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1. 发明专利

JP2014239106A 筐体及びその製造方法有权
标题翻译：其外壳及其制造方法
公开(公告)号：JP2014239106A
公开(公告)日：2014-12-18
申请号：JP2013119764
申请日：2013-06-06
申请人：富士通株式会社 , Fujitsu Ltd
发明人： ISHIZUKA MASANOBU , ABE TOMOYUKI
IPC分类号： H05K5/02 , G06F1/16 , H04M1/02
摘要：【課題】薄型化及び軽量化が可能であるとともに十分な強度を確保でき、電波を送受信する機能を備えた電子機器に適用できる筐体及びその製造方法を提供する。【解決手段】筐体10は、非導電性繊維の集合体に樹脂を含浸させて形成された第1の繊維強化プラスチック部11と、非導電性繊維の集合体に樹脂を含浸させて形成され、第1の繊維強化プラスチック部11の外側に配置された第2の繊維強化プラスチック部13と、第1の繊維強化プラスチック部11と第2の繊維強化プラスチック部13との間に配置された剛性基板12とを有する。剛性基板12は、第1の繊維強化プラスチック部11及び前記第2の繊維強化プラスチック部13よりも剛性が高い。【選択図】図2
摘要翻译：要解决的问题：提供一种外壳及其制造方法，能够实现厚度和重量的减轻和高强度，并且应用于具有发射和接收无线电波功能的电子设备。解决方案：机壳10包括：第一光纤 - 通过用树脂浸渍非导电纤维聚集体形成的增强塑料部分11; 第二纤维强化塑料部分13，其通过用树脂浸渍非导电纤维聚集体并且设置在第一纤维增强塑料部分11的外侧上; 以及设置在第一纤维强化塑料部11和第二纤维强化塑料部13之间的刚性基板12.刚性基板12的刚性高于第一纤维强化塑料部11和第二纤维强化塑料部13 。

2. 发明专利

JP2014183114A Exterior member for electronic apparatus, electronic apparatus, and process of manufacturing exterior member for electronic apparatus 有权
标题翻译：电子设备外部成员，电子设备及制造电子设备外部成员的过程
公开(公告)号：JP2014183114A
公开(公告)日：2014-09-29
申请号：JP2013055482
申请日：2013-03-18
申请人： Fujitsu Ltd , 富士通株式会社
发明人： ISHIZUKA MASANOBU , ABE TOMOYUKI
IPC分类号： H05K1/02 , B32B7/02 , H05K3/46 , H05K5/02
摘要： PROBLEM TO BE SOLVED: To provide an exterior member for an electronic apparatus having a plurality of layers of conductor patterns and through-holes.SOLUTION: The exterior member for an electronic apparatus includes: a laminate of a plurality of sheet materials on which conductive patterns are formed, respectively; through-holes formed on the laminate; and a heat-resistant material, provided at the laminate, having such heat resistance as not to be penetrated against heat when forming the through-hole, and through which the through-hole terminates without penetrating.
摘要翻译：要解决的问题：提供一种具有多层导体图案和通孔的电子设备的外部构件。解决方案：电子设备的外部构件包括：多个片材的层压体，导电图案分别形成; 形成在层压板上的通孔; 以及设置在层叠体上的耐热材料，其具有在形成贯通孔时不耐热的耐热性，贯通孔终止而不穿透。

3. 发明专利

JP2012222214A Cooler, electronic apparatus, and cooling system 有权
标题翻译：冷却器，电子设备和冷却系统
公开(公告)号：JP2012222214A
公开(公告)日：2012-11-12
申请号：JP2011087918
申请日：2011-04-12
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKASU YOICHI , YOSHINO MAKOTO , ABE TOMOYUKI
IPC分类号： H05K7/20 , G06F1/20 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a cooler in which the possibility of liquid leakage can be determined under actual use conditions, and to provide an electronic apparatus equipped with that cooler, and a cooling system.SOLUTION: The cooler 33 being fixed to a heating component, e.g. a CPU 23, comprises a heat exchange part 21 internally provided with a space through which cooling water 25 circulates, a housing 22 which is bonded to the heat exchange part 21 and forms a space therebetween, and a leakage detection agent 26 arranged in the space between the heat exchange part 21 and the housing 22. When a hole is made in the top plate 21b of the heat exchange part 21 because of long term use, the leakage detection agent 26 is mixed into the cooling water 25. The possibility of liquid leakage can be determined by examining mixture of the leakage detection agent 26 into the cooling water 25.
摘要翻译：要解决的问题：提供一种在实际使用条件下可以确定液体泄漏的可能性的冷却器，并提供配备有该冷却器的电子设备和冷却系统。解决方案：冷却器33固定到加热部件，例如， CPU23包括内部设置有冷却水25循环的空间的热交换部21，与热交换部21接合并形成空间的壳体22和配置在该空间中的泄漏检测剂26 在热交换部件21和壳体22之间。当由于长期使用而在热交换部件21的顶板21b上形成孔时，将泄漏检测剂26混入冷却水25中。液体的可能性可以通过检查泄漏检测剂26到冷却水25中的混合物来确定泄漏。版权所有：（C）2013，JPO＆INPIT

4. 发明专利

JP2011009651A Method of processing resin surface, and method of manufacturing composite member, housing and electronic apparatus 有权
标题翻译：加工树脂表面的方法和制造复合构件，住房和电子设备的方法
公开(公告)号：JP2011009651A
公开(公告)日：2011-01-13
申请号：JP2009154078
申请日：2009-06-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SAITO KAZUMASA , ABE TOMOYUKI
IPC分类号： H05K3/38 , H05K3/18 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To solve the problem that a resin surface which contains no inorganic filler can not be roughened by a method of roughening a resin surface by etching an inorganic filler, and a resin surface which contains no butadiene component can not be roughened by a method of desorbing a butadiene compound of a resin from a resin member through oxidative decomposition.SOLUTION: The resin surface of a member, where a resin is exposed, is covered with monosubstituted trialkoxysilane or disubstituted dialkoxysilane to form a liquid film of the monosubstituted trialkoxysilane or disubstituted dialkoxysilane. The monosubstituted trialkoxysilane or disubstituted dialkoxysilane of the liquid film is polymerized to form a plurality of polysiloxane films dotted on the resin surface. The resin surface is etched using the polysiloxane films as an etching mask to roughen the resin surface.
摘要翻译：要解决的问题：为了解决通过蚀刻无机填料使树脂表面粗糙化的方法不能使不含无机填料的树脂表面粗糙化的问题，并且不含有丁二烯成分的树脂表面不能被粗糙化通过氧化分解从树脂构件中解吸树脂的丁二烯化合物的方法。解决方案：树脂暴露的部件的树脂表面被单取代的三烷氧基硅烷或二取代的二烷氧基硅烷覆盖，以形成单取代的三烷氧基硅烷的液膜或二取代的二烷氧基硅烷。将液膜的单取代三烷氧基硅烷或二取代二烷氧基硅烷聚合，形成树脂表面上点缀的多个聚硅氧烷膜。使用聚硅氧烷膜作为蚀刻掩模蚀刻树脂表面以使树脂表面粗糙化。

5. 发明专利

JP2009302459A Wiring board, and manufacturing method thereof 有权
标题翻译：接线板及其制造方法
公开(公告)号：JP2009302459A
公开(公告)日：2009-12-24
申请号：JP2008157936
申请日：2008-06-17
申请人： Fujitsu Ltd , 富士通株式会社
发明人： ABE TOMOYUKI
IPC分类号： H05K3/46 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a wiring board capable of obtaining a narrow pitch of a through-hole of a core board, and a manufacturing method of the wiring board capable of forming the through-hole of the core board by a simple process. SOLUTION: The wiring board 50 includes a core layer 30 having a carbon fiber 20. The core layer 30 is formed by alternately laying out the carbon fiber 20 and an organic fiber or a glass fiber 25, respectively. In the core layer 30, at a place where the organic fiber or the glass fiber 25 is arranged, a through-hole 2 in which a conductive member 4 is arranged in the inner wall surface, is formed. The upper part and the lower part of the core layer 30 are conductive via the through-hole 2. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够获得芯板的通孔的窄间距的布线板，以及能够通过一个芯片板形成芯板的通孔的布线板的制造方法简单的过程。解决方案：布线板50包括具有碳纤维20的芯层30.芯层30分别通过交替地布置碳纤维20和有机纤维或玻璃纤维25而形成。在芯层30中，在有机纤维或玻璃纤维25配置的地方形成有在内壁面配置有导电性部件4的通孔2。核心层30的上部和下部通过通孔2是导电的。（C）2010，JPO＆INPIT

6. 发明专利

JP2009170500A Method of manufacturing printed wiring board 有权
标题翻译：制造印刷线路板的方法
公开(公告)号：JP2009170500A
公开(公告)日：2009-07-30
申请号：JP2008004226
申请日：2008-01-11
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SAITO KAZUMASA , ABE TOMOYUKI
IPC分类号： H05K3/44 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by forming fine through-holes having a single via structure in a conductive substrate.
SOLUTION: The method of manufacturing the printed wiring board includes the steps of: forming through-holes in a conductive core base material; immersing the conductive core base material in a liquid resin; taking the conductive core base material out of the liquid resin; and curing the liquid resin adhered to the inside wall of the through-hole to form an insulating film on the inside wall of the through-hole.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过在导电基板中形成具有单一通孔结构的精细通孔来制造印刷线路板的方法。解决方案：制造印刷电路板的方法包括以下步骤：在导电芯基材中形成通孔; 将导电芯基材浸渍在液体树脂中; 将导电芯基材从液态树脂中取出; 并且固化粘附到通孔的内壁的液体树脂，以在通孔的内壁上形成绝缘膜。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009099621A Method of manufacturing substrate 审中-公开
标题翻译：制造基板的方法
公开(公告)号：JP2009099621A
公开(公告)日：2009-05-07
申请号：JP2007267171
申请日：2007-10-12
申请人： Fujitsu Ltd , 富士通株式会社
发明人： IIDA KENJI , ABE TOMOYUKI , MAEHARA YASUTOMO , HIRANO SHIN , NAKAGAWA TAKASHI , YOSHIMURA HIDEAKI , YAMAWAKI SEIGO , OZAKI TOKUICHI
IPC分类号： H05K3/42 , H05K3/44 , H05K3/46
CPC分类号： H05K3/427 , H05K3/064 , H05K3/429 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/0347 , H05K2201/0959 , H05K2201/0969 , H05K2201/09809 , H05K2203/1178 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate, that correctly etches a conductor formed on the surface of the substrate in the production steps for substrates including a step of forming a through-hole in the substrate and fill it with an insulating material. SOLUTION: The method includes the steps of: forming a through-hole 18 in a substrate 16; filling the through-hole 18 with an insulating material 20 and performing electroless plating to coat the surface of the substrate 16; applying photoresist on the electroless-plated layer 80 formed on the surface of the substrate 16; optically exposing and developing the photoresist so as to form a resist pattern 72 coating an end face of the through-hole 18 filled with the insulating material 20; etching conductor layers 14 and 19 formed on the surface of the substrate 16 while using the resist pattern 72 as a mask; and removing the resist pattern 72 coating the end face of the through-hole 18 from the substrate 16 while using the electroless-plated layer 80 as a release layer. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种制造基板的方法，在基板的制造步骤中正确地蚀刻形成在基板的表面上的导体，包括在基板中形成通孔的步骤并将其填充用绝缘材料。解决方案：该方法包括以下步骤：在衬底16中形成通孔18; 用绝缘材料20填充通孔18并进行化学镀以涂覆基板16的表面; 在形成在基板16的表面上的化学镀层80上施加光致抗蚀剂; 光致曝光和显影光致抗蚀剂，以形成涂覆绝缘材料20的通孔18的端面的抗蚀图案72; 在使用抗蚀剂图案72作为掩模的同时，在基板16的表面上形成蚀刻导体层14和19; 并且在使用化学镀层80作为剥离层的同时，从基板16去除涂覆通孔18的端面的抗蚀剂图案72。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009044703A Frame synchronization unit, communication unit, and fault detection method 审中-公开
标题翻译：帧同步单元，通信单元和故障检测方法
公开(公告)号：JP2009044703A
公开(公告)日：2009-02-26
申请号：JP2007210691
申请日：2007-08-13
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FUKUDA ISAMU , ABE TOMOYUKI , HARADA HIROMI
IPC分类号： H04L7/08
摘要： PROBLEM TO BE SOLVED: To execute normality checking of a frame synchronization unit as needed before the occurrence of abnormality, and to promptly detect the occurrence of a fault in the frame synchronization unit, in regard to the frame synchronization unit, a communication unit, and a fault detection method. SOLUTION: A central processing unit 24 issues a command to transmit a frame synchronization signal. On receiving the command, a frame synchronization signal transmission section 22 reads out, from a frame number update section 21, a frame number (F2) at the time point of the frame synchronization signal transmission, adds it to the frame synchronization signal, and transmits them. The above frame synchronization signal is looped back by an upper-level unit (signal switch) 1. A frame synchronization signal reception section 23 reads out, from the frame number update section 21, a frame number (F5) at the time point of the frame synchronization signal reception being looped back, adds it to the frame synchronization signal, and transmits them to the central processing unit 24. The central processing unit 24 collates the relationship of magnitude between the frame numbers F2 and F5 in the received frame synchronization signal, and decides whether the frame synchronization is normal or abnormal. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了在发生异常之前根据需要执行帧同步单元的正常检查，并且为了及时检测帧同步单元中的故障的发生，关于帧同步单元，通信单元和故障检测方法。解决方案：中央处理单元24发出发送帧同步信号的命令。帧同步信号发送部22在帧同步信号发送部22接收到帧同步信号发送部22时，在帧同步信号发送的时刻从帧号更新部21读出帧号（F2），将其与帧同步信号相加，发送他们。上述帧同步信号由上级单元（信号开关）1回送。帧同步信号接收部23从帧号码更新部21读出在帧号更新部21的时刻的帧号（F5）帧同步信号接收被循环，将其添加到帧同步信号，并将其发送到中央处理单元24.中央处理单元24对接收的帧同步信号中的帧号F2和F5之间的幅度关系进行比较，并判定帧同步是正常还是异常。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008306513A Processing method of call access request signal, and radio base station control apparatus 审中-公开
标题翻译：呼叫接入请求信号的处理方法和无线基站控制装置
公开(公告)号：JP2008306513A
公开(公告)日：2008-12-18
申请号：JP2007152262
申请日：2007-06-08
申请人： Fujitsu Ltd , 富士通株式会社
发明人： ABE TOMOYUKI , TOMITA KENICHI
IPC分类号： H04W4/16 , H04W28/08 , H04W68/00 , H04W76/02
摘要： PROBLEM TO BE SOLVED: To efficiently execute a call access processing with regard to a processing method of a call access request signal and with regard to a radio base station control apparatus.
SOLUTION: The number of processing of the call access request signal of the radio base station with a low processing completion rate at a vergence is controlled by a step (1-1) for totaling a statistical information of the processing completion rate of each radio base station of the call access request signal (RACH) transmitted and received between a mobile machine and the radio base station, by steps (1-4 to 1-12) for gradually reducing the number of processing of the call access request signal of the radio base station each period at which the processing completion rate is a prescribed threshold value (M%) or lower and for setting a vergence control level so as to gradually increase the number of processing each period at which the processing completion rate is the prescribed threshold value (M%) or higher, and by a step (1-13) for calculating the number of processing of the call access request signal of the radio base station of a vergence control object according to the vergence control level. Also when the number of the call access request signal brought from some of the radio base stations is over a threshold value (N%) of a prescribed ratio of the number of a processable signal, the control of the processing is executed at once.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：有效地执行关于呼叫接入请求信号的处理方法的呼叫接入处理以及无线基站控制装置。解决方案：通过步骤（1-1）来控制具有处理完成率的处理完成率的无线基站的呼叫接入请求信号的处理次数，用于将处理完成率的统计信息合计为通过步骤（1-4至1-12）在移动机和无线电基站之间发送和接收的呼叫接入请求信号（RACH）的每个无线电基站，用于逐渐减少呼叫接入请求信号的处理次数在处理完成率为规定阈值（M％）以下的每个周期，并设定合并控制等级，以逐渐增加处理次数，每个处理完成率为规定阈值（M％）以上，步骤（1-13），用于计算根据聚合的聚合控制对象的无线基站的呼叫接入请求信号的处理次数控制级别。此外，当从一些无线电基站接收的呼叫接入请求信号的数量超过可处理信号的规定比率的阈值（N％）时，一次执行处理的控制。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008060270A Electronic device, and its manufacturing method 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2008060270A
公开(公告)日：2008-03-13
申请号：JP2006234399
申请日：2006-08-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKAMOTO KEISHIRO , ABE TOMOYUKI
IPC分类号： H01L21/60 , H01L25/00 , H05K3/28
CPC分类号： H01L2224/32225 , H01L2224/73204 , H01L2224/92125
摘要： PROBLEM TO BE SOLVED: To provide an electronic device which can suppress a large stress from being applied to a solder bump or the like of an adjacent semiconductor chip when it is desired to replace a faulty chip by a new chip, and to provide a method of manufacturing the electronic device. SOLUTION: The electronic device includes a substrate 2 having an electrode 44 formed thereon, semiconductor element 4 mounted on the substrate to be electrically connected with the electrode via a solder bump 46, and a sealing resin layer 68 formed between the substrate and the semiconductor element so as to bury the solder bump. The sealing resin layer is made of a foam having a thermal conductivity not larger than 0.1 W/mK. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种电子装置，当希望用新的芯片代替故障芯片时，可以抑制大的应力施加到相邻的半导体芯片的焊料凸块等，并且提供一种制造电子设备的方法。电子设备包括：基板2，其上形成有电极44;半导体元件4，其安装在基板上，以通过焊料凸点46与电极电连接;以及密封树脂层68，形成在基板和半导体元件以埋入焊料凸块。密封树脂层由导热率不大于0.1W / m·K的泡沫制成。版权所有（C）2008，JPO＆INPIT

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