会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • AI EPOXY ADJUSTMENT
    • AI环氧调节
    • US20120040477A1
    • 2012-02-16
    • US12856180
    • 2010-08-13
    • Frank YuEric HsiehAres TwuW. L. Hsu
    • Frank YuEric HsiehAres TwuW. L. Hsu
    • H01L21/66B05C5/00
    • H01L22/20H01L22/12H01L24/743H01L2224/83192
    • A method and apparatus for dispensing a volume of die attach adhesive onto a surface can include an optical system which images the dispensed volume of die attach adhesive. A two-dimensional area covered by the die attach adhesive and a die attach dispense pressure can be used as a comparison with a reference value to determine whether the volume of die attach adhesive dispensed is sufficient. The reference value can take into account viscosity changes of the die attach adhesive, so that the volume of die attach adhesive dispensed during production can be determined. The volume dispensed can be automatically adjusted in situ during production using a computer system.
    • 用于将体积的管芯附着粘合剂分配到表面上的方法和设备可以包括对分配的管芯附着粘合剂体积进行成像的光学系统。 可以使用由芯片附着粘合剂覆盖的二维区域和管芯附着分配压力作为与参考值的比较,以确定分配的管芯附着粘合剂的体积是否足够。 参考值可以考虑管芯附着粘合剂的粘度变化,从而可以确定在生产期间分配的管芯附着粘合剂的体积。 在使用计算机系统的生产期间,分配的体积可以在现场自动调整。