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1. 发明专利

JP2013143519A Connector and resin sealed type semiconductor device 审中-公开
标题翻译：连接器和树脂密封型半导体器件
公开(公告)号：JP2013143519A
公开(公告)日：2013-07-22
申请号：JP2012003843
申请日：2012-01-12
申请人： Fuji Electric Co Ltd , 富士電機株式会社
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L23/495 , H01L21/02 , H01L23/3107 , H01L23/49524 , H01L23/49562 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/97 , H01L2224/3701 , H01L2224/37012 , H01L2224/40095 , H01L2224/40247 , H01L2224/40249 , H01L2224/40257 , H01L2224/4103 , H01L2224/41109 , H01L2224/45124 , H01L2224/84801 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , Y10T83/0207 , H01L2924/00 , H01L2924/00015 , H01L2224/48 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a connector capable of certainly forming a connection surface shape corresponding to a narrow electrode area.SOLUTION: A semiconductor element 11 is mounted on a chip mount portion 12 of a lead frame. Leads 12a and 12c configuring one chip electrode of the semiconductor element 11 and an external lead-out terminal are electrically connected by a connector 13. The connector 13 is formed with a stepped portion 13a with generally half thickness of the board thickness by half blanking processing, at a platy coupling portion connecting a joint surface of one chip electrode of the semiconductor element 11 and a joint surface on the leads 12a and 12c side. A connector 14 connects the other chip electrode of the semiconductor element 11 and a chip mount portion which is a base end portion of the lead 12b, and is formed with three stepped portions 14a-14c with generally half thickness of the board thickness by the half blanking processing.
摘要翻译：要解决的问题：提供能够确定形成对应于窄电极面积的连接表面形状的连接器。解决方案：半导体元件11安装在引线框架的芯片安装部分12上。构成半导体元件11的一个芯片电极的引线12a和12c和外部引出端子通过连接器13电连接。连接器13形成有台阶部分13a，其厚度通常为板的厚度的一半半冲切加工在将半导体元件11的一个芯片电极的接合面与引线12a，12c侧的接合面连接的板状连结部上。连接器14连接半导体元件11的另一个芯片电极和作为引线12b的基端部的芯片安装部分，并且形成有三个台阶部分14a-14c，其厚度通常为板的厚度的一半消隐处理。

2. 发明专利

GB2263815A A SEMICONDUCTOR DEVICE ASSEMBLY LEAD FRAME 未知
公开(公告)号：GB2263815A
公开(公告)日：1993-08-04
申请号：GB9226347
申请日：1992-12-17
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/50 , H01L23/495 , H01L25/07 , H01L25/18
摘要： To provide highly flexible assembly lead frames that can be used for semiconductor devices of diverse applications, with the objective of creating resin-sealed semiconductor devices assembled with various IC chips in one package, the lead frame (6) is structured with various chip mounts (1) laid in a line along the pattern periphery, various common leads (2) laid parallel to each other on the inner side of the chip mount arrangement, external leads (3) centrally arranged along the pattern periphery opposite to the chip mounts, aligned with each of said chip mounts and common leads, a connecting strip (4) surrounding the outer circumference of said pattern, and tie bars (5) linking the connecting strip to each chip mount and across the external leads.

3. 发明专利

GB2263815B A semiconductor device and the assembly lead frame thereof 未知
公开(公告)号：GB2263815B
公开(公告)日：1995-11-01
申请号：GB9226347
申请日：1992-12-17
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/50 , H01L23/495 , H01L25/07 , H01L25/18
摘要： A lead frame for facilitating assembly and interconnection of a plurality of integrated circuit chips comprises a pattern of planar conductors including a surrounding outer connecting strip to which other conductors are temporarily joined, said outer connecting strip having an open end and a closed end. The other conductors comprise a plurality of chip mount conductive areas, each for mounting one of a plurality of chips, disposed in a fan-like arrangement adjacent to the closed end of said outer connecting strip and each connected to said outer connecting strip by a respective tie bar. The other conductors further comprise a plurality of common leads disposed in a semicircular pattern within the fan-like arrangement of the conductive areas, each adapted for connection to selected electrodes of said plurality of chips and a first plurality of parallel external leads drawn out from said common leads arranged in a row, all of said external leads being temporarily connected together and to said outer connecting strip by a common tie bar extending across the open end of said outer connecting strip.

4. 发明专利

JPH05304248A 失效
公开(公告)号：JPH05304248A
公开(公告)日：1993-11-16
申请号：JP32487491
申请日：1991-12-10
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/12 , H01L25/07 , H01L25/18
摘要： PURPOSE:To provide a power semiconductor device, e.g. a power transistor module, in which overall downsizing is realized by reducing the required area of metallic insulating board while ensuring high heat dissipation properties and noise resistance. CONSTITUTION:A metallic insulating board 1, a semiconductor chip (power transistor) 2 mounted on the metallic insulating board 1, control circuit components 3, and external lead out terminals 4 are built in a resin case 5. An intermediate partition wall 5a covering the top surface area of the metallic insulating board 1 other than the mounting area of the semiconductor chip 2 is provided at an intermediate stage in the case 5. The external lead out terminals 4, control circuit components 3, and wiring conductors therefor are arranged on the top surface side of the intermediate partition wall 5a while being isolated from the semiconductor chip 2, which is mounted through a heat plate 6 onto the metallic insulating board 1 on the side where a metallic foil 1c is not patterned.

5. 发明专利

JPH05206365A SEMICONDUCTOR DEVICE AND ITS LEAD FRAME FOR ASSEMBLING 失效
公开(公告)号：JPH05206365A
公开(公告)日：1993-08-13
申请号：JP1438292
申请日：1992-01-30
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/50 , H01L23/495 , H01L25/07 , H01L25/18
摘要： PURPOSE:To provide a lead frame for assembling with high generalutility capable of coping with a semiconductor device used for multikind deverse purposes as well, on a resin-sealed semiconductor device resin wherein a plurality of IC chips are incorporated in the same package. CONSTITUTION:A lead frame 6 is constituted of the basic patterns of a plurality of chip mounts 1, which stand in a line along the peripheral area of the basic patterns, plural strips of common leads 2, which stand in a line in parallel inside the disposition of the chip mounts 1, outer leads 3, which are arranged concentrically in the pattern area on the opposite side from the chip mount part 1, ranging from each chip mount part 1 and common lead 2, a coupling band 4, which surrounds the patterns, and tie bars 5, which connects the coupling band 4 with each chip mount part 1 and outer lead 3.

6. 发明专利

JPH08340068A LEAD FRAME FOR SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH08340068A
公开(公告)日：1996-12-24
申请号：JP14300495
申请日：1995-06-09
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/48
摘要： PURPOSE: To provide a lead frame for semiconductor device having such easiness in assembling that, when a semiconductor device is mounted on a printed board by inserting pins into the printed board, the outer leads of the device can be smoothly inserted into the part holes of the board only if the outer leads are machined secondarily. CONSTITUTION: In a lead frame 1 for semiconductor device formed by patterning metallic ribbons into die pads 1a, outer leads 1b, and dam bars 1c, the leads 1b are formed narrower as going to their front ends. In the case of mounting a semiconductor device on a printed board inserting pins into the board, the device is mounted on the board by inserting the cut front ends of the leads 1b into parts holes 5a of the board after the leads 1b are cut in linear cut ends at desired lengths.

7. 发明专利

JPH04165653A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04165653A
公开(公告)日：1992-06-11
申请号：JP29311890
申请日：1990-10-30
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/04
摘要： PURPOSE:To secure a sufficiently high dielectric strength between a metallic insulating substrate and a leading-out terminal by covering the side edge of the metallic insulating substrate facing the conductor of the leading-out terminal with an insulating cover. CONSTITUTION:An insulating cover 7 forming a cleat frame is integrally form- molded with an envelope 3 on the opened end side of the envelope 3 front which a leading-out terminal 4 is drawn out. The cover 7 has an L-shaped cross section and covers the upper edge corner section of a metallic insulating substrate 1 along the side of the substrate 1 facing the conductor of the terminal 4 when the envelope 3 is fitted to the substrate 1. When such constitution is used, a creeping discharge hardly occurs from the part where electric fields tend to concentrate when a voltage is applied, since the part is covered with the cover 7, and a substantially high dielectric strength can be secured, since the creeping distance to the terminal 4 can be increased by the detouring amount when the cover 7 is made to detour. Therefore, not only the package of this semiconductor device can be reduced in thickness, but also the dielectric strength can be stabilized.

8. 发明专利

JPH0325962A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0325962A
公开(公告)日：1991-02-04
申请号：JP16134289
申请日：1989-06-23
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/40
摘要： PURPOSE:To enable the maintenance of good heat-dissipation characteristics by blazing a cooling member to the container of a semiconductor device. CONSTITUTION:A power transistor module container 1 containing plural power transistor elements is composed of an insulating substrate of a container bottom plate 11, a container side wall 12 fixed on the circumference of said substrate, and an upper lid 13 covering the upper part of side wall. As the insulating substrate of the container bottom plate 11, a copper-coating ceramic substrate, the so-called DBC(Direct Bonding Copper) substrate is used and that copper- coating surface is made the outside of container. The container side wall 12 and the upper lid 13 are formed of fat molded bodies. The outer surface of container bottom plate 11 is made of an aluminum material, to which a cooling fin 4 whose surface is nickel-plated is blazed by a solder 5.

9. 发明专利

JPH02126661A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02126661A
公开(公告)日：1990-05-15
申请号：JP28075588
申请日：1988-11-07
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L23/14 , H01L23/50
摘要： PURPOSE:To prevent a bonded part from being destroyed and to enhance a positional accuracy of an external extraction terminal by a method wherein a metal sheet and an insulating sheet are fixed and bonded, exclusing a part under a bonded part of the external extraction terminal, by using a bonding material existing between both. CONSTITUTION:A semiconductor chip 8 and an external extraction terminal 5 are brazed to a substrate for semiconductor-element mounting use by using a brazing material 6. Since a difference in a coefficient of thermal expansion between a semiconductor material and a ceramic is small, a bonded part of a Cu sheet 1 and of a ceramic sheet 2 under the semiconductor chip is not destroyed even by a heat cycle. Since the Cu sheet 1 and the ceramic sheet 2 are not bonded under the terminal whose coefficient of thermal expansion is larger than that of the semiconductor material, the bonded part is not destroyed. A deformation of the Cu sheet 1 during a brazing operation of the external extraction terminal 5 to the Cu sheet 1 by using the brazing material 6 is slight; its influence on a positional accuracy of the terminal 5 and an irregularity in a thickness of the brazing material are hardly caused. An upper-part electrode of the semiconductor chip 8 is connected to the external extraction terminal bonded to the Cu sheet 1 via an insulating sheet by a bonding operation of a conductor.

10. 发明专利

JPH0233942A FORMING METHOD FOR CUPLIKE RESIN MOLDING CASE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0233942A
公开(公告)日：1990-02-05
申请号：JP18413088
申请日：1988-07-23
申请人： FUJI ELECTRIC CO LTD
发明人： MARUYAMA ATSUSHI
IPC分类号： H01L21/56
摘要： PURPOSE:To prevent a case from cracking by resin-molding by a metal mold in which a gate for pouring melted resin in a cavity is opened at a position corresponding to the center of the bottom of the case. CONSTITUTION:Melted resin is poured from a gate 12 formed at the position of a cavity corresponding to the center of the bottom of a case 11 to mold the case 11. Since the poured resin radially uniformly flows toward the peripheral edge of the upper opening of the case 11 as designated by an arrow A in the cavity, the case 11 of the resin molding having no welded part is molded. Thus, the case 11 is not cracked.

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