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1. 发明专利

JP2005085967A Composite magnetic particle and composite magnetic material 审中-公开
标题翻译：复合磁性颗粒和复合磁性材料
公开(公告)号：JP2005085967A
公开(公告)日：2005-03-31
申请号：JP2003316082
申请日：2003-09-08
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： EDO MASAHARU , OKUDA SANEHIRO , UCHIDA SHINJI , OKAMOTO KENJI
IPC分类号： H01F1/33
摘要： PROBLEM TO BE SOLVED: To provide a composite magnetic material capable of establishing the compatibility between a high permeability and a high resistivity in a high-frequency region.
SOLUTION: A metallic material coating film 32 is coated on the surface of metallic magnetic particles 31, and further the surface is coated by a ferrite coating film 33 being an oxide magnetic coating film. By providing the metallic material coating film 32 between the ferrite coating film 33 and the metallic magnetic particles 31 can suppress the diffusion of oxygen from the ferrite coating film 33 to the metallic magnetic particles 31 at sintering of the composite magnetic particles, thereby avoiding reduction in the resistivity of the ferrite coating film 33 due to oxygen deficiency of the ferrite coating film 33, having conventionally been caused at sintering at a high temperature of 400°C or over, and reduction in the insulation performance among the compound magnetic particles. Moreover, since the composite magnetic particles, after the sintering, are bonded via a ferrite bond region 35 with a wide contact area, a high permeability can be maintained.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够在高频区域中建立高磁导率和高电阻率之间的相容性的复合磁性材料。解决方案：在金属磁性颗粒31的表面上涂覆金属材料涂膜32，并且还用氧化物磁性涂膜的铁氧体涂层33涂覆表面。通过在铁氧体涂覆膜33和金属磁性颗粒31之间设置金属材料涂膜32，可以抑制在复合磁性颗粒烧结时氧从铁素体涂层膜33向金属磁性颗粒31的扩散，从而避免了由铁氧体涂膜33的缺氧导致的铁氧体涂膜33的电阻率，通常是在400℃以上的高温烧结时引起的，并且复合磁性粒子之间的绝缘性能降低。此外，由于复合磁性颗粒在烧结之后通过具有宽接触面积的铁氧体结合区域35结合，所以可以保持高磁导率。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2008300530A Switching module 审中-公开
标题翻译：切换模块
公开(公告)号：JP2008300530A
公开(公告)日：2008-12-11
申请号：JP2007143554
申请日：2007-05-30
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： TAMATE MICHIO , SASAKI TAMIKO , TAKUBO HIROSHI , FERNANDO PASAN , OKAMOTO KENJI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a switching module which can increase a breakdown voltage while suppressing deterioration of a heat radiation efficiency even when either one of upper and lower surfaces of a semiconductor chip having a switching element formed therein is used as a mounting surface. SOLUTION: A breakdown voltage structure 47 is formed around an emitter electrode 46e of a semiconductor chip 46, conductive spacer 14 is disposed between the semiconductor chip 46 and a copper pattern 12, and the emitter electrode 46e of the semiconductor chip 46 is connected to the copper pattern 12 sequentially via a solder 15, the conductive spacer 14 and a solder 13. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种开关模块，其可以在抑制散热效率的劣化的同时提高击穿电压，即使将其中形成有开关元件的半导体芯片的上表面和下表面中的任何一个用作安装面。解决方案：在半导体芯片46的发射电极46e周围形成击穿电压结构47，在半导体芯片46和铜图案12之间设置导电间隔物14，半导体芯片46的发射电极46e 通过焊料15，导电间隔物14和焊料13顺序连接到铜图案12.版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008294216A Switching module 有权
标题翻译：切换模块
公开(公告)号：JP2008294216A
公开(公告)日：2008-12-04
申请号：JP2007137999
申请日：2007-05-24
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： SASAKI TAMIKO , TAMATE MICHIO , TAKUBO HIROSHI , FERNANDO PASAN , OKAMOTO KENJI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce conduction noise and radiation noise by further reducing stray capacitance leading to common mode current. SOLUTION: An insulating substrate 11 is mounted on a copper base 10 for cooling. Copper patterns 12, 13, and 18, which are separated from one another, are formed on the insulating substrate 11. A convex part 19 is formed corresponding to the arrangement position of the copper pattern 18 in the insulating substrate 11. The thickness in the insulating substrate 11 of the region, in which the copper pattern 18 is formed, is constructed so as to be thicker than the thickness in the insulating substrate 11 of the region, in which the copper patterns 12 and 13 are formed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过进一步减少杂散电容来降低传导噪声和辐射噪声，从而达到共模电流。解决方案：绝缘基板11安装在铜基座10上用于冷却。彼此分离的铜图案12,13和18形成在绝缘基板11上。对应于铜图案18在绝缘基板11中的布置位置形成凸部19。其中形成有铜图案18的区域的绝缘基板11被构造成比形成有铜图案12和13的区域的绝缘基板11的厚度厚。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2006319146A Wiring board 有权
标题翻译：接线板
公开(公告)号：JP2006319146A
公开(公告)日：2006-11-24
申请号：JP2005140498
申请日：2005-05-13
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： OKAMOTO KENJI
IPC分类号： H01L23/12 , H01L23/36 , H05K3/14 , H05K3/24
CPC分类号： H05K3/24 , H01L23/3735 , H01L2224/45124 , H01L2224/48091 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H05K1/0203 , H05K1/0263 , H05K1/0306 , H05K1/056 , H05K2203/1344 , Y10T29/4913 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a low price wiring board having excellent heat radiating property which may be manufactured with less number of processes. SOLUTION: In a wiring board, a circuit pattern 3 is formed by laminating a copper foil to an insulating layer 2. A metal material is further laminated with a cold spraying method to the upper part of such circuit pattern 3 to increase thickness in order to form an upper circuit pattern 5. Accordingly, even when a power semiconductor 6 is mounted on this thick upper circuit pattern 5, thermal resistance can be reduced because the heat generated by a loss of the same power semiconductor 6 can be diffused. Therefore, it is possible to constitute a wiring board having excellent heat radiating property and showing remarkably less amount of thermal resistance in comparison with the wiring board of the related art not including the upper circuit pattern 5. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有优异的散热性能的低价格布线板，其可以以较少的工艺制造。解决方案：在布线板中，通过将铜箔层压到绝缘层2上形成电路图案3.将金属材料进一步用冷喷涂方法层压到这种电路图案3的上部以增加厚度为了形成上部电路图案5.因此，即使将功率半导体6安装在该厚的上部电路图案5上，由于能够扩散相同的功率半导体6的损失而产生的热量，因此能够降低热阻。因此，与不包括上层电路图案5的现有技术的布线基板相比，可以构成散热性优异的布线板，并且显示出明显较少的热阻。（C）2007 ，JPO＆INPIT

5. 发明专利

JP2006165498A Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2006165498A
公开(公告)日：2006-06-22
申请号：JP2005145848
申请日：2005-05-18
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： IKEDA YOSHINARI , OKAMOTO KENJI
IPC分类号： H01L23/29 , H01L23/50
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2224/49111 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that can be applied to large electric power by forming an electrical insulation with a structure that is mechanically strong in addition to having good electrical insulation performance and thermal conduction performance, and to provide a method of manufacturing the semiconductor device achieving these functions. SOLUTION: On the backside of a circuit pattern part 14, there is formed a ceramic layer 14 that is a normal-temperature impact solidifying film formed through junction by colliding a plurality of ceramic particulates by an aerosol deposition method. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种除了具有良好的电绝缘性能和导热性能之外，通过形成具有机械强度的结构的电绝缘来提供可应用于大功率的半导体器件，并且提供制造实现这些功能的半导体器件的方法。解决方案：在电路图形部分14的背面，形成陶瓷层14，陶瓷层14是通过气溶胶沉积法碰撞多个陶瓷颗粒而形成的常温冲击凝固膜。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2004342943A Compressed powder core incorporating coils, its manufacturing method, transformer and reactor for power sources using the core, and their manufacturing method 审中-公开
公开(公告)号：JP2004342943A
公开(公告)日：2004-12-02
申请号：JP2003139599
申请日：2003-05-16
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： UCHIDA SHINJI , OKAMOTO KENJI , EDO MASAHARU , OKUDA SANEHIRO , HIRAOKA MUTSUHISA
IPC分类号： H01F41/02 , H01F27/24 , H01F27/255
摘要： PROBLEM TO BE SOLVED: To realize a transformer and a reactor for power sources which are improved in the performance of a magnetic body, exhibit excellent magnetic properties in high frequency ranges, and enables reduction of the size and thickness.
SOLUTION: The transformer and the reactor for power sources each comprise a compressed powder core (10) incorporating coils, obtained by embedding coils, each consisting of conductors (12, 13) coated with an oxide insulating material (14), in a magnetic powder (11) consisting of metallic particles coated with ferrite for insulation, and thereafter compression molding. The compression molding may preferably be heated compression molding. A heat treatment may be given after compression molding. It is also preferable that the surface of the magnetic core is coated with a insulating coating material. The magnetic powder (11) may be replaced by an assembly of an upper magnetic plate and a lower magnetic plate which have been obtained by effecting compression molding to a magnetic powder material.
COPYRIGHT: (C)2005,JPO&NCIPI

7. 发明专利

JP2011114010A Semiconductor module and method of manufacturing the same, and electric apparatus 有权
标题翻译：半导体模块及其制造方法和电气设备
公开(公告)号：JP2011114010A
公开(公告)日：2011-06-09
申请号：JP2009266264
申请日：2009-11-24
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： OKAMOTO KENJI
IPC分类号： H01L23/12 , C23C4/10 , C23C4/18 , H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/45124 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To achieve, at low cost, a package of a semiconductor module enhanced in insulation properties and heat dissipation properties. SOLUTION: An insulating layer 7 is formed on a first surface 1A of a metal base material 1 by thermal-spraying powder of aluminum oxide. The insulating layer 7 is enhanced in thermal conductivity through a heat treatment, or has a hexagonal system crystal structure. On a second surface 1B of the metal base material, a semiconductor circuit element 2 is mounted so as to be contacted directly or indirectly. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了以低成本实现提高绝缘性能和散热性能的半导体模块的封装。解决方案：通过热喷涂氧化铝粉末，在金属基材1的第一表面1A上形成绝缘层7。通过热处理，绝缘层7的导热性提高，或具有六方晶系晶体结构。在金属基材的第二表面1B上，半导体电路元件2安装成直接或间接接触。版权所有（C）2011，JPO＆INPIT

8. 发明专利

JP2005142514A Magnetic member and method for manufacturing same 审中-公开
标题翻译：磁性构件及其制造方法
公开(公告)号：JP2005142514A
公开(公告)日：2005-06-02
申请号：JP2003380458
申请日：2003-11-10
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： UCHIDA SHINJI , OKAMOTO KENJI , EDO MASAHARU , OKUDA SANEHIRO
IPC分类号： B22F1/02 , B22F3/00 , H01F1/33 , H01F41/02
摘要： PROBLEM TO BE SOLVED: To provide a low-loss magnetic member which has superior magnetic permeability and saturated magnetism strength even in a high frequency band, and to provide its manufacturing method.
SOLUTION: An NiZn ferrite coating of 0.5 μm in mean thickness is formed on the surface of a spherical permalloy particle of 20 μm in diameter by an ultrasonic excitation ferrite plating method and powder of compound magnetic particles is pressed into a core. This core is dipped in a reaction solution prepared by mixing a mixed solution of FeCl
2 , NiCl
2 , and ZnCl
2 , an oxidizer NaNO
2 , and a pH control agent NH
4 OH (for 30 minutes at a reaction solution temperature of 60°C) to replate the core 37. The core 37 which is thus obtained has metal magnetic particles 11 bonded together across bonding parts 14 of the ferrite coating without coming into direct contact with each other, so the degree of bonding between magnetic particles 11 can be made small while magnetic bonding between ferrite coating metal magnetic particles is maintained.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使在高频带中也提供具有优异的磁导率和饱和磁强度的低损耗磁性部件，并提供其制造方法。解决方案：通过超声波激发铁素体电镀法在直径为20μm的球形坡莫合金颗粒的表面上形成平均厚度为0.5μm的NiZn铁氧体涂层，并将复合磁性颗粒的粉末压制成芯。将该芯浸渍在通过混合FeCl 2 SBI，NiCl SB 2和SBCl 2 SB SB的混合溶液和ZnCl 2 SB SBB 2混合溶液制备的反应溶液中， SB> 2 和pH调节剂NH 4 S（反应溶液温度为60℃30分钟），从而重新制备核心37.由此得到的核心37 具有将金属磁性粒子11粘合在铁素体涂层的接合部14上而不直接接触的状态，因此可以使磁性粒子11之间的接合程度小，同时保持铁氧体涂覆金属磁性粒子之间的磁性接合。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004228403A Semiconductor module, its manufacturing method and switching power supply device 有权
公开(公告)号：JP2004228403A
公开(公告)日：2004-08-12
申请号：JP2003015899
申请日：2003-01-24
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： UCHIDA SHINJI , OKAMOTO KENJI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To evade the influence of a noise generated by the switching of a switching element on a control IC and to reduce the size and thickness of a switching power supply device. SOLUTION: In a semiconductor module, a rear electrode of a power semiconductor element 5 is connected and fixed to a conductor pattern 3 of an insulating substrate 4, and a wiring pattern 17 formed on a surface of a wiring board 8 opposite to the insulating substrate 4 is connected to an upper electrode of the power semiconductor element 5 through a conductive post 20. Consequently, the switching power supply device can be formed in a thin package. By providing an external lead-out terminal on the exposed surface of the printed board, the switching power supply device can be packaged on the surface of a substrate of electronic apparatus as a package size device and the size and thickness of a notebook type personal computer and a portable device or the like can be reduced. COPYRIGHT: (C)2004,JPO&NCIPI

10. 发明专利

JP2006179856A Insulating substrate and semiconductor device 审中-公开
标题翻译：绝缘基板和半导体器件
公开(公告)号：JP2006179856A
公开(公告)日：2006-07-06
申请号：JP2005226990
申请日：2005-08-04
申请人： Fuji Electric Holdings Co Ltd , 富士電機ホールディングス株式会社
发明人： OKAMOTO KENJI
IPC分类号： H01L23/14
CPC分类号： H05K1/053 , C23C4/02 , C23C24/04 , C23C28/321 , C23C28/322 , C23C28/34 , C23C28/345 , H01L21/4867 , H01L23/142 , H01L23/3735 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L25/072 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H05K2201/0179 , H05K2203/1344 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an insulating substrate which is cheap by lessening a manday and is excellent in a heat dissipation nature and an insulation performance, and to provide a semiconductor device using such an insulating substrate. SOLUTION: An insulating substrate 1 comprises a metal base 2 used as a base substrate, an insulating layer 3 which is an ordinary temperature shock solidification film formed on this metal base 2 by an aerosol deposition method, and a circuit pattern portion 4 which is a sprayed coating formed on this insulating layer 3 by a cold spray method. Moreover, the semiconductor device loads this insulating substrate 1 and raises a heat dissipation characteristic. COPYRIGHT: (C)2006,JPO&NCIPI

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