专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2012192385A Powder coating method 有权
标题翻译：粉末涂料方法
公开(公告)号：JP2012192385A
公开(公告)日：2012-10-11
申请号：JP2011060165
申请日：2011-03-18
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KOSUGI HISAFUMI , YUI YASUSHI
IPC分类号： B05D1/06
CPC分类号： B05D1/06 , B05D2202/00 , C09D5/032 , Y10T428/31529
摘要： PROBLEM TO BE SOLVED: To provide a powder coating method which gives a fine surface having a substantially uniform coating thickness with no orange peel or lack of hiding.SOLUTION: A coating film is formed on a surface of a coating object 13 by adhering a coating powder to the coating object 13 by spraying the coating powder from an electrostatic gun 12 together with a compressed gas. A voltage not smaller than 80 kV but not larger than 100 kV is applied between the electrostatic gun 12 and the coating object 13. Moreover, a current flowed between the electrostatic gun 12 and the coating object 13 is set to be not smaller than 10 μA but not larger than 20 μA. Further, a pressure of the compressed gas for spraying the coating powder is set to be not smaller than 3 kgf/cmbut not larger than 6 kgf/cm.
摘要翻译：要解决的问题：提供一种粉末涂覆方法，其赋予具有基本上均匀的涂层厚度，没有橙皮或不起隐藏的精细表面。解决方案：通过将静电枪12的涂布粉末与压缩气体一起喷涂，将涂料粉末粘附到涂布物体13上，在涂布体13的表面上形成涂膜。在静电枪12和被涂物13之间施加不小于80kV但不大于100kV的电压。此外，在静电枪12和被涂物13之间流动的电流设定为不小于10μA 但不大于20μA。此外，用于喷涂涂料粉末的压缩气体的压力被设定为不小于3kgf / cm 2，而不大于6kgf / cm 2 SP SP =“ POST“> 2 。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2010016024A Molded product 有权
标题翻译：模制产品
公开(公告)号：JP2010016024A
公开(公告)日：2010-01-21
申请号：JP2008171994
申请日：2008-07-01
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YUI YASUSHI
IPC分类号： H05K9/00 , B29C45/14
CPC分类号： H05K9/0045 , B29C45/14639 , B29C45/14778 , B29K2705/00 , B29K2995/006 , B29L2031/3431 , B29L2031/345
摘要： PROBLEM TO BE SOLVED: To provide a molded product that increases shield effect with a simple structure.
SOLUTION: A body 32 is formed of a resin material. A metal plate 31 covers the back surface of the body 32. An adhesive agent 33 is provided between the body 32 and the metal plate 31. The metal-plated film 37 is formed on the front surface of the body and electrically connected to the metal plate 31. Such a molded product 15 is improved in mechanical strength based upon the metal plate 31. Further, the metal plate 31 and metal-plated film 37 each function as a shield layer. The shield layers are formed to have wide area. The shield effect of the molded product 15 is improved. In addition, the metal-plated film 37 is electrically connected to the metal plate 31. Consequently, the shield effect is improved more.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供以简单的结构增加屏蔽效果的模制产品。解决方案：主体32由树脂材料形成。金属板31覆盖主体32的背面。粘合剂33设置在主体32和金属板31之间。金属镀膜37形成在主体的前表面上并与金属电连接这种模制品15基于金属板31的机械强度提高。此外，金属板31和金属镀膜37均用作屏蔽层。屏蔽层形成为具有宽的面积。模制品15的屏蔽效果得到改善。此外，金属镀膜37与金属板31电连接。因此，屏蔽效果进一步提高。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2007197523A Biodegradable resin molded article and method for producing the same 有权
标题翻译：生物可降解树脂模制品及其生产方法
公开(公告)号：JP2007197523A
公开(公告)日：2007-08-09
申请号：JP2006015890
申请日：2006-01-25
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YUI YASUSHI
IPC分类号： C08J7/04 , B32B15/09 , B32B27/36 , C08L101/16
CPC分类号： C09D5/32 , C09D5/24 , Y10T428/31504 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To provide a biodegradable resin molded article which is molded from a biodegradable resin material, but certainly has conductivity.
SOLUTION: This biodegradable resin molded article 14 is characterized by comprising a main body 25 formed from a biodegradable resin material and a coating film 26 covering the surface of the main body 25. In the biodegradable resin molded article 14, the coating film 26 is sufficiently adhered to the surface of the main body 25. Conductivity is surely established in the biodegradable resin molded article 14. The coating film can act as an electromagnetic wave shield or an earth. The coating film 26 can simply be peeled from the surface of the main body, for example, on the basis of sand blasting. After the peeling, the main body 25 can be degraded, for example, in soil. The production of wastes is avoided as much as possible. When the main body is burned, the production of carbon dioxide is reduced to an amount of an approximately half based on that on the combustion of an oil-based resin material.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种由可生物降解的树脂材料成型但可以具有导电性的可生物降解的树脂模塑制品。解决方案：该生物降解性树脂成型体14的特征在于，包括由生物降解性树脂材料形成的主体25和覆盖主体25的表面的涂膜26.在生物降解性树脂成形体14中， 26被充分地粘附在主体25的表面上。在生物降解性树脂模塑制品14中肯定地形成了电导率。涂膜可以用作电磁波屏蔽或地球。涂膜26可以简单地从主体的表面剥离，例如，基于喷砂。剥离后，主体25例如在土壤中劣化。尽可能避免废物的生产。当主体燃烧时，基于油性树脂材料的燃烧时的二氧化碳的生成量减少到大约一半的量。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2008017112A Chassis 有权
标题翻译：机壳
公开(公告)号：JP2008017112A
公开(公告)日：2008-01-24
申请号：JP2006185536
申请日：2006-07-05
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAGARA KOHEI , YUI YASUSHI , YAMAGUCHI SHINGO , KANBAYASHI SATORU , SHINODA ISATO
IPC分类号： H04M1/02 , A63H33/30 , H05K5/02
摘要： PROBLEM TO BE SOLVED: To provide a chassis which can reduce the cost of development and of manufacturing, and shorten the design period regarding the chassis which is prepared in the appearance casing of a mock-up, and mounts sub-components arranged on a surface of the exterior casing.
SOLUTION: The chassis is provided with a plurality of sub-component positioning units which performs positioning of the sub-components 9 in the chassis 1, and sub-component fixing units which perform fixing of the sub-component 9 in the chassis 1. They function as the sub-component positioning units which perform positioning of the sub-components 9 with respect to the chassis 1 by convex units 7 on the chassis 1 in the drawing 1, and the sub-components fixing units which perform fixing with respect to the chassis 1.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够降低开发成本和制造成本的底盘，并且缩短了在模型的外观壳体中制备的底盘的设计周期，并且安装了布置在其上的子部件在外壳的表面上。解决方案：底盘设置有多个子部件定位单元，其执行子部件9在底盘1中的定位，以及子部件固定单元，其执行子部件9在底盘中的固定它们用作通过图1中的底盘1上的凸起单元7相对于底盘1定位子部件9的子部件定位单元，以及执行固定的子部件固定单元尊重底盘1.版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007106783A Resin molded product and electronic equipment using the same and method for treating resin molded product 审中-公开
标题翻译：树脂模制产品和使用它的电子设备和处理树脂模制产品的方法
公开(公告)号：JP2007106783A
公开(公告)日：2007-04-26
申请号：JP2005296071
申请日：2005-10-11
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YUI YASUSHI , YAMAGUCHI SHINGO , TAKAHASHI HIROSHI , NAGARA KOHEI
IPC分类号： C08J7/04 , B65D65/42 , B65D65/46 , C08J11/10 , C08L101/16 , H05K5/02
CPC分类号： C08J7/047 , C08J11/105 , C08J2300/16 , C08J2367/04 , Y02W30/702 , Y10T428/31504 , Y10T428/31801 , Y10T428/31826 , Y10T428/31844 , Y10T428/31971
摘要： PROBLEM TO BE SOLVED: To provide a resin molded product capable of improving a biodegradable rate and electronic equipment using the molded product and to provide a method for treating the resin molded product in which biodegradable rate can be improved. SOLUTION: The resin molded product 10 comprises a molded base material 11 composed of a biodegradable resin, and a coated film 12 formed on the surface of the molded base material 11, wherein the coated film 12 comprises a petroleum-based coating material, a natural material and a proliferation promoter for promoting proliferation of microorganisms, e.g. a carbohydrate or an amino acid. The resin molded product 10 proliferates microorganisms in soil by the proliferation promoter and improves biodegradable rate of the resin molded product 10. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够提高生物降解速度的树脂成型体和使用该成型体的电子设备，提供可以提高生物降解率的树脂成型体的处理方法。解决方案：树脂模制产品10包括由生物可降解树脂构成的模塑基材11和形成在模制基材11的表面上的涂膜12，其中涂膜12包括石油基涂料，天然物质和促进微生物增殖的增殖启动子，例如碳水化合物或氨基酸。树脂成型体10通过增殖促进剂在土壤中增殖微生物，提高树脂成型体10的生物降解率。（C）2007，JPO＆INPIT

6. 发明专利

JP2014063811A Electronic apparatus 有权
标题翻译：电子设备
公开(公告)号：JP2014063811A
公开(公告)日：2014-04-10
申请号：JP2012206910
申请日：2012-09-20
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YUI YASUSHI , FUJITA SHUHEI , OKAMOTO SHINICHIRO , KONO SHINICHIRO , SUGIE MASARU
IPC分类号： H05K9/00
CPC分类号： H05K9/0007 , H05K9/0022
摘要： PROBLEM TO BE SOLVED: To realize the downsizing of an electronic apparatus.SOLUTION: An electronic apparatus includes: a housing 11; a conductive film 12 which is provided on an inner surface 11a of the housing 11 and includes a recessed part 12a on its surface; a circuit board 3 which is housed in the housing 11; and a semiconductor element 4 provided on the circuit board 3; and a conductive frame 13 fixed to an area on the circuit board 3 which is located around the semiconductor element 4 and fitting in the recessed part 12a.
摘要翻译：要解决的问题：实现电子设备的小型化。电子设备包括：壳体11; 导电膜12，其设置在壳体11的内表面11a上并且在其表面上包括凹部12a; 容纳在壳体11中的电路板3; 以及设置在电路板3上的半导体元件4; 以及导电框架13，其固定在位于半导体元件4周围的电路基板3上的与凹部12a嵌合的区域。

7. 发明专利

JP2009119672A Molded product of biodegradable resin and its manufacturing method 审中-公开
标题翻译：生物可降解树脂的成型产品及其制造方法
公开(公告)号：JP2009119672A
公开(公告)日：2009-06-04
申请号：JP2007294889
申请日：2007-11-13
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YUI YASUSHI
IPC分类号： B32B27/06 , B29C45/14 , B29K105/22 , C08J5/12 , C08L101/16
CPC分类号： B29C45/14778 , B29C37/0025 , B29C45/14639 , B29C65/48 , B29C65/483 , B29C65/562 , B29C66/1122 , B29C66/5346 , B29C66/545 , B29C66/71 , B29C66/712 , B29C66/7379 , B29C66/73791 , B29C66/742 , B29K2021/00 , B29K2305/00 , B29K2705/00 , B29K2715/006 , B29K2995/0012 , B29K2995/0059 , B29K2995/006 , B29L2031/3002 , B29L2031/3425 , B29L2031/3437 , B29L2031/3481 , B32B1/00 , B32B7/06 , B32B7/12 , B32B15/08 , B32B23/04 , B32B23/20 , B32B27/36 , B32B2255/06 , B32B2255/10 , B32B2307/304 , B32B2307/7163 , B32B2457/00 , G06F1/1616 , G06F1/1656 , Y10T156/10 , Y10T428/31504 , Y10T428/31515 , Y10T428/31522 , Y10T428/31663 , Y10T428/31935 , B29K2067/046 , B29K2001/12
摘要： PROBLEM TO BE SOLVED: To provide a molded product of a biodegradable resin capable of avoiding the deterioration of the environment while achieving a heat insulating effect by a simple structure, and to provide its manufacturing method. SOLUTION: In the molded product 14 of a biodegradable resin, the surface of a main body 21 is coated with a heat insulator 22. By the simple structure, the heat insulating effect is obtained. Further the adhesive 23 is melted, for example, by heat treatment. The heat insulator 22 is easily stripped off from the surface of the main body 21. In addition, the main body 21 formed of a biodegradable resin material is easily decomposed, for example, in the soil. The generation of a waste material is prevented. Besides, upon thermal recycling for example, the emission of a carbon dioxide in incinerating the main body is suppresses by almost the half of that of a petroleum-based resin material. The worsening of the environment is avoided. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种能够通过简单的结构实现隔热效果而能够避免环境恶化的生物降解性树脂的成型体，提供其制造方法。解决方案：在可生物降解树脂的模制产品14中，主体21的表面涂覆有绝热体22.通过简单的结构，获得绝热效果。此外，粘合剂23例如通过热处理而熔融。绝热体22容易从主体21的表面剥离。此外，由生物降解性树脂材料形成的主体21容易分解，例如在土壤中。防止废料的产生。此外，在热再循环的情况下，焚烧主体的二氧化碳排放量几乎减少了石油基树脂材料的一半。避免环境恶化。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2007077273A Resinous molded product 有权
标题翻译：树脂成型产品
公开(公告)号：JP2007077273A
公开(公告)日：2007-03-29
申请号：JP2005266896
申请日：2005-09-14
申请人： Fujitsu Ltd , 富士通株式会社
发明人： NAGARA KOHEI , YUI YASUSHI , YAMAGUCHI SHINGO , TAKAHASHI HIROSHI
IPC分类号： C08J7/04 , C08L101/00 , C08L101/16 , C09D193/00 , C09D199/00 , C09D201/00
CPC分类号： C08J7/047 , C08J2300/16 , C08J2493/00
摘要： PROBLEM TO BE SOLVED: To provide a new resin molded product excellent in mechanical properties of a coated film and capable of controlling biodegradability inhibition when a biodegradable resin is biodegraded by microorganisms. SOLUTION: This resin molded product comprises a molded substrate 11 made of the biodegradable resin and a coated film 12 formed on a surface of the substrate 11, wherein the coated film 12 is formed by coating a mixture made of a petroleum based coating and a natural material. Because the natural material is rapidly biodegraded comparing with a synthetic resin contained in the petroleum based coating, the natural material does not inhibit biodegradation of the molded substrate 11 and can reduce residues after biodegradation. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种涂覆膜机械性能优异的新树脂成型体，并且当生物降解性树脂被微生物降解时能够控制生物降解性抑制。解决方案：该树脂模制产品包括由可生物降解树脂制成的模塑基材11和形成在基材11的表面上的涂膜12，其中涂布膜12通过涂布由石油基涂料和天然材料。由于与石油基涂料中含有的合成树脂相比，天然材料快速生物降解，天然材料不会抑制模制基材11的生物降解，并且可以降低生物降解后的残留。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2005146323A Surface treatment method for molded metallic product 有权
标题翻译：模塑金属产品的表面处理方法
公开(公告)号：JP2005146323A
公开(公告)日：2005-06-09
申请号：JP2003383441
申请日：2003-11-13
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YUI YASUSHI
IPC分类号： B05D3/10 , B05D7/14 , B32B15/04 , B32B15/08 , B32B15/20 , C23C22/36 , C23C22/83 , C23C28/00 , C25D11/06 , C25D11/30 , C25D11/34
CPC分类号： B32B15/08 , B32B15/04 , B32B15/20 , B32B2307/714 , C23C22/361 , C23C22/83 , C23C28/00 , C25D11/06 , C25D11/30 , C25D11/34
摘要： PROBLEM TO BE SOLVED: To increase the electric conductivity and the controllability of the exterior color in a protective film by a clean process wherein harmful substances are not used regarding a surface treatment method for a molded metallic product.
SOLUTION: A molded metallic product 1 composed of one of a single metal selected from Mg, Al, and Zn or an alloy composed essentially of any single metal selected from the above is dipped into a solution 2 composed essentially of an aluminum salt, and an oxide film 3 is formed on the surface of the molded metallic product 1.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

DE602006008886D1 未知
公开(公告)号：DE602006008886D1
公开(公告)日：2009-10-15
申请号：DE602006008886
申请日：2006-12-04
申请人： FUJITSU LTD
发明人： YUI YASUSHI
IPC分类号： C09D5/00
摘要： An article includes a base (25) or body made of a biodegradable resin. The article allows the base (25) to have the surface covered with a coating film (26) containing a conductive material. The coating film (26) firmly attaches to the surface of the base (25), This results in a reliable establishment of an electric conductivity of the article. The coating film (26) functions as a shield for electromagnetic waves, a ground, and the like. Sandblast may be employed to remove the coating film (26) off the surface of the base (25). The base (25) can be decomposed in the ground. Refuse can thus be decreased to the utmost. Even when the base (25) is incinerated, the amount of carbon dioxide can be reduced to approximately half the amount obtained in the case of a base (25) made of a petroleum resin material.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式