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1. 发明专利

JPS59195856A Semiconductor device and manufacture thereof 失效
标题翻译：半导体器件及其制造
公开(公告)号：JPS59195856A
公开(公告)日：1984-11-07
申请号：JP7055883
申请日：1983-04-20
申请人： Fujitsu Ltd
发明人： MIZUKOSHI MASATAKA , ENDOU TEIICHI
IPC分类号： H01L21/60 , H01L23/49 , H01L23/498
CPC分类号： H01L24/85 , H01L23/498 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/06153 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48471 , H01L2224/48599 , H01L2224/48699 , H01L2224/49052 , H01L2224/49109 , H01L2224/49171 , H01L2224/49431 , H01L2224/4945 , H01L2224/78313 , H01L2224/85181 , H01L2224/85186 , H01L2224/85191 , H01L2224/85986 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01074 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00 , H01L2924/2075 , H01L2224/05599 , H01L2224/85399
摘要： PURPOSE:To reduce contact accidents, and to improve reliability by bonding wires so that the positions of the rise sections and fall sections of adjacent bonding wires are reversed mutually. CONSTITUTION:The directions of bonding of bonding wires connecting connecting pads 1 on a semiconductor chip 10 and connecting electrodes 2 on a semiconductor vessel 20 are all brought to the opposite directions among adjacent connecting pads and among adjacent connecting electrodes as shown in the arrows. According to such wire bonding, since the bonding wire rises high in the rise section of the connecting pad 1 or connecting electrode 2 bonded first and the wire is pulled in the direction of the arrow and is bonded and falls, the wires can be separated mutually at farther intervals in space, and the wires are made difficult to be brought into contact more than a bonding by a pull in the same direction (such as only in the forward direction).
摘要翻译：目的：减少接触事故，并通过接合线提高可靠性，使相邻接合线的上升部分和下降部分的位置相互反向。构成：如图箭头所示，将半导体芯片10上的连接焊盘1和半导体容器20上的连接电极2的接合线的接合方向全部沿着相邻的连接焊盘和相邻的连接电极之间的相反方向。根据这种引线接合，由于接合线在连接焊盘1的上升部分或第一接合电极2的上升部分上升，并且电线沿着箭头方向被拉动并被接合和下降，所以电线可以相互分离在空间中的间隔更远的地方，通过在相同方向（例如仅在向前方向）上的拉动而使得线难以接合。

2. 发明专利

JPS5489575A MANUFACTURE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5489575A
公开(公告)日：1979-07-16
申请号：JP15966277
申请日：1977-12-27
申请人： FUJITSU LTD
发明人： ENDOU TEIICHI
IPC分类号： H01L21/52 , H01L21/50 , H01L21/58 , H01L21/60
摘要： PURPOSE:To reduce the cost by achieving the accuracy of lead frame alignment and the increase in the working efficiency, through the keeping of the condition where the lead frames are linked continuously until the end of final process. CONSTITUTION:The lead frames 1a to 1n in wihich the aluminum layer 3 is coated to the die stage 4 and the bonding finger 5, are continuously formed. The semiconductor chip 6 is fitted with low melting point glass on the die stage 4. The bonding of wires between the chip 6 and the finger 5 is made with the aluminum wire 8, the chip 8 is sealed with the low melting point glass 11 by using the ceramic package, and the lead cut off of the lead frame 1 in continuity is made.

3. 发明专利

JPS5553436A WIRE BONDING DEVICE 失效
公开(公告)号：JPS5553436A
公开(公告)日：1980-04-18
申请号：JP12709578
申请日：1978-10-16
申请人： FUJITSU LTD
发明人： ENDOU TEIICHI
IPC分类号： H01L21/68 , H01L21/60
摘要： PURPOSE:To perform accurate positioning for a pellet and a capillary, by irradiating a beam of light onto a semiconductor pellet from above diagonally, causing the reflected light to strike a small light shutting metal piece placed in the center, and detecting light deviation by means of a detector, and thereby adjusting the position of the pellet. CONSTITUTION:Stage ST is mounted on precision jack mechanism J, which is controlled by control circuit CON, via stage travelling table ST'. On top of this is mounted package PK fitted with semiconductor pellet SP. Next, diagonally above pellet SP is provided light projector EL, which irradiates spot light. The reflected light from pellet SP is made to focus on light-shutting metal piece MP provided on mask M, via image focusing lens LNZ. At this time, the size of metal piece MP is set just large enough to shut the smallest light image, and the portion of spot light L deviated from the surface of pellet SP is detected by light detector PH. Subsequently, this output is sent to control circuit CON, and by operating stage ST, pellet SP is made to fit the position of capillary C provided on this.

4. 发明专利

JPS524780A MANUFACTURING METHOD OF SEMICONDUCTOR EQUIPMENT 失效
公开(公告)号：JPS524780A
公开(公告)日：1977-01-14
申请号：JP8122275
申请日：1975-07-01
申请人： FUJITSU LTD
发明人： ENDOU TEIICHI , KOMURO TOSHIO , ANDOU NOBORU
IPC分类号： H01L21/301 , H01L21/302
摘要： PURPOSE:To eliminate wiring short-circuit by making a groove beforehand in the scribe zone.

5. 发明专利

JPS5772338A Manufacture of semiconductor device 失效
标题翻译：半导体器件的制造
公开(公告)号：JPS5772338A
公开(公告)日：1982-05-06
申请号：JP14859980
申请日：1980-10-23
申请人： Fujitsu Ltd
发明人： ENDOU TEIICHI
IPC分类号： H01L21/52 , H01L23/24
CPC分类号： H01L23/24 , H01L24/32 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PURPOSE:To avoid a short circuit phenomena caused by a conductive piece by a method wherein the part of the chip-sticking surface of a ceramic package on which a semiconductor chip is not placed is coated with thermal resistant resin after the semiconductor chip is placed. CONSTITUTION:After a chip 2 is bonded to a surface 7 for sticking a chip of a ceramic package 1, the remaining surface is coated with polyimide or thermal resistant silicon resin 8. Through the situation, even if there are small pieces that are easy to be separated on the bottom surface, since they are enclosed in the resin, short circuits of wiring can not be found afterward.
摘要翻译：目的：为了避免由导电片引起的短路现象，其中在半导体芯片放置之后，其上没有放置半导体芯片的陶瓷封装的芯片粘附表面的一部分涂覆耐热树脂。构成：将芯片2贴合到用于粘贴陶瓷封装1的芯片的表面7之后，其余表面涂覆有聚酰亚胺或耐热硅树脂8.通过这种情况，即使存在容易由于它们被封装在树脂中，所以在底面上分离，之后不能发现布线短路。

6. 发明专利

JPS5546558A METALLIC COVER PLATE FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPS5546558A
公开(公告)日：1980-04-01
申请号：JP12023778
申请日：1978-09-29
申请人： FUJITSU LTD
发明人： ENDOU TEIICHI , HASADA KAZUO
IPC分类号： H01L23/04 , H01L23/02 , H01L23/10
摘要： PURPOSE:To prevent solder material from creeping onto the upper surface of a cover plate for a semiconductor package by forming metal or alloy layer having improper wettability for the solder material onto the upper or upper and side surfaces of the metallic cover plate. CONSTITUTION:A layer 11 of nickel or the like having proper wettability for solder material is formed on one side of a stainless steel plate 13 having improper wettability for solder material. When a ceramic package is sealed with solder using this cover plate, solder material 7 does not creep onto the upper and side surfaces 15 and 16 of the cover plate 14.

7. 发明专利

JPS51147176A METHOD OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPS51147176A
公开(公告)日：1976-12-17
申请号：JP7059475
申请日：1975-06-11
申请人： FUJITSU LTD
发明人： SUGAWARA TAKEHISA , ENDOU TEIICHI , HAYASHI KUNIHIKO
IPC分类号： H01L23/02
摘要： PURPOSE:To be able to maintain a good condition of air tight sealing between the base and the cap during a long period of time even in a case using a solder with lead as a main component.

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