开口的绝缘层并使开口彼此面对地彼此重叠而形成。

10. 发明授权

US07610794B2 Particle detection sensor, method for manufacturing particle detection sensor, and method for detecting particle using particle detection sensor 有权
标题翻译：粒子检测传感器，粒子检测传感器的制造方法以及使用粒子检测传感器检测粒子的方法
公开(公告)号：US07610794B2
公开(公告)日：2009-11-03
申请号：US11467320
申请日：2006-08-25
申请人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
发明人： Mayumi Yamaguchi , Konami Izumi , Fuminori Tateishi
IPC分类号： G01N27/04 , G01N15/02
CPC分类号： G01N15/1031 , G01N15/1056
摘要： A compact sensor with which particles floating in the air can be easily detected. A sensor having a microstructure which detects a detection object by contact is used. A microstructure has an opening to be a detection hole corresponding to the size of a detection object, and a pair of electrodes having a bridge structure are provided thereabove or thereunder so as to partially contact with each other.
摘要翻译：可以容易地检测到一种紧凑的传感器，可以很容易地检测到悬浮在空气中的颗粒。使用具有通过接触检测检测对象的微结构的传感器。微结构具有对应于检测对象尺寸的检测孔的开口，并且在其上方或其下方设置具有桥接结构的一对电极，以便彼此部分接触。

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