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    • 4. 发明授权
    • Fabrication of printed wiring boards by projection imaging
    • 通过投影成像制作印刷线路板
    • US5138368A
    • 1992-08-11
    • US318522
    • 1989-03-01
    • Frederic J. KahnNeil G. BergstromDavid E. Stepner
    • Frederic J. KahnNeil G. BergstromDavid E. Stepner
    • G03F7/20
    • G03F7/2057
    • A hard copy such as a printed wiring board is fabricated by exposing to radiation a liquid crystal cell in which a desired pattern is written and directing the pattern-carrying radiation projected from the cell by transmission or reflection to a substrate which is coated with a material sensitive to the radiation and disposed alignedly at an exposure position by optical registration. The duration of the exposure is controlled for a given light intensity and for the type of the coating material. A pattern may be written in one cell substantially simultaneously as another cell is used for the projection imaging. After a produced pattern is compared with a reference pattern, corrections may be effected through a processor which controls the writing of a pattern in a cell.
    • 诸如印刷电路板的硬拷贝通过将辐射所需图案写入的液晶单元暴露于辐射来制造,并将通过透射或反射从电池突出的图案携带辐射引导到涂覆有材料的基板 对辐射敏感,并通过光学配准对准地设置在曝光位置。 对于给定的光强度和涂层材料的类型来控制曝光的持续时间。 当另一个单元用于投影成像时,图案可以基本上同时写入一个单元中。 在将生成的图案与参考图案进行比较之后,可以通过控制单元格中的图案的写入的处理器来进行校正。